• 대한전자공학회논문지
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• 제18권3호
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• pp.42-51
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• 1981

결정방위 (100)인 단결정 P형 실리콘 기판으로 N+PP+ 태양전지를 제작하였다. 뒷면의 P+층의 형성은 940℃에서 60분간 boron nitride를 사용하는 첫번째 boron predeposition과 boron glass를 제거하지 않고 1145℃에서 3시간 동안 행하는 두번째 predeposition으로 이루어지며 boron 확산층의 어닐링은 1100℃에서 40분간 하였다. 앞면의 N+ 층의 형성은 900℃에서 7∼15분동안 POCI3 source를 사용하는 Phosphorus Predeposition으로 이루어지며 어닐링은 800℃에서 1시간 동안 dryO2분위기로 하였다 금속전극층의 형성은 Ti, Pd, Ag의 순으로 앞, 뒷면에 이들 금속들을 질공증착한 후 사진식각을 함으로써 이루어지며 이에 다시 전기도금을 하여 전체 전극층의 두께를 3∼4μm정도로 증가시켰다. 표면 광반사를 줄이기 위해 앞면에 400℃에서 silicon nitride를 입혔으며 마지막으로 550℃에서 10분간 alloy를 함으로써 금속전극의 신뢰도를 높혔다. 그 결과 제작된 면적 3.36㎠의 N+PP+ 전지들은 100mW/㎠의 인공조명하에서 단락전류 103mA, 개방전압 0.59V ,충실도 0.8을 보였다. 따라서 실제 전면적(수광면적)효율이 14.4%(16.2%)가 되어 BSF가 없는 N+P 전지의 11%전면적 변환효율에서 약3.5%의 효율이 개선되었다.

• 보존과학회지
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• 제29권4호
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• pp.355-366
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• 2013

전세품인 청동기를 대상으로 ICP-AES, SEM-EDS와 두 종류의 P-XRF (Bench top type, Gun type)를 이용하여 성분분석과 미세조직 관찰을 실시하였다. 또한 전세품 청동기의 성분 함유량을 분석하는 과학적 분석을 이용하여 특이원소의 검출에 따른 청동기의 진위 판별에 대한 적용성 연구를 실시하였다. ICP-AES의 분석 결과 청동기는 3원 합금(Cu-Sn-Pb계)의 청동으로 Ag, As, Co, Fe 등의 미량 성분이 검출되었으며 특이 원소(Zn 등)는 검출되지 않았다. P-XRF 분석결과 ICP-AES 분석결과와 비교하였을 때 Cu의 함유량은 10~25% 낮고, Sn 함유량은 10~20% 높게 검출되었다. 이는 탈주석 현상으로 Sn의 함유량이 높은 산화주석($SnO_2$) 화합물이 청동기 표면에 존재하여 영향을 주는 것으로 판단되었다. 그리고 SEM-EDS 분석결과 Pb의 편석 현상을 확인할 수 있었다. 이러한 과학적 분석 방법을 이용하여 청동 소지층과 부식층(표면)의 성분 조성 관계가 서로 다르게 나타나는 것을 확인하였다. 청동유물은 미세조직 및 성분분석 결과만으로 진위판별에 대한 결과를 적용하기가 어려웠다. 따라서 매장 환경 및 유물의 보존 상태 등에 따라 부식생성물질이 서로 다른 양상을 보이는 것에 착안하여 부식생성물질에 대한 추가적인 연구와 고고미술사적인 비교연구를 통하여 진위여부를 확인할 수 있을 것으로 사료된다.

• 분석과학
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• 제13권3호
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• pp.291-296
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• 2000

사용후핵연료와 조성이 비슷한 모의 사용후핵연료를 고압 산분해법으로 용해시킨 후 우라늄 매질로부터 몰리브덴을 분리하지 않고 유도결합플라스마 원자방출분광기(ICP-AES)로 바로 정량할 수 있는 분석조건을 검토하였다. 몰리브덴 분석에 미치는 우라늄의 분광학적 간섭 정도를 각각의 스펙트럼으로부터 비교, 평가한 결과 202.030과 203.844 nm의 파장이 분석선으로서 가장 적합하였으며, 보다 정확하고 정밀한 분석 결과를 얻기 위하여 표준물 첨가법을 적용하였다. 우라늄 매질로부터 몰리브덴을 양이온 교환수지(Bio-Rad AG 50W-X8)로 분리한 다음 ICP-AES로 분석한 결과와 직접 분석한 결과를 비교한 결과, 상대편차는 5% 범위 내에서 잘 일치하는 결과를 얻었다. 따라서 본 방법은 모의 사용후핵연료 용해용액 내에 함유되어 있는 몰리브덴을 바로 분석할 수 있을 뿐만 아니라 몰리브덴의 함량이 수 퍼센트인 우라늄-몰리브덴 합금중 몰리브덴 정량에도 적용할 수 있었다.

• Corrosion Science and Technology
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• 제6권6호
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Restorative Dentistry and Endodontics
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• 제22권1호
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• pp.1-33
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• 1997

The objective of this study was to analyze the in vitro and in vivo corrosion products of low and high copper amalgams. The four different types of amalgam alloy used in this study were Fine cut, Caulk spherical, Dispersalloy, and Tytin. After each amalgam alloy and Hg were triturated according to the directions of the manufacturer by means of the mechanical amalgamator(Amalgam mixer. Shinhung Co. Korea), the triturated mass was inserted into a cylindrical metal mold which was 12mm in diameter and 10mm in height. The mass was condensed by 150Kg/cm compressive force. The specimen was removed from the mold and aged at room temperature for about seven days. The standard surface preparation was routinely carried out by emery paper polishing under running water. In vitro amalgam specimens were potentiostatically polarized ten times in a normal saline solution at $37^{\circ}C$(potentiostat : HA-301. Hukuto Denko Corp. Japan). Each specimen was subjected to anodic polarization scan within the potential range -1700mV to+400mV(SCE). After corrosion tests, anodic polarization curves and corrosion potentials were obtained. The amount of component elements dissolved from amalgams into solution was measured three times by ICP AES(Inductive Coupled Plasma Atomic Emission Spectrometry: Plasma 40. Perkim Elmer Co. U.S.A.). The four different types of amalgam were filled in occlusal and buccal class I cavities of four human 3rd molars. After about five years the restorations were carefully removed after tooth extraction to preserve the structural details including the deteriorated margins. The occlusal surface, amalgam-tooth interface and the fractured surface of in vivo amalgam corrosion products were analyzed. In vivo and in vitro amalgam specimens were examined and analyzed metallographically by SEM(Scanning Electron Microscope: JSM 840. Jeol Co. Japan) and EDAX(Energy Dispersive Micro X-ray Analyser: JSM 840. Jeol Co. Japan). 1. The following results are obtained from in vitro corrosion tests. 1) Corrosion potentials of all amalgams became more noble after ten times passing through the in vitro corrosion test compared to first time. 2) After times through the test, released Cu concentration in saline solution was almost equal but highest in Fine cut. Ag and Hg ion concentration was highest in Caulk spherical and Sn was highest in Dispersalloy. 3) Analyses of surface corrosion products in vitro reveal the following results. a)The corroded surface of Caulk spherical has Na-Sn-Cl containing clusters of $5{\mu}m$ needle-like crystals and oval shapes of Sn-Cl phase, polyhedral Sn oxide phase. b)In Fine cut, there appeared to be a large Sn containing phase, surrounded by many Cu-Sn phases of $1{\mu}m$ granular shapes. c)Dispersalloy was covered by a thick reticular layer which contained Zn-Cl phase. d)In Tytin, a very thin, corroded layer had formed with irregularly growing Sn-Cl phases that looked like a stack of plates. 2. The following results are obtained by an analysis of in vivo amalgam corrosion products. 1) Occlusal surfaces of all amalgams were covered by thick amorphous layers containing Ca-P elements which were abraded by occlusal force. 2) In tooth-amalgam interface, Ca-P containing products were examined in all amalgams but were most clearly seen in low copper amalgams. 3) Sn oxide appeared as a polyhedral shape in internal space in Caulk spherical and Fine cut. 4) Apical pyramidal shaped Sn oxide and curved plate-like Sn-Cl phases resulted in Dispersalloy. 5) In Tytin, Sn oxide and Sn hydroxide were not seen but polyhedral Ag-Hg phase crystal appeared in internal space which assumed a ${\beta}_l$ phase.

• 대한치과보철학회지
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• 제22권1호
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• pp.95-108
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• 1984

Even though the tarnishing and corrosion problems characteristic with dental silver-palladium alloy are not yet fully solved, it is recently widely used because of its low cost. However the effects of major alloying elements on the various properties of this system are not fully understood. The object of this research is to clarify the effects of In and Zn additives on the corrosion and tarnishing resistances and precipitation hardening behavior of this sytem, using electrodynamic polarization, immersion, and Vicker's microhardness test and X-ray diffraction and electron probe micro analysis methods. The obtained results were as follows: I. As indium content is increased, both the corrosion resistance in Cl-solution and microhardness are also increased while the tarnishing resistance is decreased. 2. As Zinc content is increased, the corrosion resistance is decreased, but tarnishing resistance is increased 3. At 70Ag-25Pd-2.5Zn-2.5In composition, the precipitation harding behavior was mot significant. The optimum aging temperature was $450^{\circ}C$ and the time was 2 hrs. The resulting specimen of this work carried 180VHN. 4. Under the heat treatment, the changes in the mechanical property are due to the changes in the shape and composition of dendrite matrix, namely, it is because of the precipitation hardening behavior which has been proved by electron probe micro analysis and optical microscopic finding.

• 헤리티지:역사와 과학
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• 제52권1호
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• pp.4-21
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• 2019

영남지역에서 출토된 6~7세기 신라 금제 귀걸이 23점에 대한 성분 분석을 실시하고, 금판에 포함된 은(Ag) 함량을 기준으로 세 가지 유형으로 분류하였다. I 유형(20~50wt%), II 유형(10~20wt%), III 유형(10wt% 이하)으로 구분하였는데, I II 유형의 귀걸이 금판은 금(Au) 함량이 상대적으로 높은 부분에서 미세한 기공이 집중적으로 분포되는 현상이 관찰되었다. 금판 표면의 성분 차이 발생 원인을 네 가지로 구분하여 1) 표면 처리, 2) 제작 과정에서 열 확산, 3) 사금의 성분 차이, 4) 금의 정련 방법 측면에서 검토하였다. 금판 표면의 금 함량이 상대적으로 높은 부분에서는 미세한 기공이 집중적으로 관찰되며, 이와 관련하여 금 합금 표면에 의도적으로 금을 제외한 금속 성분을 제거하면서 금 함량을 높이는 고갈 도금(depletion gilding) 가능성을 제시하였다. 의도적인 표면 처리와 더불어 제작 과정에서 금판과 금속 봉 사이에 열 확산이 일어나 금판의 구리 함량이 높아진 사례를 세환이식의 분석 결과로 확인되었다. 금판의 재료적인 측면에서 살펴보면 금판에 포함된 은(Ag)이 자연금에 포함된 것인지, 합금에 의해 추가된 것인지를 국내에서 채취된 사금 분석을 통해 살펴보았다. 분석 결과 평균적으로 13wt% 정도의 은이 포함된 것으로 미루어 보아 II 유형은 자연금의 범주에 포함되고, III 유형은 정련 과정을 거친 금, I 유형은 자연금에 은이 합금된 것으로 보인다. 여기에서 III 유형의 경우 정련 과정을 거쳐 순수한 금을 만든 뒤 은을 합금했을 가능성에 대해 국내외 고대 문헌에 소개된 금 정련 방법을 조사하였다. 고대 정련 방법은 자연금에 포함된 은이 염화물 또는 황화물과 반응하여 결합됨으로써 제거되는 방법이었는데, 이러한 방법을 통해 순수한 금을 얻기 위해서는 장시간의 노력과 기술이 요구된다는 것이 밝혀졌다. 따라서 정련 과정을 통해 순금을 만든 후에 강도를 높이기 위해 소량의 은을 첨가했을 가능성은 낮아 보인다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 춘계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.3-5
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• 2001

Racetrack coils are used in many areas of superconductivity applications such as generators, motors, maglev, wiggler magnets and so on. The fabrication and characteristics of race-track type High Tc Superconducting (HTS) magnets were carried out. The Magnet is composed of 3 pancake coils wound by 37-filamental Bi-2223/ Ag-alloy tapes. Quench current ($I_q$) of both whole magnet and 3 pancake coils were measured. At 77K under the self-field, $I_q$ of magnet was 12A, while in the case of middle pancake coil, $I_q$ was 15A. The upper pancake coils of racetrack magnet with iron plates, magnet having optimized current distribution and initial magnet are compared with each other through 3D FEA, manufacturing and testing these magnets. The measured performance of the upper pancake coil #3 with iron plates improved by 50% on the basis of initial pancake coil #3. Quench current ($I_q$) of field winding was 12A. In addition, the fabrication processes and the characteristics of HTS magnet are described.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.