• Title/Summary/Keyword: Ag-paste

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Synthesis of SiO2/Ag Core-shell Nanoparticles for Conductive Paste Application (SiO2/Ag 코어-쉘 나노입자의 합성 및 전도성 페이스트 적용)

  • Sim, Sang-Bo;Han, Jong-Dae
    • Applied Chemistry for Engineering
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    • v.32 no.1
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    • pp.28-34
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    • 2021
  • SiO2/Ag core-shell nanoparticles were synthesized by combining modified Stöber process and reverse micelle method using acetoxime as a reducing agent in water/dodecylbenzenesulfonic acid (DDBA)/cyclohexane reverse micells. The SiO2/Ag core-shells were studied for structure, morphology and size using UV-visible spectroscopy, XRD, SEM and TEM. The size of a SiO2/Ag core-shell could be controlled by changing the [water]/[DDBA] molar ratio (WR) values. The size and the polydispersity of SiO2/Ag core-shells increased with increase of the WR value. The resultant Ag nanoparticles exhibit a strong surface plasmon resonance (SPR) peak at 430 nm over the amorphous SiO2 nanoparticles. The SPR peak shifted to the red side with increase in nanoparticle size. Conductive pastes with 70 wt% SiO2/Ag core-shell were prepared, and the pastes were coated on the PET films using a screen-printing method. The printed paste film of the SiO2/Ag core-shell showed higher surface resistance than the commercial Ag paste in the range of 460~750 µΩ/sq.

Core-shell TiO2/Ag Nanoparticle Synthesis and Characterization for Conductive Paste (전도성 페이스트용 코어-쉘 TiO2/Ag 나노입자의 합성 및 특성 연구)

  • Sang-Bo, Sim;Jong-Dae, Han
    • Applied Chemistry for Engineering
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    • v.34 no.1
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    • pp.36-44
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    • 2023
  • Core-shell TiO2/Ag nanoparticles were synthesized by a modified sol-gel process and the reverse micelle method using acetoxime as a reducing agent in water/dodecylbenzenesulfonic acid (DDBA)/cyclohexane. The structure, shape, and size of the TiO2/Ag nanoparticles were investigated using X-ray diffraction (XRD), UV-visible spectroscopy, scanning electron microscope (SEM), transmission electron microscope (TEM), and thermogravimetric analysis (TGA). The size of TiO2/Ag nanoparticles could be controlled by changing the [water]/[DDBA] molar ratio values. The size and the polydispersity of TiO2/Ag nanoparticles increased when the [water]/[DDBA] molar ratio rose. The resultant Ag nanoparticles over the anatase crystal TiO2 nanoparticles exhibited a strong surface plasmon resonance (SPR) peak at about 430 nm. The SPR peak shifted to the red side with the increase in nanoparticle size. Conductive pastes with 70 wt% TiO2/Ag nanoparticles were prepared, and the pastes were coated on the PET films using a screen-printing method. The printed paste films of the TiO2/Ag nanoparticles demonstrated greater surface resistance than conventional Ag paste in the range of 405~630 μΩ/sq.

Contact Formation Between Ag and Si With Lead-Free Frits in Ag Pastes For Si Solar Cells (실리콘 태양전지용 Ag pastes 에서의 무연 프릿에 따른 Ag, Si간 접촉 형성)

  • Kim, Dongsun;Hwang, Seongjin;Kim, Jongwoo;Lee, Jungki;Kim, Hyungsun
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.06a
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    • pp.61.2-61.2
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    • 2010
  • Ag thick-film has usually been used for the front electrode of Si solar cells with the outstanding electrical properties. Ag paste consists of Ag powers, vehicles, frits and additives. Ag paste has broadly been screen-printed on the front side of Si wafer with the merits of low cost and simplicity. The optimal contact formation between Ag electrodes and Si wafer in the front electrode during a fast firing has been considered as the key factor for high efficiency. Although the content of frit in Ag pastes is less than 5wt%, it can profoundly influence the contact formation between Ag and Si under the fast firing. In this study, the effects of lead-free frits on the contacts between Ag and Si were studied with the thermal properties and compositions of various frits. Our experimental results showed that the electrical properties of cells were related to the interface structures between Ag and Si. It was found that current path of electrons from Si to Ag would be possible through the tunneling mechanism assisted by tens of nano-Ag recrystals on $n^+$ emitter as well as Ag recrystals penetrated into $n^+$ emitter layers. These preliminary studies will be helpful for designing the proper frits for the Ag pastes with considering the properties of various Si wafers.

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Dispersion Characteristics of Ag Pastes and Properties of Screen-printed Source-drain Electrodes for OTFTs (Ag Pastes의 분산 특성 및 스크린 인쇄된 OTFTs용 전극 물성)

  • Lee, Mi-Young;Nam, Su-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.9
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    • pp.835-843
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    • 2008
  • We have fabricated the source-drain electrodes for OTFTs by screen printing method and manufactured Ag pastes as conductive paste. To obtain excellent conductivity and screen-printability of Ag pastes, the dispersion characteristics of Ag pastes prepared from two types of acryl resins with different molecular structures and Ag powder treated with caprylic acid, triethanol amine and dodecane thiol as surfactant respectively were investigated. The Ag pastes containing Ag powder treated with dodecane thiol having thiol as anchor group or AA4123 with carboxyl group(COOH) of hydrophilic group as binder resin exhibited excellent dispersity. But, Ag pastes(CA-41, TA-41, DT-41) prepared from AA4123 fabricated the insulating layer since the strong interaction between surface of Ag powder and carboxyl group(COOH) of AA4123 interfered with the formation of conduction path among Ag powders. The viscosity behavior of Ag pastes exhibited shear-thinning flow in the high shear rate range and the pastes with bad dispersion characteristic demonstrated higher shear-thinning index than those with good dispersity due to the weak flocculated network structure. The output curve of OTFT device with a channel length of 107 ${\mu}m$ using screen-printed S-D electrodes from DT-30 showed good saturation behavior and no significant contact resistance. And this device exhibited a saturation mobility of $4.0{\times}10^{-3}$ $cm^2/Vs$, on/off current ratio of about $10^5$ and a threshold voltage of about 0.7 V.

Manufacturing and Thermal Process Optimization of Ag-paste for Fabricating High Efficiency Mono-Si Solar Cell (고효율 단결정 Si 태양전지 제작을 위한 은 페이스트의 제조 및 열 공정 최적화)

  • Pi, Ji-Hee;Kim, Sung-Jin;Son, Chang-Rok;Kweon, Soon-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.2
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    • pp.144-150
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    • 2013
  • A New Ag-pastes were developed for integrating the high efficiency mono-Si solar cell. The pastes were the mixture of 84 wt% Ag, 2 wt% glass frit, 11 wt% solvent of buthyl cabitol acetate, and 3 wt% additives. After fabricating the Ag-pastes by using a 3-roll mill, they were coated on a $SiN_x$/n+/p- stacks of a commercial mono-Si solar cell. And the post-thermal process was also optimized by varying the process conditions of peak temperature. The optimized solar cell efficiency on a 6-inch mono-Si wafer was 18.28%, which was the one of the world best performances. It meaned that the newly developed Ag-paste could be adopted to fabricate a commercial bulk Si solar cell.

Determination of Ag(Ⅰ) Ion at a Modified Carbon Paste Electrode Containing N,N'-Diphenyl Oxamide

  • Won, Mi-Sook;Yeom, Jeong-Sik;Yoon, Jang-Hee;Jeong, Euh-Duck;Shim, Yoon-Bo
    • Bulletin of the Korean Chemical Society
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    • v.24 no.7
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    • pp.948-952
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    • 2003
  • New approach for the determination of Ag(I) ion was performed by using a carbon paste electrode (CPE) containing N,N'-Diphenyl oxamide (DPO) with anodic stripping voltammetry. The CMEs have been prepared by making carbon paste mixtures containing an appropriate amount of DPO salt coated onto graphite particles to analyze trace metal ions via complexation followed by stripping voltammetry. Various experimental parameters affecting the response, such as pH, deposition time, temperature, and electrode composition, were carefully optimized. Using differential pulse anodic stripping voltammetry, the logarithmic linear response range for the Ag(I) ion was 1.0 × $10^{-7}$ - 5.0 × $10^{-9}$ M at the deposition time of 10 min, with the detection limit was 7.0 × $10^{-10}$ M. The detection limit adopted from anodic stripping differential pulse voltammetry was 7.0 × $10^{-10}$ M for silver and the relative standard deviation was ± 3.2% at a 5.0 × $10^{-8}$ M of Ag(I) ion (n = 7). The proposed electrode shows a very good selectivity for Ag(I) in a standard solution containing several metals at optimized conditions.

Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes

  • Sharma, Ashutosh;Mallik, Sabuj;Ekere, Nduka N.;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.83-89
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    • 2014
  • Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

COMPARISON OF DIFFUSION COEFFICIENTS AND ACTIVATION ENERGIES FOR AG DIFFUSION IN SILICON CARBIDE

  • KIM, BONG GOO;YEO, SUNGHWAN;LEE, YOUNG WOO;CHO, MOON SUNG
    • Nuclear Engineering and Technology
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    • v.47 no.5
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    • pp.608-616
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    • 2015
  • The migration of silver (Ag) in silicon carbide (SiC) and $^{110m}Ag$ through SiC of irradiated tristructural isotropic (TRISO) fuel has been studied for the past three to four decades. However, there is no satisfactory explanation for the transport mechanism of Ag in SiC. In this work, the diffusion coefficients of Ag measured and/or estimated in previous studies were reviewed, and then pre-exponential factors and activation energies from the previous experiments were evaluated using Arrhenius equation. The activation energy is $247.4kJ{\cdot}mol^{-1}$ from Ag paste experiments between two SiC layers produced using fluidized-bed chemical vapor deposition (FBCVD), $125.3kJ{\cdot}mol^{-1}$ from integral release experiments (annealing of irradiated TRISO fuel), $121.8kJ{\cdot}mol^{-1}$ from fractional Ag release during irradiation of TRISO fuel in high flux reactor (HFR), and $274.8kJ{\cdot}mol^{-1}$ from Ag ion implantation experiments, respectively. The activation energy from ion implantation experiments is greater than that from Ag paste, fractional release and integral release, and the activation energy from Ag paste experiments is approximately two times greater than that from integral release experiments and fractional Ag release during the irradiation of TRISO fuel in HFR. The pre-exponential factors are also very different depending on the experimental methods and estimation. From a comparison of the pre-exponential factors and activation energies, it can be analogized that the diffusion mechanism of Ag using ion implantation experiment is different from other experiments, such as a Ag paste experiment, integral release experiments, and heating experiments after irradiating TRISO fuel in HFR. However, the results of this work do not support the long held assumption that Ag release from FBCVD-SiC, used for the coating layer in TRISO fuel, is dominated by grain boundary diffusion. In order to understand in detail the transport mechanism of Ag through the coating layer, FBCVD-SiC in TRISO fuel, a microstructural change caused by neutron irradiation during operation has to be fully considered.

Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring (저온동시소성용 감광성 은(Ag)페이스트의 광식각 특성)

  • Park, Seong-Dae;Kang, Na-Min;Lim, Jin-Kyu;Kim, Dong-Kook;Kang, Nam-Kee;Park, Jong-Chul
    • Journal of the Korean Ceramic Society
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    • v.41 no.4
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    • pp.313-322
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    • 2004
  • Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.