• Journal of Powder Materials
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• v.29 no.4
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• pp.283-290
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• 2022

A Cu-15Ag-5P filler metal (BCuP-5) is fabricated on a Ag substrate using a high-velocity oxygen fuel (HVOF) thermal spray process, followed by post-heat treatment (300℃ for 1 h and 400℃ for 1 h) of the HVOF coating layers to control its microstructure and mechanical properties. Additionally, the microstructure and mechanical properties are evaluated according to the post-heat treatment conditions. The porosity of the heat-treated coating layers are significantly reduced to less than half those of the as-sprayed coating layer, and the pore shape changes to a spherical shape. The constituent phases of the coating layers are Cu, Ag, and Cu-Ag-Cu3P eutectic, which is identical to the initial powder feedstock. A more uniform microstructure is obtained as the heat-treatment temperature increases. The hardness of the coating layer is 154.6 Hv (as-sprayed), 161.2 Hv (300℃ for 1 h), and 167.0 Hv (400℃ for 1 h), which increases with increasing heat-treatment temperature, and is 2.35 times higher than that of the conventional cast alloy. As a result of the pull-out test, loss or separation of the coating layer rarely occurs in the heat-treated coating layer.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.41-48
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• 2000

In this study, microstructure and mechanical properties and electrical conductivities of in situ Cu-Fe-Xi(Xi=Ag, Cr or Co) alloy wires obtained by cold drawing combined with intermediate heat treatments have investigated. During cold working the primary and secondary dendrite arms are aligned along the drawing direction and elongated into filaments after deformation processing. The addition of Ag was found to be more effective in reducing the microstructural scale at the given draw ratio than that of Co or Cr throughout the drawing processing. The ultimate tensile strength and the conductivity of the Cu-Fe based composites containing Ag were higher than those of Cu-Fe composites containing Co or Cr. The good mechanical and electrical properties of Cu-Fe-Ag wires may be associated with the more uniform distribution of the finer filaments in the wires containing silver. The strength of Cu-Fe-Xi composites is dependent on the spacing of the Fe filaments in accord with a Hall-Petch relationship. The fracture surfaces of all the specimens showed ductile-type fracture and iron filaments occasionally observed on the fracture surfaces.

• The Journal of Advanced Prosthodontics
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• v.7 no.1
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• pp.56-61
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• 2015

PURPOSE. The purpose of this study was to evaluate the effects of the surface treatment and shape of the dental alloy on the composition of the prosthetic work and its metallic ion release in a corrosive medium after casting. MATERIALS AND METHODS. Orion Argos (Pd-Ag) and Orion Vesta (Pd-Cu) were used to cast two crowns and two disks. One of each was polished while the other was not. Two as-received alloys were also studied making a total of 5 specimens per alloy type. The specimens were submersed for 7 days in a lactic acid/sodium chloride solution (ISO standard 10271) and evaluated for surface structure characterization using SEM/EDAX. The solutions were quantitatively analysed for the presence of metal ions using ICP-MS and the results were statistically analysed with one-way ANOVA and a Tukey post-hoc test. RESULTS. Palladium is released from all specimens studied (range $0.06-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$), with the Pd-Cu alloy releasing the highest amounts. For both types of alloys, ion release of both disk and crown pairs were statistically different from the as-received alloy except for the Pd-Ag polished crown (P>.05). For both alloy type, disk-shaped pairs and unpolished specimens released the highest amounts of Pd ions (range $0.34-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). Interestingly, in solutions submerged with cast alloys trace amounts of unexpected elements were measured. CONCLUSION. Shape and surface treatment influence ion release from dental alloys; polishing is a determinant factor. The release rate of cast and polished Pd alloys is between $0.06-0.69{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$, which is close to or exceeding the EU Nickel Directive 94/27/EC compensated for the molecular mass of Pd ($0.4{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). The composition of the alloy does not represent the element release, therefore we recommend manufacturers to report element release after ISO standard corrosion tests beside the original composition.

• Journal of the Korean institute of surface engineering
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• v.15 no.4
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• pp.192-207
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• 1982

A study has been made of the interaction parameters of Zn other elements in dilute solutesd solution of molten cadmium alloys over the temperature range of 450 to 570$^{\circ}C$. The experi-mental measurementss were made in a touch instant cell using a fusedd Licl-KCl electrolyte. The activity of zinc in binary and ternary solutions sexhibiteds a strong positive deviation from Raoult's law. The addition of silver, indium or lead increased the activity of zinc whereas addition of copper, bismuth or tin decreased the zinc activity slightly. The results for all the metallic solutions showed a linear dependence of reciprocal of ab-solute temperature over the experimental range. The interaction parameters obtained are as follows.

• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1231-1236
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• 1996

The electrode resistance of semiconducting PTC BaTiO3 ceramic material was studied in some detail. Comme-rical In-Ag paste In-Ga alloy and electroless plated Ni as well as evaporated Al were chosen as electrode. The contact resistance of electroded samples were measured by both dc resistivity and ac impedance analysis. The aging effect on contact resistance under cyclic loading from -1$0^{\circ}C$ to 85$^{\circ}C$ was also monitored for the prolonged period of time. In case of Al electroded samples the heat treatment and protective coating had effects on the stability against contact resistance degradation. It was also found that the samples with commercial In-Ag paste and electroless plated Ni electrode had good properties of contact resistance against aging.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Ceramic Society
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• v.35 no.1
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• pp.79-87
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• 1998

Melt spun YbBa2Cu3Agx(x=0, 5, 12, 16 and 53) precursor alloy ribbons were oxidized at 263-330$^{\circ}C$ and treated at 820$^{\circ}C$, 855$^{\circ}C$ and 885$^{\circ}C$ under 1.0 atm oxygen pressure. In the ribbons treated at 820$^{\circ}C$, 855$^{\circ}C$and 885$^{\circ}C$ 1-2-4 phase (YbBa2Cu4O8) and 1-2-3 phase (YbBa2Cu3O{{{{ OMICRON _7-$\delta$ }})were formed respectively. The shape of 1-2-4 phase was distorted or ellipsoid. The 2-4-7 and 1-2-3 phases tooked the shape of bar. All the ribbons showed zero critical current density Jc at 77K in zero magnetic field. By considering the shape and the highest critical temperature (among the three phases) of the 1-2-3 phase we tried to increase the critical current density of the ribbons treated at 885$^{\circ}C$ by press deformation. About tenribbons were stacked and coupled by press deformation and then treated at 885$^{\circ}C$ These 1-2-3 phase did not show any texture in any of the ribbons. However they exhibited weak texture in the multilayered specimens. Among the multilayered specimens YbBa2Cu3Ag16 exhibited a Jc of 180 A/cm2 Among the above ribbons YbBa2Cu3Ag16 ribbon has the optimum composition to produce textured superconducting oxide with improved Jc by press deformation. Onset critical temperatures Ton of the multilayered YbBa2Cu3Agx(x=5, 12, 16 and 53) were measured as 88-90 K.

• Korean Journal of Acupuncture
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• v.31 no.3
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• pp.125-135
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• 2014

Objectives : Warm needling is the method combining the effects of acupuncture and moxibustion. In modern clinics, warm needling is only affected by treatment time or frequency. We need to study the physical characteristics of warm needles currently used in clinics in order to develop more efficient and economical treatments. Methods : We collected various warm needle specimens and analyzed chemical constitutions, measured heat transfer velocity, micro Vicker's hardness and specific resistance. We studied the relationship between heat transfer velocity and micro Vicker's hardness as well as that between heat transfer velocity and specific resistance. Results : The heat transfer velocity of the Silver_HL was 3.3 mm/sec, of the Au alloy group was 1.3~2.6 mm/sec, and Silver_IN, Silver_ZK and SS groups was less than 0.3 mm/sec. We therefore concluded that the needle composed of Ag has the best heat transfer velocity. In the Micro Vicker's hardness test, Vicker's hardness of the Au alloy group was 159~170 Hv, of Silver_HL was 181 Hv, and of the Silver_IN, Silver_ZK, SS group was 450.8~519 Hv. In the Silver_IN, Silver_ZK and SS groups, hardness was inversely proportial to thermal conductivity. In the specific resistance test, the specific resistance of Silver_HL was the lowest, that of the Au alloy group was the second lowest, and that of the Silver_IN, Silver_ZK, SS groups were the highest. Conclusions : We concluded that the needle composed of Ag has the best heat transfer velocity, highest electric conductivity and thermal conductivity, therefore the needle composed of Ag is suitable for warm needling.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.83-89
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• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• Korean Journal of Heritage: History & Science
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• v.49 no.2
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• pp.172-189
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• 2016

In this research, literature research on the Odong material, mixture ratio, casting method and casting facility was conducted on contemporary documents, such as Cheongong Geamul. Also, a long sword was produced using the Odong inlay technique. The sword reproduction steps were as follows; Odong alloying, silver soldering alloying, Odong plate and Silver plate production, hilt and sheath production, metal frame and decorative elements, such as a Dugup (metal frame), production, Odong inlay assembly and final assembly. For the Odong alloy production, the mixture ratio of the true Odong, which has copper and gold ratio of 20:1, was used. This is traditional ratio for high quality product according to $17^{th}$ century metallurgy instruction manual. The silver soldering alloy was produced with silver and brass(Cu 7 : Zn 3) ratio of 5:1 for inlay purpose and 5:2 ratio for simple welding purpose. The true Odong alloy laminated with silver plate was used to produce hilt and sheath. The alloy went through annealing and forging steps to make it into 0.6 mm thick plate and its backing layer, which is a silver plate, had the matching thickness. After the two plates were adhered, the laminated plate went through annealing, forging, engraving, silver inlaying, shaping, silver welding, finishing and polishing steps. During the Odong colouring process, its red surface turns black by induced corrosion and different hues can be achieved depending on its quality. To accomplish the silver inlay Odong techniques, a Hanji saturated with thirty day old urine is wrapped around a hilt and sheath material, then it is left at warm room temperature for two to three hours. The Odong's surface will turn black when silver inlay remains unchanged. Various scientific analysis were conducted to study composition of recreated Odong panel, silver soldering, silver plate and the colouring agent on Odong's surface. The recreated Odong had average out at Cu 95.57 wt% Au 4.16wt% and Cu 98.04 wt% Au 1.95wt%, when documented ratio in the old record is Cu 95wt% and Au 5wt%. The recreated Odong was prone to surface breakage during manufacturing process unlike material made with composition ratio written in the old record. On the silver plate of the silver and Odong laminate, 100wt% Ag was detected and between the two layers Cu, Ag and Au were detected. This proves that the adhesion between the two layers was successfully achieved. The silver soldering had varied composition of Ag depending on the location. This shows uneven composition of the silver welding. A large quantities of S, that was not initially present, was detected on the surface of the black Odong. This indicates that presence of S has influence on Odong colour. Additional study on the chromaticity, additional chemical compounds and its restoration are needed for the further understanding of the origin of Odong colour. The result of Odong alloy testing and recreation, Odong silver inlay long sword production, scientific analysis of the Odong black colouring agent will form an important foundation of knowledge for conservation of Odong artifact.