• 한국주조공학회지
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• 제20권4호
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• pp.247-253
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• 2000

Titanium was melted in the CaO-coated alumina crucible and the reaction between the melt and the coating layer was negligible. The volume fraction of the gas porosity was decreased with increasing pressure and the sound bar castings with no porosity was obtained under the Ar atmosphere of the pressure of $300kN/mm^2$. The surface of the casting obtained from CaO-coated graphite mold was slightly rougher than that from graphite without coating. The reaction product of titanium melt with the layer of CaO was mainly titanium oxide and that with graphite crucible was titanium cabide with small amount of titanium nitride.

• 한국해양공학회지
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• 제15권2호
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• pp.61-65
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• 2001

The fracture toughness of ceramics can be measure by such various methods as DT (double torsion), CN (chevron notch) etc. But, the application of these methods to the engineering ceramics is very difficult because of its very high hardness. So, IF (indentation fracture) method is generally used for the evaluation of fracture toughness of ceramics. The Median crack induced by the sharp Vickers indenter was compared with the detected AE (acoustic emission) signal. On the silicon nitride ceramics, the AE test results agree fairly well with the median crack occurance and growth process. But, on the alumina, very many complicated crack signals were detected besides median crack. It can be considered that the IF methods must be used in limited engineering ceramics materials.

• 한국초전도ㆍ저온공학회논문지
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• 제13권2호
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• pp.17-20
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• 2011

Superconducting magnetic energy storage (SMES) has attracted a great deal of interest from the viewpoint of energy saving. The magnet of conduction-cooled high temperature superconducting (HTS) SMES is cooled down by a cryocooler. One of the most important problems to be assured the protection of magnet and cryocooler is breakdown at cryogenic temperature. In this study, we investigated insulation materials such as Kapton, Aluminum Nitride(AIN), Alumina($Al_2O_3$), glass fiber reinforced plastics(GFRP) and vacuum in cryogenic temperature. Also, we analyzed statistically the Weibull distribution of breakdown voltage.

• 반도체디스플레이기술학회지
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• 제10권3호
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• pp.35-42
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• 2011

This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

• 동력기계공학회지
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• 제10권4호
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• pp.133-138
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• 2006

Effective thermal conductivity of particulate reinforced composite has been predicted by Eshelby's equivalent inclusion method modified with Mori-Tanaka's mean field theory. The predicted results are compared with the experimental results from the literature. The model composite is polymer matrix filled with ceramic particles such as silica, alumina, and aluminum nitride. The preliminary examination by Eshelby type model shows that the predicted results are in good agreements with the experimental results for the composite with perfect spherical filler. As the shape of filler deviates from the perfect sphere, the predicted error increases. By using the aspect ratio of the filler deduced from the fixed filler volume fraction of 30%, the predicted results coincide well with the experimental results for filler volume fraction of 40% or less. Beyond this fraction, the predicted error increases rapidly. It can be finally concluded from the study that Eshelby type model can be applied to predict the thermal conductivity of the particulate composite with filler volume fraction less than 40%.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.95-99
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• 2018

최근 고집적 고출력 전자 패키지의 효율적인 열전달을 위한 기판 및 방열소재로서 절연성 고열전도 필름의 수요가 커지고 있어, 알루미나, 질화알루미늄, 질화보론, 탄소나노튜브 및 그래핀 등의 고열전도 필러소재를 사용한 고방열 복합소재에 대한 많은 연구가 이루어지고 있다. 그 중에서도 육방정 질화보론(h-BN) 나노시트가 절연성 고열전도 필러 소재로서 유력한 후보 물질로 선택되고 있다. 본 연구는 이 h-BN 나노시트와 PVA로 된 세라믹/폴리머 복합체 필름의 방열특성 향상에 관한 것이다. h-BN 나노시트는 h-BN 플레이크 원료 분말을 유기용매를 사용한 볼밀링과 초음파 처리에 의한 물리적 박리공정으로 만들었으며, 이를 사용한 h-BN/PVA 복합 필름을 제조한 결과 성형된 복합필름의 면방향과 두께방향 열전도도는 50 vol%의 필러함량에서 각각 $2.8W/m{\cdot}K$ 및 $10W/m{\cdot}K$의 높은 열전도도가 나타났다. 이 복합필름을 PVA의 유리전이온도 이상에서 일축 가압하여 h-BN 판상분말의 얼라인먼트를 향상시킴으로써 면방향 열전도도를 최대 $13.5W/m{\cdot}K$까지 증가시킬 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.122-122
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• 2008

Recently, Metal/Alumina/Silicon-Nitride/Silicon-Oxide/Silicon (MANOS) structures are one of the most attractive candidates to realize vertical scaling of high-density NAND flash memory [1]. However, as ANO layers are miniaturized, negative and positive bias temperature instability (NBTI/PBTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density increase, ${\Delta}D_{it}$, the gate leakage current, ${\Delta}I_G$. and the retention characteristics, in MONOS capacitors, becomes an important issue in terms of reliability. It is well known that tunnel oxide degradation is a result of the oxide and interfacial traps generation during FN (Fowler-Nordheim) stress [2]. Because the bias temperature stress causes an increase of both interfacial-traps and fixed oxide charge could be a factor, witch can degrade device reliability during the program and erase operation. However, few studies on NBTI/PBTI have been conducted on improving the reliability of MONOS devices. In this work, we investigate the effect of post-annealing gas on bias temperature instability (BTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density shift, ${\Delta}I_G$ retention characteristics, and the gate leakage current characteristics of MANOS capacitors. MANOS samples annealed at $950^{\circ}C$ for 30 s by a rapid thermal process were treated via additional annealing in a furnace, using annealing gases $N_2$ and $N_2-H_2$ (2 % hydrogen and 98 % nitrogen mixture gases) at $450^{\circ}C$ for 30 min. MANOS samples annealed in $N_2-H_2$ ambient had the lowest flat band voltage shift, ${\Delta}V_{FB}$ = 1.09/0.63 V at the program/erase state, and the good retention characteristics, 123/84 mV/decade at the program/erase state more than the sample annealed at $N_2$ ambient.

• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 한국세라믹학회지
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• 제33권3호
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• pp.285-292
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• 1996

질소 분위기에서 상압소결한 알루미나 소결체의 열전도도에 대한 AIN 첨가효과를 검토하였다. AIN 함량이 1,5 및 10 mol%롤 증가하면 $Al_{2}O_{3}$-AIN 소결체의 열전도도는 급격히 감소하지만, 20 및 25 mol%가 첨가되면 거의 일정하였다. 1~10mol% AIN이 첨가된 알루미나 소결체의 열전도도는 $1700^{\circ}C$의 소결온도에서 최대값을 나타내었으며, 소결온도가 $1800^{\circ}C$로 증가하면 감소하는 경향을 보였다. 이러한 현상은 $1700^{\circ}C$까지는 $\alpha$-$Al_{2}O_{3}$ 및 $Al_{2}O_{3}$와 AIN이 반응하여 생성되 ALON상이 존재하나, $1750^{\circ}C$부터 ${\gamma}$-ALON($9Al_{2}O_{3}$.AIN) 및 $\Phi$($5Al_{2}O_{3}$.AIN)상 등의 2차상을 생성하는 것에 기인된다. 20 및 25 mol% AIN이 첨가된 알루미나 소결체의 열전도도는 $1800^{\circ}C$에서 최대값을 나타내며, $1600^{\circ}C$에서는 $\alpha$-$Al_{2}O_{3}$ 및 ALON상이 존재하나 그 이상의 온도에서는 모두 ALON상만이 존재하였다.

• Tribology and Lubricants
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• 제12권1호
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• pp.56-65
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• 1996

The result of wear test for ceramic materials was assessed by Scf parameter to verify the usefulness of the proposed Scf parameter. Friction and wear tests were carried out with ball on disk type. The materials used in this study were HIPed Alumina $(Al_2O_3)$, Silicon carbide (sic), Silicon nitride $(Si_3N_4)$ and Zirconia $(ZrO_2)$. The tests were carried out at room temperature with self mated couples of ceramic materials under lubricated condition. Turbine oil was used as a lubricant. In this test, increasing the load, specific wear rates and wear coefficients of four kinds of ceramic materials had a tendency to increase. The wear coefficients of ceramic materials were in order of $Al_2O_3, SiC, Si_3N_4, ZrO_2$. Worn surfaces investigated by SEM had residual surface cracks and wear particles caused by brittle fracture. As the fracture toughness of ceramic materials was higher, wear resistance more increased. The roughness of worn surface had correlation with wear rate. The wear rate(W$_{s}$) and Scf parameter showed linear relationship in log-log coordinates and the wear equation was given as $W_s = 5.52 $\times$ Scf^{5.01}$.