• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.492-497
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• 2018

This paper reports the efficacy of tape casting using an Ag-10 wt% CuO filler for the successful joining of a sintered $Ce_{0.9}Gd_{0.1}O_{2-{\delta}}-La_{0.7}Sr_{0.3}MnO_{3{\pm}{\delta}}$ (GDC-LSM) ceramic with a SUS 460 FC metal alloy by reactive air brazing. The as-prepared green tape was highly flexible without drying cracks, and the handling was easy when used as a filler material for reactive air brazing. Heat treatment for the GDC-LSM/SUS 460 FC joint was performed at $1050^{\circ}C$ for 30 min in air. Microstructural observations indicated a reliable and compact joining. The room temperature mechanical shear strength of the as-brazed joints was $60{\pm}8MPa$ with a cohesive failure. The flexural strength of joints was measured from room temperature up to $850^{\circ}C$, where the strength retention revealed to be almost 100% at $500^{\circ}C$. However, the joints showed a degradation in strengths at 800 and $850^{\circ}C$, exhibiting strength retentions of 57% and 37%, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.5
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• pp.805-810
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• 2006

Defects in the conventional casting process of silver jewelry can result in famished products of mediocre hardness. To overcome the shortcomings of conventional methods, we proposed new press forming process, which involves applying uniaxial pressure on casting 92.5%Ag-6.5%Cu-1%Zn ring elements and shaping with a lath. We investigated Vickers hardness, density, and microstructure evolution by changing the applied uniaxial pressure. We report that our newly proposed process can increase the hardness up to 2.3 times and decrease average grain size by 50%. Our method leads to drastic mechanical property enhancements, and is thus suitable for casting tension-style jewelry.

• Journal of Technologic Dentistry
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• v.22 no.1
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• pp.69-78
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• 2000

The microstructure and corrosion behavior of commercially dental casting gold alloys were investigated to clarify the effect of burn-out temperature and cooling rate. In the case of water quenching after casting, only the αphase, which is typical dendritic microstructure of golda alloy, was detected. However, the precipitates along the grain boundary were detected only at the slow cooling rate and they increased inversely proportional to the burn-out temperature. This might be due to the time difference which solute atom could diffuse. EPMA and SEM results also demonstrated that the precipitate should be lamellar structure consisted of Ag rich phase(${\alpha}_1$) and Cu rich phase (${\alpha}_2$). In terms of corrosion, the galvanic coupling was formed due to the difference of composition between precipitates and matrix at the slow cooling rate. In the case of water quenching, the critical current density($i_p$) which indicate the degree of corrosion was lowest at $650^{\circ}C$ and below the burnout temperature, $i_p$ increased with it because of the effect of grain boundary segregation. But above the temperature, $i_p$ increased with it. This may be due to the strain field effect by residual thermal stress.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.112-112
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• 2018

알루미늄 합금은 내구성과 내식성이 우수한 경량 재료이다. 그 중 Al-Mg계 5083 Al 합금은 가공성 및 용접성이 우수하여 선체 재료로 널리 이용되고 있다. 이는 선체 중량의 경량화로 인해, 연료비 절감과 빠른 선속 등 다양한 이점을 지니기 때문이다. 그러나 선박의 고속화에 따라 선체에 가해지는 유체충격이 증가하고, 압력 저하에 기인하여 캐비테이션-침식 손상이 증가할 뿐만 아니라, 염소이온이 존재하는 해수환경에서는 침식과 부식의 시너지효과로 인하여 재료의 손상이 더욱 가속화된다. 이에 대한 다양한 방지책들이 제안되고 있으나, 강한 충격압을 동반한 캐비테이션 침식-부식 복합 손상 환경에서는 다소 한계가 있다. 따라서 본 연구에서는 알루미늄 5083에 대하여 캐비테이션 환경 하에서 일정 전위를 인가하며 침식-부식 손상이 최소화 되는 전위 구간을 규명하고자 하였다. 먼저, 분극 실험을 선행하여 재료의 전기화학적 거동을 파악 한 후 적용 전위구간을 선정하여, 해당 전위를 인가한 상태에서 캐비테이션 실험을 실시하였다. 전기화학적 분극실험과 캐비테이션-전기화학 복합 실험은 $25^{\circ}C$의 해수 하에서 실시하였으며, 시험편의 노출면적은 $3.24cm^2$으로 하였다. 분극 실험은 개로전위로부터 +3 V까지 2 mV/s의 분극속도로 전위를 인가하였고, 기준전극으로 Ag/AgCl, 대극으로 백금전극을 사용하였다. 캐비테이션-전기화학 복합 실험은 정전위를 인가한 상태에서 대향형 진동법으로 진동수 20 kHz, 진폭 $30{\mu}m$ 진동을 20분간 가하였으며, 혼팁과 시험편 사이의 거리는 1 mm로 일정하게 유지하였다. 실험 후 표면 손상의 정량적 분석을 위해 인가된 전위별 전류밀도를 비교하고, 무게감소량을 측정하였으며, 손상경향 파악을 위하여 3D광학현미경과 주사전자현미경(SEM)을 통해 표면을 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.143-143
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• 2016

알루미늄 합금은 내구성과 내식성이 우수할 뿐만 아니라 다양한 표면개질을 통해 그 표면 특성을 더욱 향상시킬 수 있다. 특히 Al-Mg계 5083-H321 Al 합금의 경우 가공성 및 용접성이 우수하여 선체 재료로 널리 이용되는데, 이는 선체중량의 경량화가 가능하여 연료비 절감과 빠른 선속 등 다양한 이점을 지니기 때문이다. 그러나 선속의 고속화에 따라 선체에 가해지는 유체충격이 증가하고 정압 저하에 기인하여 캐비테이션-침식 손상이 증가할 뿐만 아니라 해수환경 특성 상염소이온의 존재로 부식이 가속화되는 등 침식 및 부식의 시너지효과로 손상은 크게 증가한다. 이에 대한 방지대책으로 다양한 표면개질 기법이 제안되고 있으나 강한 충격압이 동반된 캐비테이션 침식-부식 복합 손상 환경에서는 표면처리만으로는 불가능할 수 있다. 따라서 본 연구에서는 양극산화된 5083-H321을 대상으로 캐비테이션 환경 하에서 일정 전위를 인가하여 침식-부식 손상이 최소화되는 최적전위를 규명하고자 한다. 이를 위해 먼저 분극 실험을 통해 재료의 전기화학적 거동을 바탕으로 임의의 전위를 선정하고 해당 전위를 인가한 상태에서 캐비테이션 실험을 실시하였다. 이때 분극실험과 캐비테이션-전기화학 복합실험 모두 $25^{\circ}C$의 해수에서 실시하였으며, 전기화학적 분극실험은 유효면적이 $3.24cm^2$인 시편에 2 mV/s의 분극속도로 0 ~ -3 V 까지 인가하였고, Ag/AgCl 기준전극과 백금대극을 사용하였다. 캐비테이션-전기화학 복합 실험은 정전위를 인가한 상태에서 $30{\mu}m$의 진폭으로 20분간 실시하였으며, 혼팁과 시험편 사이의 거리는 1 mm로 일정하게 유지하였다. 실험 후 표면 손상의 정량적 분석을 위해 인가된 전위별 전류밀도를 비교하고, 무게감소량을 측정하였으며, 손상특성 분석을 위해 3D현미경과 주사전자현미경(SEM)을 통해 표면을 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Journal of Conservation Science
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• v.31 no.1
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• pp.21-27
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• 2015

The Phoenix-shaped Glass Ewer, which is No. 193 National Treasure, was seriously damaged by a unique form of green glass pieces when excavated among a number of burial accessories of Hwangnamdaechong known to have been formed in the 5th century. While it has long been exhibited at the National Museum of Korea since its treatment for conservation treatment at conservation science laboratory in 1984, the existing adhesive materials seriously deteriorated for the 30 years, and the condition was quite unstable. The epoxy resin used as a restorative materials turned yellowing due to the light and heat so much that it was no longer able to exhibit it in a stable and effective manner. As a result, a re-treatment for conservation was conducted lately. This study focuses on the three pieces of Gold wires used to carefully wrap up the handle of the Phoenix-shaped Glass Ewer broken into three pieces, which has not been studied so far. As for the analysis method for Gold wires, SEM-EDS and Stereo Microscope were used for nondestructive analysis. First of all, the result of the SEM-EDS analysis shows that the composition was Au 91.9 wt.%-Au 92.8 w.t% and Ag 5.9 wt.%-Ag 6.5 wt.%, which indicates that it was an alloy made of Au and Ag. The production technique of Gold wires was also observed by means of optical microscopes. In general, Gold wires were manufactured by a drawing process in which a lump of gold was beaten or pulled out of a hole or by a process of twisting a gold plate. However, Gold wires separated from the handle of the Phoenix-shaped Glass Ewer did not involve any trace of twisting on the surface. Rather, fine vertical stripes were observed with the sections filled up. Hence, it is thought that this Ewer went through a drawing process and then was mended. As a result, no certain relation with the golden mending material used for the Phoenix-shaped Glass Ewer was verified. The findings above indicate that most of the existing researches on Gold wires recognized them, not as separate remains, but merely as a component of other golden remains. Thus, there has been little systematic study on the manufacturing techniques of Gold wires. The future study on Gold wires may verify the correlation between the Gold wires used to fix the handle of the Phoenix-shaped Glass Ewer, which is examined in this study, with that of golden remains in the Silla era.

• Journal of Conservation Science
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• v.27 no.1
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• pp.1-11
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• 2011

For the silver artifacts in the Koryo Dynasty excavated from Neungnae-ri Ganghwa island, the metallographic section analysis and hardness and chemical analysis were conducted. After making samples in the similar ratio of the composition concentration, the changes of the microstructure were checked according to the working method and temperature. The results show that those silver artifacts are Au-Cu alloys with 2 to 6 % of Cu. From the results it is judged that Cu was artificially alloyed with them to keep the proper hardness and identified that they were gilded by the amalgamation process seeing that mercury was included at the guilt layer. Also the porous texture on the surface of them could be formed at over $400^{\circ}C$, therefore, it is assumed the hot working or heat treatment at over $400^{\circ}C$ were performed. In silver artifacts made by the relief and repousse, they have the similar composition analysis to other 7 artifacts but the hardness is lower than pure silver. Consequently from differences in the hardness, it can be inferred that the low hardness of silver artifacts is concerned with manufacturing techniques.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.49-55
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• 2006

The submicron $YBa_2Cu_3O_x$ powder was prepared by the sol-gel method. The particle size is distributed from 0.2 to 1.0 ${\mu}m$, which benefits to eliminate the micro-cracks formed in the $YBa_2Cu_3O_x$ films deposited by electrophoresis. The powder was single phase of $YBa_2Cu_3O_x$ examined by X-ray diffraction. In the sol-gel process the citrate gel was formed from citric acid and nitrate solution of $Y_2O_3$, $Ba(NO_3)_2$ and CuO. When pH values were adjusted to 6.4-6.7, $Ba(NO_3)_2$ could be dissolved in the citrate solution completely. Appropriate evaporative temperature of the sol-gel formation is discussed. Acetone is used as electrophoreticsolution, in which some water and iodine (0.2 g/1) and polyethylene glycol (2 vol. %) are added. The concentrations of $YBa_2Cu_3O_x$ powders is 20g/l. The thickness of deposited film could be more than 50 ${\mu}m$ in 3 minutes of depositing time. The most EPD films could be 90K zero resistance and the Jc values were over 1000A/cm2 (0 H, 77 K).