• Journal of the Korean Ceramic Society
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• v.36 no.3
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• pp.284-292
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• 1999

고체함량을 변화시킨 NiCuZn 페라이트 페이스트를 사용하여 스크린 인쇄법으로 7.7$\times$4.5$\times$1.0 nm 크기의 칩인덕터를 제조한 후, 페라이트 페이스트의 고체함량에 따른 수축률, 소결밀도, 미세구조, 계면반응 등의 물리적 특성 및 자기적 특성 변화를 분석하였다. 조온소결을 위하여 attrition milling 공정을 통하여 미세분말을 준비하였으며, 소결온도는 880~94$0^{\circ}C$로 변화시켰다. 90$0^{\circ}C$에서 2시간 열처리된 페라이트 후막의 소결밀도는 고체함량이 50,55,60%로 증가할수록 5.12,5.14,5.18g/㎤로 증가하였으며, 이에 따라 칩 인덕터 시편들의 주파수 10 MHz에서 L값이 2.1,2.3,2.5 $\mu$H로 커졌다.Q값은 소결밀도 증가에 의한 Q값 증가효과와 아울러 입자가 커짐에 따른 반대효과로 인하여 고체함량에 따라 87,90,94로 큰 변화가 없었다. 페라이트 페이\ulcorner의 고체함량 및 소결온도와 무관하게 Ag 성분의 페라이트 쪽으로의 확산현상은 나타나지 않았다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.11
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• pp.874-879
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• 1991

The effect of air gap between specimen and jig on the material constant (permittivity, permeability) and attenuation characteristics of electromagnetic wave absorbers in the coaxial line method was investigated. The presence of a air gap made both permittivity and permeability measured lower than true value, and the tendency was greater in the case of permittivity. An inner gap compared to an outer gop was found to yield a larger difference between measured and true values. The effect of air gap was measured for a Ni0.3Zn0.7Fe2O4, with the gap eliminated by metallizing with Ag-paste. The measured characteristics were in good agreement with corrected values by calculation.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1881-1883
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• 2001

We manufactured a micro CPL by LlGA process, a new conceptual ultra-fine and precise forming method, using X-ray lithography process. We fabricated a BN X-ray mask having properties of good X-ray transmittance and large mechanical strength. Micro CPL was manufactured by dividing into an upper plate and a low plate. Each of plates was bonded by Ag paste screen printing. The upper plate was fabricated on glass wafer to observe flow and phase transformation of cooling solution. The lower plate was manufactured by Cu electroplating for good heat transmission. Precision of inner Parts, micro pin and micro channel, of manufactured micro CPL is under ${\pm}2{\mu}m$.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2415-2418
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• 2014

In this report, the contact resistance between "electrode" and "lead" is investigated for reasonable measurements of samples' resistance in a polypyrrole (PPy) nanowire device. The sample's resistance, including "electrode-lead" contact resistance, shows a decrease as force applied to the interface increases. Moreover, the sample's resistance becomes reasonably similar to, or lower than, values calculated by resistivity of PPy reported in previous studies. The decrease of electrode-lead contact resistance by increasing the applying force was analyzed by using Holm theory: the general equation of relation between contact resistance ($R_H$) of two-metal thin films and contact force ($R_H{\propto}1/\sqrt{F}$). The present investigation can guide a reliable way to minimize electrode-lead contact resistance for reasonable characterization of nanomaterials in a microelectrode device; 80% of the maximum applying force to the junction without deformation of the apparatus shows reasonable values without experimental error.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1132-1133
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• 2015

In this paper, we are presents production and operation characteristics for inorganic EL phosphors device using screen printed. The EL device is composed as ITO PET / EL phosphors dielectric $(2{\times}2cm^2)/TiO^2$ paste/Ag electrode. At 100Vac 400Hz, the luminescence of inorganic EL phosphors were $60.33cd/m^2$ of red phosphor, $42.12cd/m^2$ of green phosphor and $58.45cd/m^2$ of blue phosphor. The output current was 12.57 mA, 17.11 mA and 11.98 mA, respectively. The inorganic EL phosphors of EL device are increasing efficiency EL device.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.391-391
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• 2011

Crystalline silicon solar cell을 양산에 적용하기 위해 전면 전극의 패턴을 형성하는 방법으로 Ag paste를 이용한 screen printing이 가장 일반적으로 사용된다. 전면 전극의 패턴 형성 시, Finger의 width와 spacing은 Fill factor, JSC, VOC 등 태양전지의 중요 parameter들과 관련되어, 효율에 영향을 미치기 때문에, printing 시 Finger width와 spacing을 최적화하여 최대한의 효율을 내는 조건을 찾는 것이 바람직하다. 본 연구에서는 Finger width를 $30{\mu}m{\sim}100{\mu}m$, spacing을 $1.8{\mu}m{\sim}2.8{\mu}m$ 까지 가변하여 c-Si solar cell을 제작하였으며, 제작된 cell의 LIV를 측정을 통하여, 최적의 효율을 내는 조건을 찾고자 하였다. 그 결과 Finger width $30{\mu}m$, Finger spacing $1.8{\mu}m$의 조건에서 17.12%로 최고의 효율을 나타내었다.

• Food Science and Preservation
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• v.30 no.5
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• pp.785-796
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• 2023

The aim of this study was to elucidate chemical structures and rheological properties of arabinogalactans (AGs) isolated from three legumes including black gram (BG), great northern bean (GNB), and California small white bean (CSWB). The ratio of galactose to arabinose (G/A) in three legumes increased in the order of BG > GNB > CSWB. The rheological measurements of 1-5% (w/v) AG solutions revealed Newtonian and non-Newtonian flow behaviors. BG exhibited yield stress, indicating plastic behavior. Small-amplitude oscillatory tests indicated viscoelastic properties of BG, GNB, and CSWB ranging from solid-like, paste-like, and liquid-like behaviors, respectively. Small-strain oscillatory tests were conducted to assess the structure recovery of the AGs after pre-shearing. G" values of BG and GNB increased, but those of CSWB remained constant after shearing. These results suggest that the chemical structures of the AGs, particularly their G/A ratios, influence their rheological properties.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of Sensor Science and Technology
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• v.5 no.5
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• pp.21-29
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• 1996

A piezoresistive silicon acceleration sensor with 8 beams, utilized by an unique silicon micromachining technique using porous silicon etching method which was fabricated on the selectively diffused (111)-oriented $n/n^{+}/n$ silicon subtrates. The width, length, and thickness of the beam was $100\;{\mu}m$, $500\;{\mu}m$, and $7\;{\mu}m$, respectively, and the diameter of the mass paddle (the region suspended by the eight beams) was 1.4 mm. The seismic mass on the mass paddle was formed about 2 mg so as to measure accelerations of the range of 50g for automotive applications. For the formation of the mass, the solder mass was loaded on the mass paddle by dispensing Pb/Sn/Ag solder paste. After the solder paste is deposited, Heat treatment was carried out on the 3-zone reflow equipment. The decay time of the output signal to impulse excitation of the fabricated sensor was observed for approximately 30 ms. The sensitivity measured through summing circuit was 2.9 mV/g and the nonlinearity of the sensor was less than 2% of the full scale output. The output deviation of each bridge was ${\pm}4%$. The cross-axis sensitivity was within 4% and the resonant frequency was found to be 2.15 KHz from the FEM simulation results.

• Journal of the Korean Ceramic Society
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• v.43 no.2 s.285
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• pp.92-97
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• 2006

Dolomite type $BaSn(BO_3)_2$ ceramics with rhombohedral crystal structure has been synthesized via solid state reaction route. Dielectric properties were measured for the samples sintered at $1050\~1200^{\circ}C$ for 2 h in air. Dielectric constant, loss tangent, and temperature coefficient were increased with sintering temperature due to the evolution of $BaSnO_3$, secondary, phase. Optimum dielectric properties were obtained at the $BaSn(BO_3)_2$ ceramics sintered at $1100^{\circ}C.\;CuO/Bi_2O_3$ was added to $BaSn(BO_3)_2$ ceramics to lower the sintering temperature for LTCC application, then Co and Fe-based coloring agents were added for colorizing the LTCC tape. Typical dielectric properties of $BaSn(BO_3)_2$ ceramics with $5 wt\%\;CuO/Bi_2O_3\;and\;3wt\%$ Co-coloring agent that sintered at $900^{\circ}C$ were $\varepsilon_r=9.89,\;tan{\delta}=0.92\times10^{-3},\;and\;TCC=112ppm/^{\circ}C$. Thus obtained LTCC tape was co-fired with Ag paste for compatibility test and revealed no sign of Ag reaction with the ceramics.