• Corrosion Science and Technology
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• v.15 no.4
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• pp.166-170
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• 2016

The combined process of porous type anodizing and desiccation treatment was applied to improve wettability of A1050 aluminum alloy. The water contact angles of anodized samples were increaseds considerably with desiccation treatment. However, there was no considerable effect of polishing and anodizing time on water contact angle. The corrosion behavior with the treatments was investigated electrochemically. The corrosion resistance of the samples in 3.5 mass% NaCl solutions increased with higher contact angle. Anodized and desiccated samples showed better corrosion resistance than un-desiccated samples around rest potential region.

• Corrosion Science and Technology
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• v.15 no.3
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• pp.120-124
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• 2016

The effect of alloying element Ca (0, 1, and 2 wt%) on corrosion resistance and bioactivity of the as-received and anodized surface of rolled plate AM60 alloys was investigated. A plasma electrolytic oxidation (PEO) was carried out to form anodic oxide film in $0.5mol\;dm^{-3}\;Na_3PO_4$ solution. The corrosion behavior was studied by polarization measurements while the in vitro bioactivity was tested by soaking the specimens in Simulated Body Fluid (1.5xSBF). Optical micrograph and elemental analysis of the substrate surfaces indicated that the number of intermetallic particles increased with Ca content in the alloys owing to the formation of a new phase $Al_2Ca$. The corrosion resistance of AM60 specimens improved only slightly by alloying with 2 wt% Ca which was attributed to the reticular distribution of $Al_2Ca$ phase existed in the alloy that might became barrier for corrosion propagation across grain boundaries. Corrosion resistance of the three alloys was significantly improved by coating the substrates with anodic oxide film formed by PEO. The film mainly composed of magnesium phosphate with thickness in the range $30-40{\mu}m$. The heat resistant phase of $Al_2Ca$ was believed to retard the plasma discharge during anodization and, hence, decreased the film thickness of Ca-containing alloys. The highest apatite forming ability in 1.5xSBF was observed for AM60-1Ca specimens (both substrate and anodized) that exhibited more degradation than the other two alloys as indicated by surface observation. The increase of surface roughness and the degree of supersaturation of 1.5xSBF due to dissolution of Mg ions from the substrate surface or the release of film compounds from the anodized surface are important factors to enhance deposition of Ca-P compound on the specimen surfaces.

• Journal of Korean Dental Science
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• v.1 no.1
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• pp.4-9
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• 2008

Purpose : This study sought to examine the aspects of crestal bone resorption and to evaluate the clinical outcomes of the TiUnite$^{(R)}$ (Nobel Biocare, Sweden) anodized implant system. Materials and Methods : Among the 67 patients (211 fixtures) who were treated using TiUnite(r) implants at Seoul National University Bundang Hospital between March 2004 and January 2007, 26 (91 fixtures) were considered in this study. Initial and secondary stabilities were measured using Periotest$^{(R)}$ and Ostell(tm) Mentor. The radiographic evaluation of crestal bone resorption was carried out by measuring the change in crestal bone level at the time of surgery compared to that 1 year after loading. Panoramic radiograph and periapical radiograph were used. Based on the radiographic findings, the shapes of crestal bone resorption were classified. Results : The average amount of crestal bone resorption after 1 year of functional implant loading was 0.30 mm. There was no saucerization in 40 implant fixtures (43.9%), although more than 1 thread were exposed in 51 implant fixtures (56.6%). The success rate of the implants was 94.5%, and the survival rate was 100%. Conclusions : Good clinical outcomes and minor crestal bone resorption were noted in this study. Saucerization for the establishment of biological width was not a general finding in the TiUnite$^{(R)}$ anodized implant system.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Corrosion Science and Technology
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• v.4 no.6
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• pp.217-221
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• 2005

In the present investigation, holographic interferometry was utilized for the first time to monitor in situ the thickness of the oxide film of aluminium samples during anodization processes in boric acid solutions. The anodization process (oxidation) of the aluminium samples was carried out by the technique of the electrochemical impedance spectroscopy(EIS), in different concentrations of boric acid (0.5-5.0% $H_3BO_3$) at room temperature. In the mean time, the real-time holographic interferometry was used to measure the thickness of anodized (oxide) film of the aluminium samples in solutions. Consequently, holographic interferometry is found very useful for surface finish industries especially for monitoring the early stage of anodization processes of metals, in which the thickness of the anodized film of the aluminium samples can be determined without any physical contact. In addition, measurements of electrochemical values such as the alternating current (A.C) impedance(Z), the double layer capacitance($C_{dl}$), and the polarization resistance(Rp) of anodized films of aluminium samples in boric acid solutions were made by the electrochemical impedance spectroscopy(EIS). Attempts to measure electrochemical values of Z, Cdl, and Rp were not possible by holographic interferometry in boric acid especially in low concentrations of the acid. This is because of the high rate of evolutions of interferometric fringes during the anodization process of the aluminium samples in boric acid, which made measurements of Z, Cdl, and Rp are difficult.

• Journal of the Korean Solar Energy Society
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• v.27 no.3
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• pp.175-179
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• 2007

This experimental demonstration has successfully shown that it is possible to use direct sunlight for the illumination of deeper building zones using the material for light path system(light duct). Three kinds of reflectors which were 95% Silver vaporizing fixed, 85% Anodized and 85% Hot melted applied to evaluate and compare their performances each others. Also, these three kind of reflectors were compared in view point of economics. The most high performance was obtained in 95% Silver vaporizing fixed reflector hater than another reflectors of 85% Anodized reflector and 85% Hot melted reflector even though more high production cost in 95% Silver vaporizing fixed reflector. The rest two reflectors of 85% Anodized and 85% Hot melted $10{sim}15%$ less performance than 95% Silver vaporizing fixed reflector but their production cost were low than the production cost of 95% Silver vaporizing fixed reflector which identified very weak and light yellow color in the light.

• Journal of the Korean institute of surface engineering
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• v.42 no.6
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• pp.260-266
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• 2009

The anodic oxidation behaviour of a cast component of AC2A Al alloy with machined surface and ascast surface was investigated in sulfuric acid solution. The anodized specimen showed relatively uniform and thick anodic oxide films on the as-cast surface, while non-uniform and very thin oxide films were formed on the machined surface. Non-anodized as-cast surface was observed to be covered with thick oxide scales and showed a number of second-phase particles containing Si, while non-anodized machined surface showed no oxide scales and relatively very small number of Si particles. Thus, the very limited growth of anodic oxide films on the as-cast surface was attributed to the presence of thick oxide scales and Si-containing second-phase particles on its surface.

• Corrosion Science and Technology
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• v.19 no.5
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• pp.259-264
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• 2020

Many studies have been conducted to improve the corrosion resistance and durability of various aluminum alloys through the anodizing technique. It is already used as a unique technique for enhancing the properties of aluminum alloys in various industries. This paper investigated the electrochemical corrosion and stress corrosion cracking characteristics of anodized aluminum 5083-H321 alloy in natural seawater. The corrosion characteristics were assessed by the electrochemical technique and potentiodynamic polarization test. The stress corrosion cracking characteristic was evaluated with a slow strain rate tensile test under 0.005 mm/min rate, which showed that the hard anodizing film had a thickness of about 16.8 ㎛. Although no significant characteristics of stress corrosion cracking were observed in the slow strain rate test, the anodized specimen presented excellent corrosion resistance. The corrosion current density was measured to be approximately 4.2 times lower than that of the base material, and no surface damage was observed in the anodic polarization test.

• Laser Solutions
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• v.17 no.2
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• pp.5-10
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• 2014

Aluminum has been widely used in the electric applications because of light metals. When mechanical element is periodically moving with contacting other surfaces, the anodizing process for aluminum is useful for avoiding the abrasive damage. The anodized element has quietly different characteristics with respect to the distribution of hardness and crystal structure. In this work, the laser drilling of anodized surface is studied experimentally. Fusion drilling method - laser drilling with inert gas blowing - is used. The effect of various process parameters (gas pressure, laser power, focus position) is investigated with respect to the hole size and circularity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1139-1143
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• 2007

A simple method for the fabrication of 3D micro-nano hybrid patterns was presented. In conventional fabrication methods of the micro-nano hybrid patterns, micro-patterns were firstly fabricated and then nano-patterns were formatted on the micro-patterns. Moreover, these micro-nano hybrid patterns could be fabricated on the flat substrate. In this paper, we suggested the fabrication method of 3D micro-nano hybrid patterns using micro-indentation on the anodized aluminum substrate. Since diameter of the hemispherical nano-pattern can be controlled by electrolyte and applied voltage in the anodizing process, we can easily fabricated nano-patterns of diameter of loom to 300nm. Nano-patterns were firstly formatted on the aluminum substrate, and then micro-patterns were fabricated by deforming the nano-patterned aluminum substrate. Hemispherical nano-patterns of diameter of 150nm were fabricated by anodizing process, and then micro-pyramid patterns of the side-length of $50{\mu}m$ were formatted on the nano-patterns using micro-indentation. Finally we successfully replicated 3D micro-nano hybrid patterns by hot-embossing process. 3D micro-nano hybrid patterns can be applied to nano-photonic device and nano-biochip application.