• Clean Technology
• /
• v.13 no.4
• /
• pp.274-280
• /
• 2007

A liquid-liquid solvent extraction process was developed in this study to recover Fe and Ni from heavily concentrated aqueous ferric chloride solution, in an effort to substitute the conventional iron reduction method. Solvent composition and extraction conditions were first developed from the laboratory experiments, and the pilot system was designed and built for commercialization. Stage numbers for extraction and stripping were determined from pilot plant runs, and other operation data were obtained for mass production.

• Korean Chemical Engineering Research
• /
• v.48 no.2
• /
• pp.157-163
• /
• 2010

A new etchant formulation was developed in this study to increase the shadow mask production rate, utilizing the $Fe(ClO_4)_3$ as an additive in the aqueous $FeCl_3$ solution. The shadow mask etch rate increased substantially with the increase of $Fe(ClO_4)_3$ concentration in the etchant. The etch rate difference between Ni and Invar steel was also reduced with the addition of $Fe{(ClO_4)_3}$ for most of the operating conditions, which was caused by the enhanced etch rate of both Ni and Fe by the new etchant. The increase in etch rate with the addition of $Fe(ClO_4)_3$ to aqueous ferric chloride solution was attributed to the superior electron transfer capability of $ClO^{4-}$ ion to that of $Cl^-$ ion.

• Korean Chemical Engineering Research
• /
• v.50 no.2
• /
• pp.211-216
• /
• 2012

Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, $Fe^{3+}$ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum-killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.