• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 춘계학술대회 논문집
• /
• pp.114-118
• /
• 2005

In this study, the DC dielectric breakdown of epoxy composites used for molding material was experimented and then its data were simulated by Weibull distribution equation. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 기술교육위원회 창립총회 및 학술대회 의료기기전시회
• /
• pp.43-46
• /
• 2001

The DC dielectric breakdown of epoxy composites used for transformer was experimented and then its data were simulated by Weibull distribution equation in this study. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it was believed that the adding filler formed interface, charges were accumulated in it, the molecular mobility was raised, the electric field was concentrated, electrons were accelerated and then electron avalanche was early accomplished. From the analysis of Wei bull distribution equation, it was confirmed that as the allowed breakdown probability was· given by 0.1[%], the value of 'applied field was needed to be under 17.20[kV/mm].

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.92-95
• /
• 2001

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric field is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5 [Mv/cm].

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집
• /
• pp.414-419
• /
• 2002

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric field is concentrated. In the case of (idled specimens with treating silane, the breakdown strength become much higher Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5 MV/cm.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.212-217
• /
• 2002

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric field is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5 MV/cm.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1996년도 추계학술대회 논문집
• /
• pp.260-264
• /
• 1996

In this study, the dieiectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability . As a result. first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature, and the breakdown strength of specimens because it is believed that the adding filler farms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since the suggests that silane coupling agent improves interfacial combination and relays electric field concentration. Finally, from the analysis 7f weibull distribution. it was confirmed that as the allowed breakdown probability was given by 0.11[%].

• 한국전기전자재료학회논문지
• /
• 제14권8호
• /
• pp.647-651
• /
• 2001

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were applied to Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased, the stronger breakdown strength became at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric filed is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher. Finally, from the analysis of weibull distribution, it was confirmed that to low allowed breakdown probability under 0,.1%, the applied field value needed to be under 21.5MV/cm.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 기술교육전문연구회
• /
• pp.159-163
• /
• 2003

In this study, the DC dielectric breakdown of epoxy composites used for PCB material was experimented and then its data were simulated by Weibull distribution equation. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2001년도 추계종합학술대회
• /
• pp.724-728
• /
• 2001

본 연구에서는 에폭시 수지를 시료로 선정, 5 종의 배합비로 제작한 시편에 대해 절연 파괴 실험을 하여 얻어진 데이터를 수명 평가나 파괴 통계에서 주로 활용하는 와이블 분포식을 이용, 임의의 허용 파괴 확률에서의 허용인가 전계값을 추정, 안전성을 판단하기 위해 경년 열화데이터의 통계 처리 방법을 제안하였다. 그 결과, 경화제 비율이 증가하면 에폭시 경화물의 에스터화로 인해 가교 밀도가 증가함으로써 저온에서의 파괴 강도가 높아졌으며, 유리 전이 온도(Tg) 영역인 11$0^{\circ}C$ 부근에서는 분자 운동이 활발해짐으로써 급격히 파괴 강도가 저하하였다. 또한, 충진제를 첨가한 경우 접합 계면에 전자가 가속되어 전반적인 파괴 강도는 무충진에 비해 낮게 나타났으며, 실란 처리를 한 경우에는 계면 접합 상태가 개선되어 충진제만을 첨가한 시료보다 좋은 절연성을 나타냈다. 와이블 분포의 분석으로 부터 기기 절연의 허용 파괴 확률을 0.1 % 이하로 낮추기 위해서는 허용인가 전계값이 21.5 ㎹/cm 이하가 되어야함을 알 수 있었다.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2002년도 추계종합학술대회
• /
• pp.779-783
• /
• 2002

변성기용 절연 재료로 사용되는 에폭시 수지를 시료로 선정, 5종의 배합비로 제작한 시편에 대해 절연 파괴 실험을 하며, 얻어진 데이터를 와이블 분포식을 이용, 경년 열화(經年劣和) 데이터의 통계 처리 방법을 제안하였다. 경화제 비율이 증가하면 에폭시 경화물의 에스터화로 인해 가교 밀도가 증가함으로써 저온에서의 파괴 강도가 높아졌으며, 유리 전이 온도(Tg) 영역인 11$0^{\circ}C$ 부근에서는 분자 운동이 활발해짐으로써 급격히 파괴 강도가 저하하였다. 또한, 충진제를 첨가한 경우 접합 계면에 전자가 가속되어 전반적인 파괴 강도는 무충진에 비해 낮게 나타났으며, 실란 처리를 한 경우에는 계면 접합 상태가 개선되어 충진제만을 첨가한 시료보다 좋은 절연성을 나타냈다. 와이블 분포의 분석으로부터 기기 절연의 허용 파괴 확률을 0.1% 이하로 낮추기 위해서는 허용인가 전계값이 21.5 MV/cm 이하가 되어야함을 알 수 있었다.