• Journal of the Korean Vacuum Society
• /
• v.16 no.1
• /
• pp.40-45
• /
• 2007

ZnCdSe alloy semiconductor was widely used for the optoelectronic device. And CdSe is the end-point in this material. In this work, we measured the dielectric function spectrum of cubic CdSe with Vacuum Ultra Violet spectroscopic ellipsometry and analysed this data with parametric model. As a result, we observed some of transition energy point over 6 eV and obtained the database for dielectric function spectrum, which could be used for temperature or alloy composition dependence study on optical property of CdSe.

• Journal of the Korean Vacuum Society
• /
• v.12 no.1
• /
• pp.20-24
• /
• 2003

We Performed the modeling of the dielectric functions of InGaAs by using the parametric semiconductor model. Parametric model describes the analytic dielectric function as the summation of several energy-bounded Gaussian-broadened polynomials and provides a reasonably well parameterized function which can accurately reproduce the optical constants of InGaAs materials. We obtained the values of fitting parameters of an arbitrary composition $\chi$ through the parametric model. And then, from these parameters we could obtain the unknown dielectric functions of InGaAs alloy films ($0\leq\chi\leq1$).

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.4
• /
• pp.125-129
• /
• 2021

We investigated the electronic property and atomic structure for chalcopyrite (CH) Al_xGa_1-xAs semiconductor by using first-principles FPLMTO method. The CH-Al_xGa_1-xAs exhibits a p-type semiconductor with a direct band-gap. For low Al concentration unoccupied hole-carriers are induced, but for high Al concentration it is formed a localized bonding or anti-bonding state below Fermi level. The hybridization of Al(3s)-Ga(4s, or 4p) is larger than that of Al(3s)-As(4s, or 4p). And the Al film on As-terminated surface, Al/AsGa(001), is more energetically favorable one than that on Ga-terminated (001) surface. Consequently, the band-gap of CH-Al_xGa_1-xAs system increases exponentially with increasing Al concentration. The change of lattice parameter is shown two different configurations with increasing Al concentration. The calculated lattice parameters for CH-Al_xGa_1-xAs system are compared to the experimental ones of zinc-blend GaAs and AlAs.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.19 no.3
• /
• pp.576-583
• /
• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.6
• /
• pp.423-427
• /
• 1998

In this paper the electron mobility in $Ga{1-X}In_xAs$alloy semiconductors is simulated by using the ensemble Monte Carlo method. The simulations for Ga\ulcornerIn\ulcornerAs with In mole fraction, doping concentration and temperature as parameters are performed. The electron mobility for alloys which perfectly orderd alloys without the alloy scattering mechanism are assumed, the results show that mobility in Ga\ulcornerIn\ulcornerAs is improved by 11%, 12% and 7% for 0.25, 0.53 and 0.75. In mole fractions, respectively, We reported the theoretical results of electron mobility in $Ga{1-X}In_xAs$alloys, so those will contribute to the research and development into materials for high-speed semiconductor devices.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.117-117
• /
• 2012

Si:Ge alloy semiconductor nanocrystals (NCs) offer challenging opportunities for integrated optoelectronics/optoplasmonics, since they potentially allow unprecedentedly strong light-matter interaction in the wavelength range of the optical communication. In this talk, we discuss the recent research efforts of my laboratory to develop optoelectronic components based on individual group IV NCs. We present experimental demonstration of the individual NC optoelectronic devices, including broadband Si:Ge nanowire (NW) photodetectors, intra NW p-n diodes, Ge NC electrooptical modulators and near-field plasmonic NW detectors, where the unique size effects at the nanometer scales commonly manifest themselves. In particular, we demonstrated a scanning photocurrent imaging technique to investigate dynamics of photocarriers in individual Si:Ge NWs, which provides spatially and spectrally resolved local information without ensemble average. Our observations represent inherent size-effects of internal gain in semiconductor NCs, thereby provide a new insight into nano optoplasmonics.

• Journal of the Semiconductor & Display Technology
• /
• v.14 no.2
• /
• pp.47-52
• /
• 2015

In this paper, the performance of uncoated- and Titanium nitride aluminium TiAlN-PVD coated- carbide twist drills were investigated when drilling aluminium alloy, Al 6061. This research focuses on the optimization of drilling parameters using the Taguchi technique to obtain minimum surface roughness and thrust force. A number of drilling experiments were conducted using the L9 orthogonal array on a CNC vertical machining center. The experiments were performed on Al 6061 material l blocks using uncoated and coated HSS twist drills under dry cutting conditions. Analysis of variance(ANOVA) was employed to determine the most significant control factors. The main objective is to find the important factors and combination of factors influence the machining process to achieve low surface roughness and low cutting thrust force. From the analysis of the Taguchi method indicates that among the all-significant parameters, feed rate are more significant influence on surface roughness and cutting thrust than spindle speed.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2005.05a
• /
• pp.129-133
• /
• 2005

대기압 글로우 플라즈마를 이용하여 반도체 리드프레임(Alloy 42) 도금 전처리 습식 공정을 건식으로 대체하였다. 13.56 MHz의 RF 전원을 사용하여 300 W 파워에서 안정적인 대기압 글로우 플라즈마를 발생시켰으며, 금속 리드프레임에 플라즈마가 직접 접촉해도 아크나 스트리머 발생이 없었다. 플라즈마 소스 가스로는 알곤(Ar)을 사용하였으며, 활성가스로 산소($O_2$)를 첨가하였다. 300 W 파워에서 산소를 50 sccm 공급하고 100 mm/sec 속도로 리드프레임을 처리한 결과, 처리 전 접촉각이 $82^{\circ}$에서 처리 후 $10^{\circ}$ 이하로 낮아졌다. 플라즈마 처리 후 리드프레임 표면 거칠기 변화를 AFM으로 측정하였다.

• ETRI Journal
• /
• v.21 no.3
• /
• pp.16-21
• /
• 1999

After etching Al-Cu alloy films using SiCl4/Cl_2/He/CHF3 mixed gas plasma, the corrosion phenomenon at the grain boundary of the etched surface and a passivation layer on the etched surface with an SF6 plasma treatment subsequent to the etching were studied. In Al-Cu alloy system, corrosion occurs rapidly on the etched surface by residual chlorine atoms, and it occurs dominantly at the grain boundaries rather than the crystalline surfaces. To prevent corrosion, the SF6 gas plasma treatment subsequent to etching was carried out. The passivation layer is composed of fluorine-related compounds on the etched Al-Cu surface after the SF6 treatment, and it suppresses effectively corrosion on the surface as the SF6 treatment pressure increases. Corrosion could be suppressed successfully with the SF6 treatment at a total pressure of 300 mTorr. To investigate the reason why corrosion could be suppressed with the SF6 treatment, behaviors of chlorine and fluorine were studied by various analysis techniques. It was also found that the residual chlorine incorporated at the grain boundary of the etched surface accelerated corrosion and could not be removed after the SF6 plasma treatment.

• Journal of the Korean Society of Industry Convergence
• /
• v.25 no.6_2
• /
• pp.961-968
• /
• 2022

Hydrogen embrittlement leads to the damages in bolts, nut, especially, high pressure valves, in the semiconductor facilities, hydrogen vehicles, hydrogen stations and so on. Monel material has higher strength than SUS material. Therefore, even though Monel material with special alloy is usually used to prevent the hydrogen embrittlement, it needs powerful drawing system to manufacture the rectangular or hexagonal bar using circular bar. The purpose of this study is to investigate the characteristics of plastic deformation of Monel material and 2 rollers of rolling unit in plastic limit through numerical analysis. As the results, it was predicted that, based on mean stress, as the rolling step was increased, the rolling force of rolling unit was decreased. In addition, the heat treatment for Monel material was needed because of residual stress due to plastic deformation. As for rollers, the roller was safe about 1.86 times compared with that of ultimate strength. In this study, as the roller 2 showed larger stress than roller 1, thus, roller 2 should be designed carefully to guarantee the safety. Further it was confirmed that the reaction force of roller could be helpful in bearing design.