• Title/Summary/Keyword: Al) thin film

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Growth and Photocurrent Properties for $CuAlSe_2$ Single Crystal Thin film ($CuAlSe_2$ 단결정 박막의 성장과 광전류 특성)

  • Hong, Kwang-Joon;Baek, Seong-Nam
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.226-229
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    • 2004
  • A stoichiometric mixture of evaporating materials for $CuAlSe_2$ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films, $CuAlSe_2$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the hot wall epitaxy (HWE) system. The source and substrate temperatures were $680^{\circ}C$ and $410^{\circ}C$, respectively. The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). The carrier density and mobility of $CuAlSe_2$ single crystal thin films measured with Hall effect by van der Pauw method are $9.24{\times}10^{16}\;cm^{-3}$ and $295\;cm^2/V{\cdot}s$ at 293 K, respectively. The temperature dependence of the energy band gap of the $CuAlSe_2$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)\;=\;2.8382\;eV\;-\;(8.68{\times}10^{-4}\;eV/K)T^2/(T+155K)$. The crystal field and the spin-orbit splitting energies for the valence band of the $CuAlSe_2$ have been estimated to be 0.2026 eV and 0.2165 eV at 10K, respectively, by means of the photocurrent spectra and the Hopfield quasicubic model. These results indicate that the splitting of the ${\Delta}so$ definitely exists in the ${\Gamma}_5$ states of the valence band of the $CuAlSe_2$. The three photocurrent peaks observed at 10K are ascribed to the $A_1-$, $B_1-$, and $C_1$-exciton peaks for n = 1.

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Prototype Electromagnetic-Noise Filters Incorporated with Nano-Granular Co41Fe38Al13O8 Soft Ferromagnetic Thin Films on Coplanar Transmission Lines

  • Sohn, Jae-Cheon;Byun, Dong-Jin
    • Journal of the Korean Ceramic Society
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    • v.43 no.2 s.285
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    • pp.74-78
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    • 2006
  • A non-integrated type noise filter on a Coplanar Waveguide (CPW) transmission line is demonstrated by using a highly resistive $Co_{41}Fe_{38}Al_{13}O_8$ nanogranular thin film with the dimensions of $4\;mm (\iota)\times4\;mm(\omega)\times0.1\;{\mu}m(t)$. The noise suppression characteristics are evaluated without placing an insulating layer between the CPW line and the magnetic thin film. The insertion loss is very low being less than 0.3 dB and this low value is maintained up to 2 GHz. At a ferromagnetic resonance frequency of 3.3 GHz, the power loss is very large and the degree of noise attenuation is measured to be 3 dB. This level of noise attenuation is still small for real applications; however, considering the small magnetic volume used in this work, further improvement is expected by simply increasing the magnetic volume and by integrating the magnetic thin film into the CPW transmission line.

New Approaches for Overcoming Current Issues of Plasma Sputtering Process During Organic-electronics Device Fabrication: Plasma Damage Free and Room Temperature Process for High Quality Metal Oxide Thin Film

  • Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.100-101
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    • 2012
  • The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

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Light Sensing Characteristics of $BaAl_2O_4$ thin film by RF magnetron sputtering (RF 마그네트론 스퍼터링에 의한 $BaAl_2O_4$:Eu 박막의 광센싱 특성)

  • Kim, Sei-Ki;Kang, Jung-Woo;Kwak, Chang-Gon;Ji, Mi-Jung;Choi, Byung-Hyun;Kim, Young-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.54-54
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    • 2008
  • $Eu^{2+}$, $Nd^{3+}$ co-doped $BaAl_2O_4$ are known as a long afterglow phosphor. We found that $Eu^{2+}$-doped $BaAl_2O_4$ showed ptotoconductivity in the range of UV and visual light. In this study, $BaAl_2O_4$:Eu thin film has been prepared by RF sputtering method and a sensing characteristics to UV and visual light was performed. Only $Eu^{2+}$ and $Nd^{3+}$ co-doped $BaAl_2O_4$ powders and targets for deposition were prepared by a convention solid state method, and the deposition was performed in a reducing $H_2$-Ar mixture gas on Si substrates. The observation of crystalline phase and morphology of the sputtered film were performed using XRD, EDX. The photoluminescence and photocurrent to UV and visual light were measured simultaneously using 300W-Xe solar simulator as a light source. It was confirmed that the photocurrent induced by irradiation of light showed a linear relationship to the light intensity.

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-Physical Properties of Metal Thin Film-(Changes of Structure with Evaporation Rates) (금속박막의 물리적 성질(I)(증착속도에 따르는 구조변화))

  • 백수현;조현춘
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.24 no.6
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    • pp.980-985
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    • 1987
  • The thin metal films of Cr, Al, Mn and were made in various evaporation rates with 100\ulcornerthickness under 2x10**-9 bar vacuum level. We analized and discussed the relationships between changes of structure, morphology and sheet resistance, light transmittance for the corresponding evaporation rates. As the evaporation rates were decreased at higher rates, grain sizes of all film were decreased, however both of the sheet resistance and light transmittance were increased. At lower evaporation rate, films of Cr and Cu porduced non-stoi-chiometric oxides but Al an Mn showed up amorphous structures.

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Effects of hydrogen gas addition on insulator thin film of Al/AlN/GaAs MIS system fabricated by sputtering method (스퍼터링법으로 저작한 Al/AlN/GaAs MIS 구조에서 절연박막에 수소가스첨가가 미치는 영향)

  • Kwon, Jung-Youl;Kim, Min-Suk;Kim, Jee-Gyun;Lee, Hwan-Chul;Lee, Heon-Yong
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1925-1927
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    • 1999
  • At the study, it has fabricated Al/AlN/GaAs MIS capacitor using DC reactive sputtering method. To applicate GaAs semiconductor in a MIS devices, investigated capability of AIN thin film by the insulator layer. Also it has investigated inversion of C-V characteristics by addition of the hydrogen(hydrogen concentration: 5%) and it has investigated that leakage current has $10^{-8}A/cm^2$ for 1 MV/cm breakdown electric field of I-V characteristics.

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Surface morphology of Al cathode for OLED with Kr gas (Kr가스에 의한 OLED용 Al 음전극의 표면 형상)

  • Kim, Hyun-Woong;Keum, Min-Jong;Kim, Kyung-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.283-284
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    • 2005
  • Al electrode for OLED was deposited by Facing Targets Sputtering(FTS) system which can reduce the damage of organic layer. The Al thin films were deposited on the slide glass as a function of working gas such as Ar, Kr or mixed gas. The film surface image was observed by AFM and SEM. In the results, when Al thin film were deposited using mixed gas, the surface morphology was improved in some region.

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Luminescent and Electrical Characterization of ZnS:Tb Thin-Film Electroluminescent Devices Using Multilayered Insulators

  • Kim, Yong-Shin;Kang, Jung-Sook;Yun, Sun-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.37-38
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    • 2000
  • The ZnS:Tb thin-film electroluminescent devices were grown by atomic layer deposition with utilizing single-layer aluminum oxide and/or multilayered tantalum aluminum oxide, $Ta_xAl_yO$, as upper and lower insulating layers. These devices were investigated in terms of the luminescent and electrical characteristics. From this analysis, the devices using the $Ta_xAl_yO$ instead of $Al_2O_3$ were observed to have a lower threshold voltage for emission due to the higher relative dielectric constant of $Ta_xAl_yO$ insulators than that of the $Al_2O_3$ device. And there was a large amount of dynamic space charge generation in the phosphor of the device with the $Ta_xAl_yO$ insulators seemingly due to electron multiplication such as trap ionization.

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A Study on SAW Properties of Bilayer Thin Film Structure Composed of ZnO and Dielectric Thin Films (ZnO 박막과 유전체 박막으로 구성된 이중구조의 물성 및 표면 탄성파 특성)

  • 이용의;김형준
    • Korean Journal of Crystallography
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    • v.6 no.2
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    • pp.134-140
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    • 1995
  • SAW properties of SiNx/ZnO bilayer thin film structure were analyzed. ZnO thin films were deposited by rf magnetron sputter using O2 gas as an oxidizer. Structure of ZnO thin films was affected by Ar/O2 ratio. At the gas ratio of Ar/O2=67/33, the standard deviation of X-ray rocking curve of (002) preferred ZnO thin film was 2.17 degree. This value is sufficient to use ZnO thin films as an acoustic element. SAW velocity of glass/SiNx(7000Å)/Al/ZnO(5μm) structure was max. 2.2% faster than that of ZnO/glass.

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Physical Properties of Fe Particles Fine-dispersed in AlN Thin Films (Fe 입자를 미세 분산 시킨 AlN 박막의 물리적 성질)

  • Han, Chang-Suk;Kim, Jang-Woo
    • Korean Journal of Materials Research
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    • v.21 no.1
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    • pp.28-33
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    • 2011
  • This paper describes the fabrication of AlN thin films containing iron and iron nitride particles, and the magnetic and electrical properties of such films. Fe-N-Al alloy films were deposited in Ar and $N_2$ mixtures at ambient temperature using Fe/Al composite targets in a two-facing-target DC sputtering system. X-ray diffraction results showed that the Fe-N-Al films were amorphous, and after annealing for 5 h both AlN and bcc-Fe/bct-$FeN_x$ phases appeared. Structure changes in the $FeN_x$ phases were explained in terms of occupied nitrogen atoms. Electron diffraction and transmission electron microscopy observations revealed that iron and iron nitride particles were randomly dispersed in annealed AlN films. The grain size of magnetic particles ranged from 5 to 20 nm in diameter depending on annealing conditions. The saturation magnetization as a function of the annealing time for the $Fe_{55}N_{20}Al_{25}$ films when annealed at 573, 773 and 873 K. At these temperatures, the amount of iron/iron nitride particles increased with increasing annealing time. An increase in the saturation magnetization is explained qualitatively in terms of the amount of such magnetic particles in the film. The resistivity increased monotonously with decreasing Fe content, being consistent with randomly dispersed iron/iron nitride particles in the AlN film. The coercive force was evaluated to be larger than $6.4{\times}10^3Am^{-1}$ (80 Oe). This large value is ascribed to a residual stress restrained in the ferromagnetic particles, which is considered to be related to the present preparation process.