• Journal of Korea Foundry Society
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• v.20 no.4
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• pp.247-253
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• 2000

Titanium was melted in the CaO-coated alumina crucible and the reaction between the melt and the coating layer was negligible. The volume fraction of the gas porosity was decreased with increasing pressure and the sound bar castings with no porosity was obtained under the Ar atmosphere of the pressure of $300kN/mm^2$. The surface of the casting obtained from CaO-coated graphite mold was slightly rougher than that from graphite without coating. The reaction product of titanium melt with the layer of CaO was mainly titanium oxide and that with graphite crucible was titanium cabide with small amount of titanium nitride.

• Journal of Ocean Engineering and Technology
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• v.15 no.2
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• pp.61-65
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• 2001

The fracture toughness of ceramics can be measure by such various methods as DT (double torsion), CN (chevron notch) etc. But, the application of these methods to the engineering ceramics is very difficult because of its very high hardness. So, IF (indentation fracture) method is generally used for the evaluation of fracture toughness of ceramics. The Median crack induced by the sharp Vickers indenter was compared with the detected AE (acoustic emission) signal. On the silicon nitride ceramics, the AE test results agree fairly well with the median crack occurance and growth process. But, on the alumina, very many complicated crack signals were detected besides median crack. It can be considered that the IF methods must be used in limited engineering ceramics materials.

• Progress in Superconductivity and Cryogenics
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• v.13 no.2
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• pp.17-20
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• 2011

Superconducting magnetic energy storage (SMES) has attracted a great deal of interest from the viewpoint of energy saving. The magnet of conduction-cooled high temperature superconducting (HTS) SMES is cooled down by a cryocooler. One of the most important problems to be assured the protection of magnet and cryocooler is breakdown at cryogenic temperature. In this study, we investigated insulation materials such as Kapton, Aluminum Nitride(AIN), Alumina($Al_2O_3$), glass fiber reinforced plastics(GFRP) and vacuum in cryogenic temperature. Also, we analyzed statistically the Weibull distribution of breakdown voltage.

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.35-42
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• 2011

This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.133-138
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• 2006

Effective thermal conductivity of particulate reinforced composite has been predicted by Eshelby's equivalent inclusion method modified with Mori-Tanaka's mean field theory. The predicted results are compared with the experimental results from the literature. The model composite is polymer matrix filled with ceramic particles such as silica, alumina, and aluminum nitride. The preliminary examination by Eshelby type model shows that the predicted results are in good agreements with the experimental results for the composite with perfect spherical filler. As the shape of filler deviates from the perfect sphere, the predicted error increases. By using the aspect ratio of the filler deduced from the fixed filler volume fraction of 30%, the predicted results coincide well with the experimental results for filler volume fraction of 40% or less. Beyond this fraction, the predicted error increases rapidly. It can be finally concluded from the study that Eshelby type model can be applied to predict the thermal conductivity of the particulate composite with filler volume fraction less than 40%.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.122-122
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• 2008

Recently, Metal/Alumina/Silicon-Nitride/Silicon-Oxide/Silicon (MANOS) structures are one of the most attractive candidates to realize vertical scaling of high-density NAND flash memory [1]. However, as ANO layers are miniaturized, negative and positive bias temperature instability (NBTI/PBTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density increase, ${\Delta}D_{it}$, the gate leakage current, ${\Delta}I_G$. and the retention characteristics, in MONOS capacitors, becomes an important issue in terms of reliability. It is well known that tunnel oxide degradation is a result of the oxide and interfacial traps generation during FN (Fowler-Nordheim) stress [2]. Because the bias temperature stress causes an increase of both interfacial-traps and fixed oxide charge could be a factor, witch can degrade device reliability during the program and erase operation. However, few studies on NBTI/PBTI have been conducted on improving the reliability of MONOS devices. In this work, we investigate the effect of post-annealing gas on bias temperature instability (BTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density shift, ${\Delta}I_G$ retention characteristics, and the gate leakage current characteristics of MANOS capacitors. MANOS samples annealed at $950^{\circ}C$ for 30 s by a rapid thermal process were treated via additional annealing in a furnace, using annealing gases $N_2$ and $N_2-H_2$ (2 % hydrogen and 98 % nitrogen mixture gases) at $450^{\circ}C$ for 30 min. MANOS samples annealed in $N_2-H_2$ ambient had the lowest flat band voltage shift, ${\Delta}V_{FB}$ = 1.09/0.63 V at the program/erase state, and the good retention characteristics, 123/84 mV/decade at the program/erase state more than the sample annealed at $N_2$ ambient.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Journal of the Korean Ceramic Society
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• v.33 no.3
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• pp.285-292
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• 1996

The effect of AlN on the thermal conductivity of aluminum oxide pressurelessly sintered at nitrogen atmos-phere was investigated. Increasing aluminium nitride content up to 1~10 mol% the thermal conductivity of $Al_{2}O_{3}$-AlN system was singnificantly decreased and was constant with adding 20 and 25 mol% aluminium nitride. The thermal conuctivity of $Al_{2}O_{3}$ containing 1~10 mol% the thermal conductivity of $Al_{2}O_{3}$-AlN system was singificantly decreased and was constant with adding 20 and 25mol% aluminum nitride. The thermal conctivity of $Al_{2}O_{3}$ containing 1~10 mol% AlN showed a maximum at $1700^{\circ}C$ and decrea-sed with increasing sintering tempertures. This phenomenon was attributed to $\alpha$-$Al_{2}O_{3}$ and ALON formed by reacting $Al_{2}O_{3}$ with AlN up to $1700^{\circ}C$ and the secondary phases such as ${\gamma}$-ALON ($9Al_{2}O_{3}$.AlN)and $\Phi$($5Al_{2}O_{3}$.AlN) phase above $1750^{\circ}C$ The thermal conductivity of $Al_{2}O_{3}$ containing 20 and 25 mol% AlN showed maximum value at $1800^{\circ}C$ Both $\alpha$-$Al_{2}O_{3}$ and ALON existed up to $1600^{\circ}C$ value at $1800^{\circ}C$ Both $\alpha$-$Al_{2}O_{3}$ and ALON existed up to $1600^{\circ}C$ while only AlON phase existed above $1650^{\circ}C$.

• Tribology and Lubricants
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• v.12 no.1
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• pp.56-65
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• 1996

The result of wear test for ceramic materials was assessed by Scf parameter to verify the usefulness of the proposed Scf parameter. Friction and wear tests were carried out with ball on disk type. The materials used in this study were HIPed Alumina $(Al_2O_3)$, Silicon carbide (sic), Silicon nitride $(Si_3N_4)$ and Zirconia $(ZrO_2)$. The tests were carried out at room temperature with self mated couples of ceramic materials under lubricated condition. Turbine oil was used as a lubricant. In this test, increasing the load, specific wear rates and wear coefficients of four kinds of ceramic materials had a tendency to increase. The wear coefficients of ceramic materials were in order of $Al_2O_3, SiC, Si_3N_4, ZrO_2$. Worn surfaces investigated by SEM had residual surface cracks and wear particles caused by brittle fracture. As the fracture toughness of ceramic materials was higher, wear resistance more increased. The roughness of worn surface had correlation with wear rate. The wear rate(W$_{s}$) and Scf parameter showed linear relationship in log-log coordinates and the wear equation was given as $W_s = 5.52 $\times$ Scf^{5.01}$.