• Title/Summary/Keyword: Al and Cu

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Optical Properties of Undoped and Co-doped $CuAlGeSe_4;Co^{2+}$ Crystals ($CuAlGeSe_4$$CuAlGeSe_4;Co^{2+}$ 결정의 광학적 특성)

  • 신동운;오석균;김미양;현승철;김화택;김용근
    • Journal of the Korean Vacuum Society
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    • v.3 no.2
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    • pp.227-233
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    • 1994
  • CuAlGeSe4 및 CuAlGeSe4 ; Co2+ 결정을 고순도의 성분원소로부터 합성하고 서냉법으로 결정을 성장시켰다. 이들결정은 chalcopyrite 결정구조를 갖고 있으며 직접전이형 energy gap 구조를 갖고 286K에서 energy gap은 CuAlGeSe4 결정의 경우는 2.394eV이며 CuAlGeSe4 ; Co2+ 결정의 경우는 2.302 eV로 주어졌다. CuAlGeSe4 : Co2+ 결정에서 cobalt에 의한 불순물 광흡수 peak들은 12243, 7002, 3890 cm-1에서 나타났으며 이 peak들은 CuAlGeSe4 : Co2+ 결정의 Td symmetry site에 위치한 Co2+ ion의 energy 준위사이의 전자전이에 의한 optical absorption임을 규명했다.

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Two-step Solution Treatment for Enhancement of Mechanical Properties of AlSiCu Aluminum Alloy (Al6Si2Cu 알루미늄 합금의 기계적 물성 향상을 위한 이단계 고용화 열처리)

  • Park, Sang-Gyu;Kim, Chung-Seok
    • Journal of the Korean Society for Heat Treatment
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    • v.31 no.3
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    • pp.97-103
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    • 2018
  • The objective of this study is to develop the mechanical properties of AlSiCu aluminum alloy by the two-step solution heat treatment. The microstructure of gravity casting specimen represents a typical dendrite structure having a secondary dendrite arm spacing (SDAS) of 40 mm. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases are generated. The eutectic Si phases are fragmented and globularized with solution heat treatment. Also, the $Al_2Cu$ intermetallic phase is resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ might be a optimum condition for enhancement of mechanical properties of AlSiCu aluminum alloy.

Optical properties and Growth of CuAlSe$_2$ Single Crystal Thin Film by Hot Wal1 Epitaxy (Hot Wall Epitaxy(HWE)법에 의한 $CuAlSe_2$ 단결정 박막 성장과 점결함 특성)

  • Hong, Kwang-Joon;Yoo, Sang-Ha
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.76-77
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    • 2005
  • Single crystal $CuAlSe_2$ layers were grown on thoroughly etched semi-insulating GaAs(100) substrate at 410$^{\circ}C$ with hot wall epitaxy (HWE) system by evaporating $CuAlSe_2$ source at $680^{\circ}C$. The crystalline structure of the single crystal thin films was investigated by the photoluminescence(PL) and double crystal X-ray diffraction (DCXO). The temperature dependence of the energy band gap of the $CuAlSe_2$ obtained from the absorpt ion spectra was wel1 described by the Varshni's relation, $E_g$(T) = 2.8382 eV - ($8.86\times10^{-4}$ eV/H)$T_2$/(T + 155K). After the as-grown single crystal $CuAlSe_2$ thin films were annealed in Cu-, Se-, and Al-atmospheres, the origin of point defects of single crystal $CuAlSe_2$ thin films has been investigated by PL at 10 K. The native defects of $V_{cd}$, $V_{se}$, $Cd_{int}$, and $Se_{int}$ obtained by PL measurements were classified as donors or acceptors. And we concluded that the heat-treatment in the Cu-atmosphere converted single crystal $CuAlSe_2$ thin films to an optical n-type. Also. we confirmed that hi in $CuAlSe_2$/GaAs did not form the native defects because Al in single crystal $CuAlSe_2$ thin films existed in the form of stable bonds.

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Nanocrystallization Behavior of Al-Y-Ni with Cu Additions (Cu 첨가에 따른 Al-Y-Ni의 나노결정화 거동)

  • 홍순직;천병선;강세선;이임렬
    • Journal of Powder Materials
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    • v.9 no.1
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    • pp.19-24
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    • 2002
  • This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.

Synthesis of Cu/Al2O3 Nanostructured Composite Powders for Electrode Application by Thermochemical Process (열화학적 방법에 의한 전극용 나노 Cu/Al2O3 복합분말 합성)

  • 이동원;배정현;김병기
    • Journal of Powder Materials
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    • v.10 no.5
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    • pp.337-343
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    • 2003
  • Nanostructured Cu-$Al_2O_3$ composite powders were synthesized by thermochemical process. The synthesis procedures are 1) preparation of precursor powder by spray drying of solution made from water-soluble copper and aluminum nitrates, 2) air heat treatments to evaporate volatile components in the precursor powder and synthesis of nano-structured CuO + $Al_2O_3$, and 3) CuO reduction by hydrogen into pure Cu. The suggested procedures stimulated the formation of the gamma-$Al_2O_3$, and different alumina formation behaviors appeared with various heat treating temperatures. The mean particle size of the final Cu/$Al_2O_3$ composite powders produced was 20 nm, and the electrical conductivity and hardness in the hot-extruded bulk were competitive with Cu/$Al_2O_3$ composite by the conventional internal oxidation process.

Crystallization and Magnetic Properties of Non-Equilibrium Al(Fe-Cu) Alloy Powders Produced by Rod Milling and Chemical Leaching (Rod Milling과 Chemical Leaching에 의해 제작된 비평형 Al(Fe-Cu) 합금 분말의 결정화 및 자기적 특성)

  • Kim Hyun-Goo
    • Journal of Powder Materials
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    • v.11 no.6 s.47
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    • pp.486-492
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    • 2004
  • We report the crystallization and magnetic properties of non-equilibrium $Al_{0.6}(Fe_{x}Cu_{1-x})_{0.4}(x=0.25, 0.50, 0.75)$ alloy powders produced by rod-milling as well as by new chemical leaching. X-ray diffractometry, transmission electron microscopy, differential scanning calorimetry and vibrating sample magnetometry were used to characterize the as-milled and leached specimens. After 400 h or 500 h milling, only the broad peaks of nano bcc crystalline phases were detected in the XRD patterns. The crystallite size, the peak and the crystallization temperatures increased with increasing Fe. After being annealed at $600{^\circ}C$ for 1 h for as-milled alloy powders, the peaks of bcc $AlCu_{4}\;and\;Al_{13}Cu_{4}Fe_{3}\;for\;x=0.25,\;bcc\;AlCu_{4}\;and\;Al_{5}Fe_{2}\;for\;x=0.50,\;and\;Al_{5}Fe_{2},\;and\;Al_{0.5}Fe_{0.5}\;for\;x=0.75$ are observed. After being annealed at $500{^\circ}\;and\;600{^\circ}C$for 1 h for leached specimens, these non-equi-librium phases transformed into fcc Cu and $CuFe_{2}O_{4}$phases for the x=0.25 specimen, and into bcc ${\alpha}-Fe,\;fcc\;Cu,\;and\;CuFe_{2}O_{4}$ phases for both the x=0.50 and the x=0.75 specimens. The saturation magnetization decreased with increasing milling time for $Al_{0.6}(Fe_{x}Cu_{1-x})_{0.4}$ alloy powders. On cooling the leached specimens from $800{\~}850^{\circ}C$,\;the magnetization first sharply increase at about $491.4{\circ}C,\;745{\circ}C,\;and\;750.0{\circ}C$ for x=0.25, x=0.50, and x=0.75 specimens, repectively.

A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules (자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구)

  • Yu, Dong-Yurl;Ko, Yong-Ho;Bang, Junghwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.33 no.3
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    • pp.19-24
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    • 2015
  • Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

Effects of Alloying Elements on the Microstructure and Tensile Properties of Rapidly Solidified Al-Mg Alloys (급속응고한 Al-Mg 합금의 미세조직 및 인장특성에 미치는 첨가원소의 영향)

  • Park, Hyun-Ho;Park, Chong-Sung;Kim, Myung-Ho
    • Journal of Korea Foundry Society
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    • v.17 no.4
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    • pp.356-364
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    • 1997
  • In order to study effects of Cu and Be on the microstructure and tensile properties of rapidly solidified Al-Mg alloys, Al-Mg-Cu-Be alloys have been rapidly solidified by inert gas atomization process. Microstructure of rapidly solidified Al-Mg-Cu-Be powders exhibited refinement and good dispersion of Be particles as increasing of solidification rate. Solidification rate of atomized powders was estimated to be about $5{\times}10^{3{\circ}}C/s$. Inert gas atomized Al-Mg-Cu-Be powders were hot-processed by vacuum hot pressing at $450^{\circ}C$ under 100 MPa and hot extruded with reduction ratio in area of 25: 1 at $450^{\circ}C$. The extruded Al-Mg-Cu-Be powders consisted of recrystallized fine Al grains and homogeneously dispersed fine Be particles, and exhibited improved tensile properties with increase in Cu content. $Al_2CuMg$ compounds precipitated in grain and grain boundaries of Al-Mg-Cu-Be alloys with aging heat treatment after solution treatment. Hardness and tensile properties were improved by increasing Cu content and Be addition. Compared with extruded Al-Mg-Cu powders, the extruded Al-Mg-Cu-Be powders exhibited finer recrystallized grains and improved tensile properties by dispersion hardening of Be and subgrain boundaries pinned by fine Be particles. After aging treatment, hardness and tensile properties were improved due to restricted precipitation by increasing of dislocation density around Be particles in matrix.

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Effects of Zn Amounts on the Castability and Tensile Properties of Al-Zn-Mg-Cu Alloys for Die Casting (Al-Zn-Mg-Cu 다이캐스팅용 합금의 주조성 및 인장특성에 미치는 Zn 첨가량의 영향)

  • Kim, Ki-Tae;Yang, Jae-Hak;Lim, Young-Suk
    • Journal of Korea Foundry Society
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    • v.30 no.4
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    • pp.137-141
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    • 2010
  • The effects of Zn amounts on the castability and tensile properties of Al-Zn-Mg-Cu alloys were investigated for development of high strength die casting aluminium alloys. Al-Zn-Mg-Cu alloys with 3.5% Zn showed high cast cracking tendency and poor mold filling behaviour. Al-Zn-Mg-Cu alloys with 5wt% Zn and 7wt% Zn had the tensile strengths of 300~400MPa and the elongations of 2~18%. The effect of Zn on the tensile strength of Al-Zn-Mg-Cu alloys was insignificant, but Al-Zn-Mg-Cu alloy with high Zn amount had lower elongation.