• 한국전자현미경학회:학술대회논문집
• /
• 2001.11a
• /
• pp.100-101
• /
• 2001

• Journal of the Korean Society of Safety
• /
• v.21 no.2 s.74
• /
• pp.35-45
• /
• 2006

Cobalt catalysts for gas mask loaded on various supports such as $Al_{2}O_{3},\;TiO_{2}$, AC(activated carbon) and $SiO_{2}$ were used to examine influences of calcination temperatures and reaction temperatures for CO oxidation. $Co(NO_{3})_2{\cdot}6H_{2}O$ was used as cobalt precursor and the catalysts were prepared by incipient wetness impregnation. The catalysts were characterized using XRD, TGA/DTA, TEM, $N_{2}$ sorption, and XPS. For the catalytic activity, support was in the order of ${\gamma}-Al_{2}O_{3}>TiO_{2}>SiO_{2}>AC\;and\;Al_{2}O_{3}$. The catalytic activity at lower temperature than $80^{\circ}C$ showed that with the increase of reaction temperature, cobalt catalysts on ${\gamma}-Al_{2}O_{3},\;TiO_{2},\;AC\$ has the negative activation energy but that of $SiO_{2}$ was positive.

• 한국전자현미경학회:학술대회논문집
• /
• 1994.05a
• /
• pp.34-34
• /
• 1994

• Transactions of Materials Processing
• /
• v.8 no.3
• /
• pp.289-289
• /
• 1999

This paper describes the investment casting of TiAl alloys. The effects of mold material and mold preheating temperature for the investment casting of TiAl on metal-mold interfacial reaction were investigated by means of optical micrography, hardness profiles and an electron probe microanalyzer. The mold materials examined were colloidal silica bonded ZrO₂, ZrSiO₄, A1₂O₃and CaO stabilized ZrO₂. When compared with conventional titanium a1loy, the high aluminum concentration of TiAl alloys helps to lower their reactivity in the molten state. The A1₂O₃mold is a promising mold material for the investment casting of TiAl in terms of the thermal stability, formability and cost. Special attention need to be paid to thermal stability and mold preheating when developing the investment calling of TiAl alloys.

• Journal of the Korean Vacuum Society
• /
• v.9 no.2
• /
• pp.162-166
• /
• 2000

High quality $Si_3N_4$ metal-insulator-metal (MIM) capacitors were realized by plasma enhanced chemical vapor deposition (PECVD). Titanium nitride (TiN) adapted as a diffusion barrier reduced the interfacial reaction between $Si_3N_4$ dielectric layer and aluminum metal electrode showing neither hillock nor observable precipitate along the interface. The capacitance and the current-voltage characteristics of the MIM capacitors showed that the minimum thickness of $Si_3N_4$ layer should be limited to 500 $\AA$ under the present process, below which most of the capacitors were electrically shorted resulting in the devastation of on-wafer yield. According to the transmission electron microscopy (TEM) on the cross-sectional microstructure of the capacitors, the dielectric breakdown was caused by slit-like voids formed at the interface between TiN and $Si_3N_4$ layers when the thickness of $Si_3N_4$ layer was less than 500 $\AA$. Based on the calculation of thermally-induced residual stress, the formation of voids was understood from the mechanistic point of view.

• Journal of IKEEE
• /
• v.22 no.2
• /
• pp.484-487
• /
• 2018

5 MeV proton-irradiation with total dose of $10^{15}/cm^2$ was performed on AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with various gate metals including Ni, TaN, W, and TiN to investigate the degradation characteristics. The positive shift of pinch-off voltage and the reduction of on-current were observed from irradiated HEMTs regardless of a type of gate materials. Hall and transmission line measurements revealed the reduction of carrier mobility and sheet charge concentration due to displacement damage by proton irradiation. The shift of pinch-off voltage was dependent on Schottky barrier heights of gate metals. Gate leakage and capacitance-voltage characteristics did not show any significant degradation demonstrating the superior radiation hardness of Schottky gate contacts on GaN.

• Transactions of Materials Processing
• /
• v.18 no.7
• /
• pp.544-549
• /
• 2009

This study aimed to elucidate the deformation mechanism during low-temperature superplasticity of fine-grained Ti-6Al-2Sn-4Zr-2Mo-0.1Si alloy in the context of constitutive equation. For this purpose, initial coarse equiaxed microstructure was refined to $2.2{\mu}m$ via dynamic globularization. Globularized microstructure exhibited large superplastic elongations(434-826%) at temperatures of $650-750^{\circ}C$ and strain rate of $10^{-4}s^{-1}$. It was found that the main deformation mechanism of fine-grained material was grain boundary sliding accommodated by dislocation motion with both stress exponent (n) and grain size exponent (p) values of 2. When the alpha grain size, not sub-grain size, was considered to be an effective grain size, the apparent activation energy for low-temperature superplasticity of the present alloy(169kJ/mol) was closed to that of Ti-6Al-4V alloy(160kJ/mol).

• Proceedings of the Korean Vacuum Society Conference
• /
• 2000.02a
• /
• pp.65-65
• /
• 2000

반도체 소자의 고집적화는 배선에서 많은 문제점을 야기 시킨다. 이러한 문제점들 중에서 대표적인 것이 과도한 전류밀도에 의한 electro-migration(EM)이다. 이는 앞으로 배선의 선폭이 0.25$mu extrm{m}$미만일 경우 더욱 심화될 전망이다. 이에 대안으로 Al-합금에서 Cu로 대체하여 이러한 문제를 해결하려 하고 있다. 그런데, Cu는 Si 및 SiO2와 높은 반응성과 빠른 확산속도를 가지기 때문에 확산방지막이 필요로 되어진다. 현재에는 TiN, TaN 등의 확산방지막이 사용되어지고 있으나, TiN 박막의 경우 표면에 Ti와 oxide와의 결합에 의해 Ti-O 성분이 존재하는데, 이럴 경우 Cu 증착을 하는데 있어 부정적인 요인이 된다. 또한, 이러한 화합물은 Cu와 TiN 계면사이에 밀착성을 나쁘게 하여 고전류 인가시 EM에 있어 높은 저항성을 가질 수가 없다. 따라서, 본 연구는 MOCVD방식으로 Cu 박막을 증착하기에 앞서 수소플라즈마를 이용하여 TiN 표면에 형성된 산소 화합물을 제거한 후 Cu를 증착하여 동일한 조건에서 EM 가속화 실험을 하였다. 그림 1은 Cu/TiN 구조에 있어 수소 전처리를 한 배선의 구조의 MTF(mean time to failure)가 65분이고 전처리를 하지 않은 배선구조는 40분으로 약 50% 긴 MTF를 가지는 것으로 나왔다. 결론적으로 Cu와 TiN 계면에 좋은 밀착성은 EM에 있어 우수한 저항성을 가지는 것으로 나왔다.

• Korean Journal of Materials Research
• /
• v.8 no.2
• /
• pp.131-134
• /
• 1998

The deposition rate and surface morphology of Al films deposited by MOCVD have been studied on the $SiO_{2}$ and TiN(60nm/Si) substrates. A1 films were deposited with the pyrolysis of dimethylethylamine alane(DMEAA). When A1 was deposited on Ti& substrate without carrier gas, Al deposition rate increased with H\ulcorner pre- treatment. The $H_2$ gas enhances the CVD reaction at the substrate surface. When Al was deposited on $SiO_{2}$ substrate, $H_2$ plasma pretreatment reduced Al incubation time and made a dense Al film compared with Ar plasma pre- treatment or no pretreatment.

• Proceedings of the Optical Society of Korea Conference
• /
• 2000.08a
• /
• pp.172-173
• /
• 2000

TiN 박막은 부착력이 좋은 기계적 성질을 갖고 있으며 화학적 안정성이 뛰어난 장점을 갖고 있어 수명이 긴 박막으로 사용 할 수 있다. 또한 반도체 집적 회로소자에서는 Al과 Si 사이의 확산 방지막으로 널리 사용하고 있으며, 티타늄과 질소의 화학 조성비를 적절히 조절하여 노란 금빛을 띠는 TiN 박막을 시계나 장신구 등의 표면에 코팅하여 장식에도 많이 사용하고 있다$^{[1]}$ . 최근에는 얇은 전도성 TiN 박막을 사용하여 무반사 영역을 넓히고, 무정전 효과를 지니며, TiN 박막의 두께를 변화시켜 투과율을 조절하여 명도대비(contrast)를 향상시킬 수 있는 2층 무반사 무정전 박막을 연구하고 있다.$^{[2]}$ 여기서는 티타늄과 질소의 원소조성비에 따른 TiN 박막의 복소수 굴절률의 분산이 단 2층으로 넓은 가시광선 영역에서 무반사 효과를 가질 수 있도록 TiN 박막을 증착해야 한다. (중략)