• Transactions on Electrical and Electronic Materials
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• 제2권2호
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• pp.16-20
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• 2001

Optoelectronic characteristics of the superlattice diode as a function of deposition temperature and annealing conditions have been studied. The multilayer nanocrystalline silicon/adsorbed oxygen (nc/Si/O) superlattice formed by molecular beam epitaxy (MBE) system. Experimental results showed that deposition temperature of 550$^{\circ}C$, followed by hydrogen annealing leads to best results, in terms of optical photoluminescence (PL) and electrical current-voltage (I-V) characteristics. Consequently, the experimental results of multilayer Si/O superlattic device showed the stable photoluminescence and good insulating behavior with high breakdown voltage. This is very useful promise for Si-based optoelectronic devices, and can be readily integrated with conventional silicon ULSI processing.

• 한국재료학회지
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• 제11권3호
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• pp.159-163
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• 2001

실리콘 웨이퍼 직접 접합을 성공하기 위해서는 양호한 접합면을 구성하여야 하며, 이를 위해 접합면에서 발생하는 주요 결함 중 하나인 기포형 접합 결함을 억제하여야 한다. 본 연구에서는 접합면에서 발생하는 기포형 결함의 상온 접합 및 열처리 과정에서의 거동을 관찰하여 내부의 압력이 증가함을 직접 관찰할 수 있었다. 또한, 대기압 하의 열처리에서 결함이 발생하지 않는 $SiO_2$-$SiO_2$ 접합 웨이퍼가 진공에서의 열처리에서 결함이 발생하는 현상을 통해 기포형 결함의 내부 압력과 성장과의 관계를 실험을 통하여 증명할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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• pp.367-369
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• 1988

We suggest a new annealing method for stabilization of $Si-SiO_2$ interface state in MOS device using $NH_3$(10%) + $N_2$(90%) ambient gases. The annealing effect was examined through C-V characteristics, threshold voltage, effective mobility on channel, respectively. The experimental result show that the new method is available to improvement of MOS device characteristics.

• 반도체디스플레이기술학회지
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• 제6권3호
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• pp.41-45
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• 2007

The (SrCa)$TiO_3$(SCT) thin films were deposited on Pt-coated electrode(Pt/TiN/$SiO_2$/Si) using RF sputtering method according to the deposition condition. The crystallinity of SCT thin films were increased with increase of deposition temperature in the temperature range of $100{\sim}500[^{\circ}C]$. The optimum conditions of RF power and Ar/$O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about $18.75[{\AA}/min]$ at the optimum condition. The composition of SCT thin films deposited on Si substrate is close to stoichiometry (1.081 in A/B ratio). The maximum dielectric constant of SCT thin film was obtained by annealing at $600[^{\circ}C]$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권6호
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• pp.263-270
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• 2001

The mechanical and electrical properties of the hot-pressed and annealed ${\beta}-SiC-TiB_2$,/TEX> electroconductive ceramic composites were investigated as function as functions of the liquid forming additives of $Al_2O_3+Y_2O_3$. The result of phase analysis of composites by XRD revealed ${\alpha}$-SiC(6H), $TiB_2$,/TEX>, and YAG($Al_5Y_3O_{12}$) crystal phase. The relative density and the mechanical properties of composites were increased with increasing $Al_2O_3+Y_2O_3$ contents in pressureless annealing method because YAG of reaction between $Al_2O_3$ was increased. The flexural strength showed the highest value of 458.9 MPa for composites added with 4 wt% $Al_2O_3+Y_2O_3$ additives in pressed annealing method at room temperature. Owing to crack deflection, crack bridging, phase transition and YAG of fracture toughness mechanism, the fracture toughness showed 7.1 MPa ${\cdot}\;m^{1/2}$ for composites added with 12 wt% $Al_2O_3+Y_2O_3$ additives in pressureless annealing method at room temperature. The electrical resistivity and the resistance temperature coefficient showed the lowest value of $6.0{\times}10^{-4}\;{\Omega}\;{\cdot}\;cm(25\'^{\circ}C}$ and $3.0{\times}10^{-3}/^{\circ}C$ for composite added with 12 wt% $Al_2O_3+Y_2O_3$ additives in pressureless annealing method at room temperature, respectively. The electrical resistivity of the composites was all positive temperature coefficient resistance(PTCR) in the temperature ranges from 25 $^{\circ}C$ to 700 $^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제35권3호
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• pp.264-268
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• 2022

High pressure deuterium (HPD) annealing is an advancing technology for the fabrication of modern semiconductor devices. In this work, gate-enclosed FETs are fabricated on a silicon substrate as test vehicles. After a cycle for the HPD annealing, the device parameters such as threshold voltage (V_TH), subthreshold swing (SS), on-state current (I_ON), off-state current (I_OFF), and gate leakage (I_G) were measured and compared depending on the HPD. The HPD annealing can passivate the dangling bonds at Si-SiO₂ interfaces as well as eliminate the bulk trap in SiO₂. It can be concluded that adding the HPD annealing as a fabrication process is very effective in improving device reliability, performance, and variability.

• 한국전기전자재료학회논문지
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• 제14권10호
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• pp.802-807
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• 2001

The (S $r_{0.85}$C $a_{0.15}$)Ti $O_{3}$(SCT) thin films are deposited on Pt-coated electrode (Pt/TiN/ $SiO_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at woom temperature is close to stoichiometry(1.102 in A/B ratio). The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$]. The capacitance characteristics had a stable value within $\pm$4[%]. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films is observed above 200[kHz]. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequencey.cey.

• 한국진공학회지
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• 제9권2호
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• pp.150-154
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• 2000

Impurity-free vacancy diffusion 방법을 이용하여 압축 응력을 가진 InGaAs/InGaAsP 다중 양자 우물 구조에서 열처리 온도에 따른 무질서 정도를 조사하였다. InGaAs/SiO$_2$ cap 구조가 InP/$SiO_2$ cap 구조보다 급속열처리 (rapid thermal annealing : RTA) 과정에서 더 많은 청색 천이를 나타내었다. 열처리 온도 $700^{\circ}C$에서, InGaAs/$SiO_2$ cap 구조의 경우 다중양자우물의 밴드갭 파장은 1.55 $\mu\textrm{m}$대역에서 1.3 $\mu\textrm{m}$ 대역으로 이동하였으며, InGaAs/$SiO_2$ cap 구조와 InP/$SiO_2$ cap 구조의 밴드갭 파장차이는 195 nm (123 meV)로 높은 선택성을 나타내었다. 또한, DCXRD 스펙트럼으로부터 다중양자우물 구조에서 균일한 합금형태로 완전히 무질서화되는 것을 볼 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.72-76
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• 2003

The $Sr_{0.7}Bi_{2.6}Ta_2O_9$(SBT) thin films are deposited on Pt-coated electrode(Pt/$TiO_2/SiO_2$/Si) using RF magnetron sputtering method. The structural and electrical properties of SBT capacitors were influenced with annealing atmosphere. In the XRD pattern, the SBT thin films in all annealed atmosphere had (105) orientation. In the SEM images, Bi-layered perovskite phase was crystallized in all annealing atmosphere and grains largely grew in oxygen annealing atmosphere. The maximum remanent polarization and the coercive electric field in oxygen annealing atmosphere are $12.40[{\mu}C/cm^2]$ and 30[kV/cm] respectively. The fatigue characteristics of SBT capacitors did not change up to $10^{10}$ switching cycles.

• 한국안광학회지
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• 제5권1호
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• pp.55-59
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• 2000

본 연구에서는 ${\beta}$-SiC, ${\alpha}$-SiC, $Al_2O_3$, $Y_2O_3$ 분말들을 출발원료로 사용하여 일축 가압 소결 및 열처리함으로서 길게 자란 탄화규소입가들이 균일하게 분포된 자기강화 미세구조를 갖는 안경렌즈 절삭용 재료를 제조하였다. 주사전자 현미경을 통해 미세구조를 관찰하였다. 가압 소결과 열처리 동안에 탄화규소의 ${\beta}{\rightarrow}{\alpha}$ 상변태에 기인하여 길게 자란 ${\alpha}$-SiC 입자들이 형성되었고, 이로 인해 파괴인성이 증가하였다. 신소재의 대표적인 경도와 파괴인성은 각각 13.3 GPa과 $4.8MPa{\cdot}m^{1/2}$이었다.