• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.436-444
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• 2010

The hot tear susceptibility of Al alloys was investigated by using a constrained-rod mold designed to quantify 8 types of tear tendency. The severity of the crack was scored by 5 grades on a scale of 0 to 4, with 0 being "no crack formed" and 4 being "complete separation by crack". The Hot Tear Susceptibility index (HTS) which consists of crack type scores and position scores, was proposed to compare the hot tear tendency of Al alloys. A356.0 cast alloy and AA6061 wrought Al alloy showed an HTS value of 27.5 and 53 respectively. The effects of Si, Cu, and Mg content on hot tear tendency were also investigated with a constrained-rod mold. The variation of HTS values with alloying elements represents similar behavior in the variation of the solidification range in a pseudo binary phase diagram.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.744-746
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• 2008

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10 nm to 50 nm, we have obtained that the optimum CuPc layer thickness is around 40 nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$Cu_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• Journal of Korean Society for Atmospheric Environment
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• v.13 no.4
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• pp.307-317
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• 1997

Samples of fine particle $(d_P<2.5 \mum)$ were taken in Chongju area using a dichotomous sampler. The data set was collected on fifty-eight different days with 24 hour sampling period from October 27, 1995 through August 25, 1996. The samples were analyzed using a proton induced x-ray emission (PIXE) for Na, Mg, Al, Si, S, Cl, K, Ca, Ti, V, Cr, M, Fe, Ni, Cu, Zn, Br and Pb. Values of Fe, Ca, Si, Cu, K and Cl exhibit marked seasonal variations. Mean concentrations for this study had the following order S > Cl > Si > K > Al > Fe on fine particle. Concentrations of Ca, Si and Fe were higher during the spring season compared with any other season. These phenomena may be attributable to soil dust. Cl and K were higher in the winter, which may be explained by combustion of fossil fuel. Higher values for Cu and Zn in the Winter may be due to the combustion and incineration.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.176-179
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• 2005

Spray casting of hypereutectic Al-Si based alloy has been reported to provide distinct advantages over ingot metallurgy (IM) or rapid solidification/powder metallurgy (RS/PM) process in terms of microstructure refinement. Hypereutectic Al-Si based alloys have been regarded attractive for automotive and aerospace application, due to high specific strength, good wear resistance, low coefficient of thermal expansion, high thermal stability, and good creep resistance. In this study, hypereutectic Al-25Si-2.0Cu-1.0Mg alloy was prepared by OSPREY spray casting process. High temperature deformation behavior of the hypereutectic Al-Si based alloy has been investigated by applying the internal variable theory proposed by Chang et al. The change of strain rate sensitivity and Creep transition were analyzed by using the load relaxation test and constant creep test.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.612-614
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• 2008

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10nm to 50nm, we have obtained that the optimum CuPc layer thickness is around 40nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$C_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.360-367
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• 1995

Effects of metal coating treatment on SiC particle on wetting behavior and interfacial strength were studied. Experimental variables are included types of coated metallic films such as Cu and Ni-P, and temperatures of heat-treatment under vacuum. The experimental results concerning wetting phenomena of liquid Al on SiC, showed that coating treatment of metallic film on SiC particles remarkably improves the wetting behavior of liquid Al on SiC, especially in the case of Ni-P coating. The interfacial strength of Al/SiC composites made of coated SiC plate was higher than that of the composite with non-coated SiC plate although the coating treatment was not perfect.

• Journal of the Korean Ceramic Society
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• v.33 no.12
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.179-184
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• 1989

This study seeks to the morphological changes in the oxide skin of the Al-10wt.%si alloy melts. These changes depend on the oxidation time and the temperature of the molten alloy, as well as the effects of adding Mg, Cu and Ni. Thess affects observed by X-ray diffractometer(XRD) and scanning electron microscope(SEM)' Very litte oxide skins on Al-10wtwt.%Si alloy melts can be detected by XRD because it is less than the measuring capabillity of the XRD, or the formation of noncrystalline oxide skins oxide skins canbe deteced by SEM. The addition of 1%Mg and 1%Cu-1%Mg-2.5%Ni to this base alloy crystallized the structure of the oxide skins and increased the oxidation in proportion to the length of time, but adding 3% had hardiy anyaffect at all on the crystal structure of the oxide skins.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.535-536
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• 2005

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10 nm to 50 nm, we have obtained that the optimum CuPc layer thickness is around 40 nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$C_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• Journal of the Korean Society for Heat Treatment
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• v.7 no.4
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• pp.244-252
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• 1994

The morphological changes of primary solid particles as a fuction of process time on Al-Si alloys during semi-solid state processing with a shear rate of 200s were studied. In hypereutectic Al-15.5wt%Si alloy, it was observed that primary Si crystals are fragmented in the early stage of stirring and morphologies of primary Si crystals change from faceted to spherical during isothermal shearing for 60 minutes. In quaternary Al-12.5wt%Si-2.9wt%Cu-0.7wt%Mg alloy system, it was observed both primary silicon and ${\alpha}$-alumunum particles. Microstructural evolution of primary Si crystals was similar to that of the hypereutectic Al-Si alloy but equiaxed ${\alpha}$-Al dendrites are broken into nearly spherical at the early stage of shearing and later stage of the isothermal shearing ${\alpha}$- Al particles are slightly coarsoned by Ostwald ripening. Mechanical properties of Al-Si-Cu-Mg alloy were compared to those from other processes (squeeze casting and gravity casting). After T6 heat treatment, comparable values of hardness were obtained while slightly lower compressive strength values were observed in rheocast alloy. The elongation, on the other hand, exhibited significant increasement of 15% over gravity cast alloy.