• Title/Summary/Keyword: Anisotropic Conductive film(ACF)

Search Result 52, Processing Time 0.033 seconds

77-GHz Slot Array Antenna Using PCB and ACF (PCB와 ACF를 이용한 77 GHz 슬롯 배열 안테나)

  • Yoon, Pyoung-Hwa;Kwon, Oh-Yun;Song, Reem;Kim, Byung-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.29 no.10
    • /
    • pp.752-757
    • /
    • 2018

  • This study presents the performance evaluation results of a 77-GHz waveguide slot array antenna that was fabricated by attaching a patterned printed circuit board(PCB) on a metal block. The 77-GHz waveguide was divided into a top plate and a bottom structure. The top plate was fabricated using a patterned PCB that can implement a fine slot at low cost. The top cover was then bonded to the bottom metal structure with a waveguide trough using anisotropic conductive film. For evaluating the antenna performance, a $1{\times}16$ slot array antenna was fabricated using our proposed method and the gain and pattern were measured and compared with the simulation results. Though the measurement results demonstrate a reduction in gain of around 2.3~3.5 dB compared to the simulation results assuming ideal bonding conditions, the pattern hardly changed and the slot antenna with a gain of approximately 17 dBi at 77 GHz can be easily manufactured at a low cost using the proposed method.

  • https://doi.org/10.5515/KJKIEES.2018.29.10.752 인용 PDF KSCI

Development of Repair FPC Bonder (리페어 FPC 본더 개발)

  • Ahn Jung-Woo;Seo Ji-Weon
    • Journal of the Semiconductor & Display Technology
    • /
    • v.4 no.4 s.13
    • /
    • pp.27-31
    • /
    • 2005

  • This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

  • PDF

COG 플립칩 본딩 공정조건에 따른 Au-ITO 접합부 특성

  • Choe, Won-Jeong;Min, Gyeong-Eun;Han, Min-Gyu;Kim, Mok-Sun;Kim, Jun-Gi
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2011.05a
    • /
    • pp.64.1-64.1
    • /
    • 2011

  • LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

  • PDF

The characterization of anisotropic Si wafer etching and fabrication of flip chip solder bump using transferred Si carrier (Si웨이퍼의 이방성 식각 특성 및 Si carrier를 이용한 플립칩 솔더 범프제작에 관한 연구)

  • Mun Won-Cheol;Kim Dae-Gon;Seo Chang-Jae;Sin Yeong-Ui;Jeong Seung-Bu
    • Proceedings of the KWS Conference
    • /
    • 2006.05a
    • /
    • pp.16-17
    • /
    • 2006

  • We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

  • PDF