The Resistivity Properties and Adhesive Strength of Cu Thin firms Fabricated by EBE Method (전자빔 증착법으로 제작한 Cu 박막의 부착력과 저항율 특성)
-
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
- /
- 2003.11a
- /
- pp.422-426
- /
- 2003