• Korean Journal of Materials Research
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• v.7 no.2
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• pp.145-151
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• 1997

Remelting of $A-Si/SiC_{p}$ composites followed by isothermal holding and solidification, leads ro the settling of Sic particles to the bottom of the mold. With the isothermal holding time for molten $A-Si/SiC_{p}$ composites. the particle free zone increases rapidly up to approximately first 30 minutes of the holding time. Experimental resulls of the particle settling confirm that the larger SIC particles sink faster tlun the sniiller particles. An increase in volume fraction of Sic particles decreases the setrling velocity of the particles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.13-16
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• 2009

In this study, AlN thin films were deposited on a polycrystalline (poly) 3C-SiC buffer layer for surface acoustic wave (SAW) applications using a pulsed reactive magnetron sputtering system. AFM, XRD and FT-IR were used to analyze structural properties and preferred orientation of the AlN/3C-SiC thin film. Suitability of the film in SAW applications was investigated by comparing the SAW characteristics of an interdigital transducer (IDT)/AlN/3C-SiC structure with the IDT/AIN/Si structure at 160 MHz in the temperature range $30-150^{\circ}C$. These experimental results showed that AlN films on the poly 3C-SiC layer were highly (002) oriented. Furthermore, the film showed improved temperature stability for the SAW device, $TCF\;=\;-18\;ppm//^{\circ}C$. The change in resonance frequency according to temperature was nearly linear. The insertion loss decrease was about $0.033dB/^{\circ}C$. However, some defects existed in the film, which caused a slight reduction in SAW velocity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.4
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• pp.425-431
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• 2007

[ $Al_2O_3/SiC$ ]composite ceramics were sintered to evaluate the bending strength and elastic wave characteristics. The three-point bending test was carried out under room temperature. The elastic wave was detected by fracture wave detector. The crack healing behavior was investigated from 1373 K to 1723 K. The bending strength of $Al_2O_3/SiC$ composite by nanocomposite is higher than that of $Al_2O_3$ monolithic. Crack-healing behavior depended on an amount of additive powder $Y_2O_3$. In $Al_2O_3/SiC$ composite ceramics with 3 wt. % $Y_2O_3$ for additive powder, the bending strength at 1573 K is about 100% increase than that of the smooth specimens. From the result of wavelet analysis of elastic wave signal, the smooth specimen and heat treated specimen of $Al_2O_3$ monolithic and $Al_2O_3/SiC$ composite ceramics showed characteristics of frequency about 58 kHz. The strength of $Al_2O_3/SiC$ composite ceramics was a little higher than those of $Al_2O_3$ monolithic. The dominant frequencies were high with increasing of $Y_2O_3$ for additive powder. The dominant frequencies had direct connection with the bending strength.

• Journal of Powder Materials
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• v.14 no.6
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• pp.354-361
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• 2007

The bi-materials with Al-Mg alloy and its composites reinforced with SiC and $Al_2O_3$ particles were prepared by conventional powder metallurgy method. The A1-5 wt%Mg and composite mixtures were compacted under $150{\sim}450\;MPa$, and then the mixtures compacted under 400 MPa were sintered at $773{\sim}1173K$ for 5h. The obtained bi-materials with Al-Mg/SiCp composite showed the higher relative density than those with $Al-Mg/Al_2O_3$ composite after compaction and sintering. Based on the results, the bi-materials compacted under 400 MPa and sintered at 873K for 5h were used for mechanical tests. In the composite side of bi-materials, the SiC particles were densely distributed compared to the $Al_2O_3$ particles. The bi-materials with Al-Mg/SiC composite showed the higher micro-hardness than those with $Al-Mg/Al_2O_3$ composite. The mechanical properties were evaluated by the compressive test. The bi-materials revealed almost the same value of 0.2% proof stress with Al-Mg alloy. Their compressive strength was lower than that of Al-Mg alloy. Moreover, impact absorbed energy of bi-materials was smaller than that of composite. However, the bi-materials with Al-Mg/SiCp composite particularly showed almost similar impact absorbed energy to $Al-Mg/Al_2O_3$ composite. From the observation of microstructure, it was deduced that the bi-materials was preferentially fractured through micro-interface between matrix and composite in the vicinity of macro-interface.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.847-849
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• 1998

The effect of $Al_{2}O_{3}$ additives on the microstructure, mechanical and electrical properties of ${\beta}$-SiC+39vol.%$ZrB_2$ electroconductive ceramic composites by pressureless sintering were investigated. The ${\beta}$-SiC+39vol.%$ZrB_2$ ceramic composites were pressureless sintered by adding 4, 8, 12wt.% $Al_{2}O_{3}$ powder as a liquid forming additives at $1950^{\circ}C$ for 1h. Phase analysis of composites by XRD revealed mostly of $\alpha$-SiC(6H), $ZrB_2$ and weakly $\alpha$-SiC(4H), $\beta$-SiC(15R) phase. The relative density of composites was lowered by gaseous products of the result of reaction between $\beta$-SiC and $Al_{2}O_{3}$ therefore, porosity was increased with increased $Al_{2}O_{3}$ contents. The fracture toughness of composites was decreased with increased $Al_{2}O_{3}$ contents, and showed the maximum value of $1.4197MPa{\cdot}m^{1/2}$ for composite added with 4wt.% $Al_{2}O_{3}$ additives. The electrical resistivity of ${\beta}$-SiC+39vol.%$ZrB_2$ electroconductive ceramic composite was increased with increased $Al_{2}O_{3}$ contents, and showed positive temperature coefficient resistance (PTCR) in the temperature from $25^{\circ}C$ to $700^{\circ}C$.

• Journal of Powder Materials
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• v.8 no.3
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• pp.179-185
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• 2001

Through the observation of wear scar of two ceramic materials, microstructural wear mechanisms was investigated. As for the $Al_2O_3$-5 vol% SiC nanocomposite, the grain boundary fracture was suppressed by the presence of SiC nano-particles. The intragranular SiC particles have inhibited the extension of plastic deformation through the whole grain. Part of plastic deformation was accommodated around SiC particles, which made a cavity at the interface between SiC and matrix alumina. On the other hand, gas-pressure sintered silicon nitride showed extensive grain boundary fracture due to the thermal fatigue. The lamination of wear scar was initiated by the dissolution of grain boundary phase. These two extreme cases showed the importance of microstructures in wear behavior.

• Korean Journal of Materials Research
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• v.27 no.10
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• pp.544-551
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• 2017

In order to develop a new commercial Al-12%Si casting alloy with improved physical properties, we investigated the effect of adding Sr and TiB to the alloy. Al-12%Si alloys were prepared by die casting at $660^{\circ}C$. The eutectic temperature of the Sr-modified Al-12%Si alloy decreased to $9^{\circ}C$ and the mushy zone region increased. The shape of the Si phase changed from coarse acicula to fine fiber with the addition of Sr. The addition of TiB in the Al-12%Si alloy reduced the size of the primary ${\alpha}$-Al and eutectic Si phases. When Sr and TiB were added together, it worked more effectively in refinement and modification. The density of twins in the Si phase-doped Sr increased and the width of the twins was refined to 5 nm. These results are related to the impurity induced twinning(IIT) growth.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.2
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• pp.475-485
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• 1995

In this study, statistical analysis of fatigue data which had obtained from respective 24 fatigue crack, was examined for SiC whisker reinforced aluminium 6061 composite alloy (SiC$_{w}$/A16061) and aluminium 6061 alloy. SiC volume fraction in composite alloy is 25%. The analysis results stress intensity factor range and 0.1 mm fatigue crack initiation life for SiC$_{w}$/A16061 composite & A16061 matrix are the log-normal distribution. And regression analysis by linear model, exponential model and multiplicative model were performed to find out the relationship between fatigue crack growth rate(da/dN) and stress intensity for find out the relationship between fatigue crack growth rate(da/dN) and stress intensity factor range(.DELTA.K) in the SiC$_{w}$/A16061 composite and examine the applicability of Paris' equation to SiC$_{w}$A16061 composite. Also computer simulation was performed for fatigue life prediction of SiC$_{w}$/A16061 composite using the statistical results of this study.udy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.111-114
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• 2000

Growth characteristics and microstructure of AlN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.48-49
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• 1995

전자소자의 축소화에 따라 electromigration은 점차 반도체 디바이스의 주요 결함 원 인으로 부각되고 있다. 본 실험은 현재 배선 재료로 널리 사용되고 있는 Al-1%Si 금속박막 배선의 electromigration에 대한 온도 및 배선길이 의존성에 관하여 연구하였다. ppLCC(pplastic Leaded Chipp Carrier) ppackage된 ppSG(8000$\AA$)/SiO2(1000$\AA$)/Al-1%Si(7000 $\AA$)/SiO2(5000$\AA$)/pp-typpe Si(100)의 보호막처리된 시편과 Al-1%Si/SiO2(5000$\AA$)/pp-typpe Si(100)의 보호막처리되지 않은 시편등을 standard pphotolithograpphy 공정을 이용하여 각각 제작하였다. 선폭 3$mu extrm{m}$, 길이 100, 400, 800, 1600$\mu\textrm{m}$의 등의 Al-1%Si 박막배선구조를 사용하 였다. 가속화실험을 위해 인가된 D.C 전류밀도는 4.5$\times$106A/cm2이었고 실온에서 10$0^{\circ}C$까지 의 분위기 온도에서 electromigration를 실행하였다. 박막배선길이에 따른 MTF(Mean Time-to-Failure)는 임계길이 이상에서 포화되는 경향을 보이며 임계길이는 Al-1%Si 박막 배선에서 분위기온도에 따라 길이 400$\mu\textrm{m}$과 800$\mu\textrm{m}$범위에서 나타났다. 각 시편에서 electromigration에 대한 활성화에너지도 MTF의 특성과 유사하게 임계길이 이상에서 포화 되는 특성을 타나내었다.