• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.128-131
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• 2009

Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used Monte-Carlo method. We simulated the effect of channeling by Al implantation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the effect of varying the implantation energies and the corresponding doses on the distribution of Al in 4H-SiC. The controlled implantation energies were 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2{\times}10^{14}$ to $1{\times}10^{15}\;cm^{-2}$. The Al ion distribution was deeper with increasing implantation energy, whereas the doping level increased with increasing dose. The effect of post-implantation annealing on the electrical properties of Al-implanted p-n junction diode were also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.131-131
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• 2008

Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used a Monte-Carlo method. We studied the effect of channeling by Al implantation simulation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the Al distribution in 4H-SiC through the variation of the implantation energies and the corresponding ratio of the doses. The implantation energies controlled 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2\times10^{14}$ to $1\times10^{15}cm^{-2}$. In the simulation results, the Al ion distribution was deeper as increasing implantation energy and the doping level increased as increasing implantation doses. After the post-implantation annealing, the electrical properties of Al-implanted p-n junction diode were investigated by SILV ACO ATLAS numerical simulator.

• Journal of the Korean institute of surface engineering
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• v.39 no.5
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• pp.235-239
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• 2006

The aluminum nitride(AlN) layer on Al7075 substrate has been formed through nitrogen ion implantation process. The implantation process was performed under the conditions : 100 keV energy, total ion dose up to $2{\times}10^{18}\;ions/cm^2$. XRD analysis showed that aluminum nitride layers were formed by nitrogen implantation. The formation of Aluminum nitride enhanced surface hardness up to 265HK(0.02 N) from 150HK(0.02 N) for the unimplanted specimen. Micro-Knoop hardness test showed that wear resistance was improved about 2 times for nitrogen implanted specimens above $5\;{\times}\;10^{17}\;ions/cm^2$. The friction coefficient was measured by Ball-on-disc type wear tester and was decreased to 1/3 with increasing total nitrogen ion dose up to $1\;{\times}\;10^{18}ions/cm^2$. The enhancement of mechanical properties was observed to be closely associated with AlN formation. AES analysis showed that the maximum concentration of nitrogen increased as ion dose increased until $5\;{\times}\;10^{17}\;ions/cm^2$.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.8
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• pp.1178-1184
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• 2008

In this study, techniques of ion implantation were used in order to improve the characteristics of metal materials such as the oxidation and wear resistant. In particular it is necessary to develope their oxidation and wear resistant that could be used in severe environmental conditions. There are mainly two elementary technologies including ion implantation and/or thin film coating. Ion implantation method was performed for surface modification. As a result, it was found that some ion implantations methods such as Nb, high-temperature Nb ion implantation and Nb+C combined implantation are somewhat effective for improving the oxidation resistance of TiAl alloy. Furthermore, the fluorine PBII treatment is more effective for improving the oxidation resistance of the TiAl alloy with three-dimensional shapes. The implantation of boron ion into thin film of TiN was also effective for improving the properties of materials like high temperature wear resistance. TiCrN film was applied to the actual seal ring for steam turbines, and it was observed that its sliding property showed a successfully good performance.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.4
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• pp.307-317
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• 1994

The surf ace microstructure modification by $N^+$ ion implantation into 7050Al alloy and its low cycle fatigue behavior were investigated. Ion implantation method is to physically implant accelerated ions to the surface of a substrate. High dose of nitrogen($5{\times}10^{17}ions/cm^2$) were implanted into 7050Al alloy using current density of accellerating voltage of 100KeV. The implanted layers were characterized by Electron Probe-Micro Analysis(EPMA), Auger Elecron Spectroscopy(AES), X-Ray Diffraction(XRD), X-Ray Photoelectron Spectroscopy(XPS), and Transmission Electron Microscopy(TEM). The experimental results were compared with computer simulation data. It was shown that AlN was formed to 4500 ${\AA}$ deep. The low cycle fatigue life of the $N^4$ion modified material was prolonged by about three times the unimplanted one. The improved low cycle fatigue life was attributed to the formation of AlN and the damaged region on the surface by $N^+$ ion implantation.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1069-1071
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• 1995

The electrical properties of Al/TiN/Ti contact are investigated at submicron contacts. The contact resistance and contact leakage current are dependent on metallization, surface dopant concentration, semiconductor surface treatment and contact plug ion implantation. In this paper, the contact resistance and contact leakage current are studied according to surface dopant concentration, semiconductor surface treatment and contact plug ion implantation at 0.8 micron contact. The contact resistance and contact leakage current increases with increasing substrate ion concentration. HF cleaning represents high contact resistance but low contact leakage current while CDE cleaning represents low contact resistance but high contact leakage current. Contact plug ion implantation decreases contact resistance but increases contact leakage current. Specially, RTA represents good electrical properties.

• Journal of the Korean Ceramic Society
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• v.34 no.8
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• pp.834-842
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• 1997

Controlled Ca impurity implanted inner crack-like pore in the high purity alumina single crystal, sapphire, had been created by micro-fabrication technique, which includes ion implantation, photo-lithography, Ar ion milling, and hot press technique. The morphological change and the healing of cracklike pore in Ca doped high purity single crystal alumina, sapphire, during high temperature heat treatment in vacuum were observed using optical microscopy. The dot-like surface roughening was developed and hexagon like crystal appeared on inner surface of crack-like pore after heat treatment. Bar type crystals, probably CaO.6Al2O3, were observed on the inner surface after 1 hour heat treatment at 1, 50$0^{\circ}C$, but this bar type crystal disappeared after 1 hour heat treatment at 1, $600^{\circ}C$. This disappearance means that there should be a little increase of Ca solubility limit to alumina at this temperatures.

• The Journal of the Korean dental association
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• v.55 no.10
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• pp.716-724
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• 2017

Past literatures stressed that when a gap occurred between smooth surface implant and alveolar bone, osseointegration was unsatisfactory at histologic examination regardless of clinical findings. Accordingly, standard surgical approach in the early days of implant surgery was to place the implant after all gap was healed. However, Botticelli et al.(2004) reported high degree of osseointegration at the gap with SLA surface implant. From then, the era of immediate implantation has begun because SLA surface implant make gap healing possible. There are two main disadvantages of immediate implantation: (1) surgical technique is sensitive for primary implant stability, (2) Implant placement at the accurate position that predicts external change of extraction wound is required. Immediate implantation has outstanding advantages in all perspectives except for the above-mentioned disadvantages. Therefore, it would be unwise to abandon the option of immediate implantation simply due to surgical difficulties. The purpose of this paper is to describe the necessity of immediate implantation and to present scientific evidence for immediate implantation and accurate implant position by literature review.

• Analytical Science and Technology
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• v.7 no.4
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• pp.527-540
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• 1994

The surface microstructure modification by $N^+ion$ implantation into 7050A1 alloy was investigated. Ion implantation method is to implant physically accelerated ions to the surface of a substrate. High doses of nitrogen($5{\times}10^{15}ions/cm^2$, $5{\times}10^{17}ions/cm^2$, $8{\times}10^{17}ions/cm^2$) were implanted into 7050A1 alloy using accelerating voltage of 100KeV and current density of $23.1{\mu}A/cm^2$. The implanted layers were characterized by EPMA, AES, XRD, and TEM. The experimental results were compared with computer simulation data. The results showed that AlN was formed from the surface to $4000{\AA}$ depth with Gaussian distribution and the damage region was also observed. This surface modification by $N^+ion$ implantation increased the microhardness of 7050A1 alloy surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.33-33
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• 1999