• 한국표면공학회지
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• 제4권1호
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• 한국표면공학회지
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• 제30권5호
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• pp.320-332
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• 1997

The development of colored surface on zinc coating by the oxidation of a melten alloy of zinc with a minor amount of oxygen-avid additive such as tianium has been studied. Using a galvanizing Zinc alloy containing 0.1 to 0.3wt%Ti, gold, purple or blue color was developed clearly and stably, depending upon the extent of oxidation, by air cooling after hot dipping in a bath at temperature of $550^{\circ}C$ to $600^{\circ}C$. The source of the color is light interference with surface oxide layer. THe final color depends on the thickness of the color depends on the thickness of $TiO_2$, played So compositing, temperature and time at elevated temperature after are all controlling variables. Since oxidation film such as $TiO_2$ played role of passivation film, the corrosion resistance in a colored galvanized steel sheet. It is also thought that surface oxide layer of $TiO_2$ inhibited dissolution of the coating layer.

• 한국전기전자재료학회논문지
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• 제11권7호
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• pp.517-521
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS(X-ray pheotoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, $CHF_3$ plasma treatment subsequent to the etch has been carried put. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after $CHF_3$ treatment, and the layer suppresses effectively the corrosion on the surface as the $CHF_3$treatment in the pressure of 300m Torr.

• 한국표면공학회지
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• 제36권4호
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• pp.329-333
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• 2003

The high-temperature oxidation behavior of Ti39Al-10V alloy that consisted primarily of $\beta$-Ti, ${\gamma}$-TiAl, and $\alpha_2$ $-Ti_3$Al phases was studied. The relatively thick and porous oxide scales formed consisted primarily of an outermost, thin TiO$_2$ layer, and an outer, thin $Al_2$$O_3$-rich layer, and an inner, very thick (TiO$_2$, $Al_2$$O_3$) mixed layer. Vanadium was present uniformly throughout the oxide scale. The formation and subsequent evaporation of V-oxides such as VO, $VO_2$, and $V_2$O$_{5}$ deteriorated oxidation resistance and scale adherence of the TiAl alloy significantly.y.

• 한국분말재료학회지
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• 제29권2호
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• pp.123-131
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• 2022

The purpose of this study is to improve the mechanical properties and develop manufacturing technology through self-soluble alloy powder flame spray coating on the surface of a run-out table roller for hot rolling. The roller surface of the run-out table should maintain high hardness at high temperatures and possess high wear, corrosion, and heat resistances. In addition, sufficient bonding strength between the thermal spray coating layer and base material, which would prevent the peel-off of the coating layer, is also an important factor. In this study, the most suitable powder and process for roll manufacturing technology are determined through the initial selection of commercial alloy powder for roll manufacturing, hardness, component analysis, and bond strength analysis of the powder and thermal spray coating layer according to the powder.

• 한국진공학회지
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• 제15권3호
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• pp.280-286
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• 2006

디지털 합금 (digital-alloy) 성장방법을 사용한 AIGaAs층을 이용하여 $1.3{\mu}m$ vertical cavity surface emitting laser (VCSEL)에 사용될 수 있는 AlGaAs/GaAs distributed Bragg reflector (DBR)를 분자선 에피탁시 (molecular beam epitaxy) 방법을 통해 제작하였다. 3인치 1/4 크기의 기판에 디지털 합금 AlGaAs층을 사용한 DBR을 성장하고 기판 여러 부분에서의 반사율을 측정하여 각 부분 간의 반사율 편차가 0.35%이내임을 확인하였다. TEM 사진을 통한 계면분석을 통해 디지털 합금 AlGaAs층의 조성과 두께가 균일함을 확인하였는데, 이는 디지털 합금 AlGaAs층의 성장시 기판 표면의 온도가 불균일하더라도 크게 영향을 받지 않음을 보여준다. 이를 통해 DBR의 균일성에 따라 소자의 특성에 큰 영향을 받는 InAs 양자점을 활성층으로 사용하는 VCSEL의 수율을 향상시키는데 디지털 합금 AlGaAs층을 이용한 DBR이 응용될 수 있음을 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

• Journal of Welding and Joining
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• 제12권4호
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• pp.102-109
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• 1994

The thick and hard alloyed layer was formed on the surface of Aluminum Cast Alloy(AC2B) by PTA overlaying process with Cr, Cu and Ni metal powders under the condition of overlaying current 150A, overlaying speed 150mm/min and different powder feeding rate 5-20g/min. The characteristics of hardening and were resistance of alloyed layer have been investigated in relation to microstructure of alloyed layer. As a result, it was made clear that Cu powder was the most superier one in three metal powders used due to an uniform hardness distribution of Hv 250-350, good wear resistance and freedom from cracking in alloyed layer of which microstructure consisted of hypereutectic. On the contrary, irregular hardness distribution was usually obtained in Cr or Ni alloyed layers of which hardness was increased as Cr or Ni contents and reached to maximum hardness of about Hv 400-850 at about 60wt% Cr or 40wt% Ni in alloyed layer. However the cracking occurred in these alloyed layers with higher hardness than Hv 250-300 at more than 20-25wt% of Cr or Ni contents in alloyed layer. Wear rate of alloyed layer was decreased to 1/10 in Cu alloyed layer and 1/5 or 1/3 in Cr or Ni alloyed layer with same hardness of about Hv 300 in comparison with that of base metal at higher sliding speed.

• 동력기계공학회지
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• 제9권4호
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• pp.90-95
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• 2005

The wire-arc process is a low-cost thermal spray method simply utilizes electrical energy to melt the feedstock wire. It is more userful for field applications, especially to coat large surface area. In this paper, a special Fe-based alloy coatings by using the wire-arc process were developed. Nanoscale composite coatings were achieved either during spraying or through a post heat treatment. As-sprayed Fe-based alloy coatings had been an amorphous matrix structure, after heating to $700^{\circ}C$ for 10 minutes a solid state transformation occurred in the some fraction of amorphous matrix which resulted in the formation of nanostructured recrystallized phase. Scanning electron microscopy (SEM) and field emotional scanning electron microscope(FE-SEM) were applied to analyze the microstructure of the coatings. Additionally hardness and bend resistance of the Fe-based alloy coatings were examined, and these results were compared with those of partially stabilized zirconia(PSZ) coatings by using the plasma spray process.

• 한국표면공학회지
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• 제37권5호
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• pp.243-248
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• 2004

A palladium-nikel(Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support formed with nickel powder. Plasma surface treatment process is introduced as pre-treatment process instead of HCI activation. Pd coating layer was prepared by dc magnetron sputtering deposition after $H_2$ plasma surface treatment. Palladium-nickel alloy composite layer had a fairly uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature of 773 K and pressure of 2.2psi. The hydrogen permeance was 6 ml/minㆍ$\textrm{cm}^2$ㆍatm and the selectivity was 120 for hydrogen/nitrogen($H_2$/$N_2$) mixing gases at 773 K.