Thermomechanical Analysis of Functionally Gradient $Al-SiC_p$ Composite for Electronic Packaging
(전자패키지용 경사조성 $Al-SiC_p$ 복합재료의 열.기계적 변형특성 해석)
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- Composites Research
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- v.13 no.6
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- pp.23-29
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- 2000