• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.150.2-150.2
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• 2017

This research was conducted to investigate in detail the effect of $PO_4{^{3-}}$, $CO_3{^{2-}}$ and $F^-$ anions on the electrochemical properties of the thin air-formed oxide film-covered AZ31 Mg alloy. In this work, native air-formed oxide films on AZ31 Mg alloy samples were prepared by knife-abrading method and the changes in the electrochemical properties of the air-formed oxide film were investigated in electrolytes containing 0.01 M, 0.05 M and 0.1 M of $PO_4{^{3-}}$, $CO_3{^{2-}}$ and $F^-$ anions. It was observed that the trend of open circuit potential (OCP) transients changed only in the solution containing $PO_4{^{3-}}$ ions. The Nyquist plots obtained from electrochemical impedance spectroscopy (EIS) showed that the resistance of the new surface films formed in fluoride ion containing bath increased with the increase in concentration of fluoride ions but the resistance of surface films formed in carbonate ion containing bath decreased with the increase in concentration of carbonate ions. The potentiodynamic polarization curves illustrated that under anodic polarization, there was growth of porous passive layer only in fluoride ion containing solution while the surface layer formed in phosphate and carbonate ion containing solutions lost its passivity at high anodic potential of $2.5V_{Ag/AgCl}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.53-53
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• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• 대한치과기공학회지
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• 제21권1호
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• pp.15-26
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• 1999

This study was carried out by observing to composition of oxide on the surface of dental porcelain low gold alloy with various Indium additions according to the degassing and analysing the change composition of additional elements In on diffusion behaviors of Porcelain-matal surface. The specimens used were Au-Pd-Ag alloys by small indium addition. These specimens were treated for 10min at $1000^{\circ}C$ in vacuum condition. To investigate the microsturcture of oxidized alloy surface, SEM and EDAX were used, and EPMA were used to investigate the diffusion behaviors of porcelain-metal surface. X-ray diffraction were used to observe the morphological changes in the oxidation zone. The results of this study were obtained as follows ; 1) The hardness of alloy increased with increasing amount of In addition. 2) The formation of oxidation increased with increasing In content after heat treatment. 3) Diffusion of indium elements increased with increasing In content in metal-porcelain surface after firing. 4) The oxidations of alloy surface were mainly $In_2O_3$.

• 한국주조공학회지
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• 제34권2호
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• pp.54-59
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• 2014

In this study, the extruded Al-6.3Zn-2.4Mg alloys were selected among the 7000 series aluminum alloys sensitive to hydrogen environment in order to examine the effects of both the aging conditions and the length of hydrogen charging period on the mechanical properties of the alloy. The specimens were aged for 24hours at $100^{\circ}C$ (under aging (UA)), $120^{\circ}C$ (peak aging (PA)), and $160^{\circ}C$ (over aging (OA)), respectively. Charging tests were performed at RT for 12, 24, 36 hours under potentiostatic conditions (-2000 mV vs (Ag/AgCl)) for 12, 24 and 36 hours in 1M $H_2SO_4$ and 0.1%$NH_4SCN$ solution. The fracture surface was examined by scanning electron microscopy (SEM). X-ray diffraction (XRD) pattern in peak aged sample was obtained before and after hydrogen charging from extruded Al-6.3Zn-2.4Mg alloys. The decreasing rate of tensile strength and elongation is represented in order of over aging < under aging < peak aging, and it is believed that the hydrogen recharge is more sensitive to elongation than tensile strength. The formation of $AlH_3$ in hydrogen charged Al-6.3Zn-2.4Mg alloys has been confirmed by X-ray diffraction studies.

• 한국주조공학회지
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• 제23권5호
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• pp.244-250
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• 2003

The aim of this study is fabricating of composite filler metal (CFM) by a combination of selective laser sintering (SLS) of stainless steel powders (RapidSteel $2.0^{TM}$ and liquid phase infiltration of Ag-28 wt.%Cu alloy. Porous stainless steel body with inter-connected pore channels was fabricated by SLS, binder decomposing and densification processes. By the direct contact infiltration, the narrow inter-particle channels of the porous body were completely filled with the Ag-28 wt.%Cu alloy infiltrant. During infiltration, the dissolved elements of Fe, Ni and Cr from the porous body were solved into copper solid solution phases, which consist of eutectic structure of composite metal matrix. The S10C/CFM/S10C joints, which have narrow clearance gaps between them up to 10 micrometers, were joined successfully by self-feeding of filler metal from the matrix of CFM. The CFM kept its original thickness and microstructure after brazing. The tensile strength of brazed specimen was higher than 30 kgf/$mm^2$ and showed a typical ductile fracture mode in the CFM.

• Transactions on Electrical and Electronic Materials
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• 제16권3호
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• 제28권3호
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• 한국주조공학회지
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• 제17권3호
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• 공업화학
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• 제16권5호
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• pp.641-647
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• 2005

메탄의 부분산화반응은 수소 제조의 중요한 반응 중의 하나이다. 무전해 도금방법에 의해 제조된 팔라듐-은 막을 막반응기(membrane reactor)로서 메탄의 부분산화반응에 적용하여 반응온도, $O_2/CH_4$ 몰비, $CH_4$ 공급속도, $N_2$ 운반 가스 흐름속도 등의 변화에 따라 실험을 수행하였다. 막반응기의 메탄 전환율은 알루미나에 담지된 니켈 촉매를 사용하는 반응조건하에서 $350{\sim}730^{\circ}C$의 반응온도에 따라 증가하는 경향을 보였으며, 특히 $730^{\circ}C$와 $O_2/CH_4$ 몰비 0.5에서 메탄 전환율과 CO 선택도가 가장 높았다. 막반응기의 메탄 전환율은 전통적인 관형반응기와 비교한 결과 반응조건에 따라 10~40% 정도 높았다.