• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.137-143
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• 2008

Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of the SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that the SnAgCu solder has longer fatigue life than the SnPb solder in temperature cycling analyses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.32-37
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• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• Progress in Superconductivity
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• v.1 no.1
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• pp.61-67
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• 1999

We evaluated the effect of alloying element additions to Ag sheath on mechanical, electrical and thermal properties of Bi-2223. Additions of Au, Pd and Mg to Ag sheath increased hardness and strength, while reduced elongation and electrical and thermal conductivity. In addition, microstructural investigation showed that the grain size of Ag significantly decreased with increasing content of alloying elements. The improvements in strength and hardness are believed to be due to the presence of alloying elements that lead to strengthen materials by combined effects of solid-solution, dispersion hardening and grain size hardening. Thermal conductivity of Ag and Ag alloys was evaluated in the temperature range from 77 K to 300 K, and com-pared to calculated value obtained by Wiedermann-Franz law. It was observed that the thermal conductivity decreased with increasing the content of alloying elements. Specifically, the thermal conductivity of $Ag_{0.92}Pd_{0.06}Mg_{0.02}$ alloy was measured to be $48.2W/(m{\cdot}K)$ at 77 K, which is about 6 times lower than that of $Ag(302.6W/(m{\cdot}K))$.

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.791-795
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• 2005

In this study, aluminum borate whisker reinforced Mg-3Al-2Ag-1Zn matrix composites were fabricated by the squeeze infiltration technique. The purpose is to develop materials for elevated temperature applications. Microstructure observation revealed successful fabrication of the metal matrix composites, namely no cast defects such as porosity and matrix/reinforcement interface delamination etc. High temperature hardness and creep rupture properties were improved significantly with addition of Ag to the Al borate whisker reinforced Mg alloy composite. $Mg_3Ag$ phase formed during aging heat treatment could improve creep properties of the Mg matrix composites.

• Progress in Superconductivity and Cryogenics
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• v.5 no.3
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• pp.15-19
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• 2003

For the purpose of standardization of the critical current measurement, it is meaningful to describe how $I_{c}$ will behave as the stress/strain level changes. In this study, strain dependencies of the critical current $I_{c}$ in Ag-alloy sheathed multifilamentary Bi(2212) and Bi(2223) superconducting tapes were evaluated at 77K, 0T. The external reinforcement was accomplished by soldering AgMgNi alloy tapes onto single or both sides of the sample. With the external reinforcement to the Bi(2212) tape, the strength of the tapes increased but the critical current at the strain free state, $I_{c0}$ decreased in some cases. The strain for onset of the $I_{c}$ degradation, $\varepsilon$$_{\irr}$, increased with an increase of the reinforcing volume and then saturated to a certain value. The effect of external reinforcement on the degradation of $I_{c}$ due to the bending strain in the Bi(2223) tape was also examined. Contrary to the expectation, it showed a significant $I_{c}$ degradation even at a small strain of 0.4 %. The observations of damage morphologies gave a good explanation to the $I_{c}$ behavior.c/ behavior.r.

• Nuclear Engineering and Technology
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• v.51 no.3
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• pp.647-653
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• 2019

A comprehensive study of photon interaction features has been made for some alloys containing Pd and Ag content to evaluate its possible use as alternative gamma radiations shielding material. The mass attenuation coefficient (${\mu}/{\rho}$) of the present alloys was measured at various photon energies between 81 keV - 1333 keV utilizing HPGe detector. The measured ${\mu}/{\rho}$ values were compared to those of theoretical and computational (MCNPX code) results. The results exhibited that the ${\mu}/{\rho}$ values of the studied alloys are in same line with results of WinXCOM software and MCNPX code results at all energies. Moreover, Pd75/Ag25 alloy sample has the maximum radiation protection efficiency (about 53% at 81 keV) and lowest half value layer, which shows that Pd75/Ag25 has superior gamma radiation shielding performance among the compared other alloys.

• Proceedings of the Korean Vacuum Society Conference
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• 1994.02a
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• pp.36-36
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• 1994

• Proceedings of the Korean Magnestics Society Conference
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• 2008.12a
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• pp.254.1-254.1
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• 2008

• Journal of Korea Foundry Society
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• v.18 no.6
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• pp.570-577
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• 1998

An investigation has been conducted to describe solidification characteristics in Sn-Zn binary system and Sn-Zn-Ag ternary system added by Ag produced by the continuous casting process using heated mold as a basic study for developing Pb-free solder materials. To obtain the continuous casting rods with mirror surface and near net shape at higher casting speed, water flow rates must be increased and mold temperature must be lowered. However, surface tearing in the casting rods occured at lower continuous casting speed while break out occured at higher continuous casting speed even if optimum conditions such as water flow rate and heated mold temperature are determined. Primary ${\alpha}Sn$ and eutectic structure in unidirectioally solidified Sn-Zn alloys were finer with increased casting speed. But, directionality may not be expected for primary Zn in hypereutectic Sn-Zn alloy. It was found that the addition of $0.2{\sim}0.8%$ Ag promoted the growth of primary ${\alpha}Sn$ dendrites. The changes of tensile strength and elongation in Sn-Zn binary alloys were not observed while the increase of tensile strength and the decrease of elongation in Sn-Zn-Ag ternary alloys were observed with increased casting speed.