• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.96-98
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• 2003

Many of research efforts have been focused on the improvement of critical current density Jc of silver-sheathed Bi-2223 tapes for practical applications of material. Bi-2223 superconducting wires with 55 filaments were fabricated by stacking, drawing process with different heat-treatment histories. After rolling process, Bi-2223 tapes were heat-treatment at 780~826$^{\circ}C$ with variable mass flow rate of mixed gas. In this study, the effect of changes in the variable mass flow rate of mixed gas during the heat treatment of Bi-2223/Ag tapes has been investigated. Distinct differences were observed in the Bi-2223 phase and critical current as flow rate of mixed gas. We could achieve proper conditions of mass flow rate of mixed gas for Ag-alloy clad Bi-2223 superconducting tapes.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.132-133
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• 1996

• Progress in Superconductivity and Cryogenics
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• v.10 no.1
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.942-943
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• 2006

To meet the demands for use in extremely abrasive and corrosive environments, a new material was developed. The VeKo25Cr distinguishes itself through specifically selected amounts of carbon and carbide forming elements such as Cr, Mo, V, W and Nb. The alloy is based on a Fe matrix. The strength after heat treatment and the wear and corrosion properties are compared to those of other materials. VeKo25Cr can be combined with easy-to-process materials such that the difficult handling is minimized to those places on the piece most subjected to operational wear.

• Bulletin of the Korean Chemical Society
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• v.16 no.4
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• pp.321-325
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• 1995

Adsorption mechanisms of diisobutyl dithiophosphinate (DIBDTPI) and diisobutyl monothiophosphinate (DIBMTPI) on gold and gold-silver alloys (80:20 and 50:50) have been studied. The adsorption mechanisms on gold-silver alloys can be explained by the EC mechanism involving an electron transfer step and a chemical reaction step. Thus, the adsorption should be controlled by the E of the electrochemical oxidation of the electrode involved and the pK of the metal collector complex. Both di- and mono- thiophosphinate adsorb on 50:50 Au-Ag alloy at lower potential than on 80:20 Au-Ag alloy surface. There are no significant differences between the reactivities of DIBDTPI and DIBMTPI with precious metals except that the dithio- compound can be oxidized to dimer on gold at high potentials, while the monothio- homologue cannot. In this regard, DIBDTPI may be a better surface active reagent for pure gold than DIBMTPI.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.930-936
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• 2011

In the present study, we show that the addition of Ag, an element having a positive enthalpy of mixing with Cu in the liquid state, enables the simultaneous enhancement of the glass forming ability and the plasticity in Cu-Zr-Ag bulk metallic glasses (BMGs). Rods of 4 mm diameter could be prepared with a fully amorphous structure and values of plastic strain up to 18% were measured under a compression mode for compositions around $Cu_{42.5}Zr_{47.5}Ag_{10}$. The possible role of Ag in the change of the atomic structure and the enhancement of the plastic strain in the ternary Cu-Zr-Ag BMGs is discussed based on analyses from transmission electron microscopy and EXAFS (extended X-ray absorption fine structure).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.133-137
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• 2003

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.11-22
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• 2015

Pd alloy hydrogen membranes for hydrogen purification and separation need thermal stability at high temperature for commercial applications. Intermetallic diffusion between the Pd alloy film and the porous metal support gives rise to serious problems in long-term stability of Pd alloy membranes. Ceramic barriers are widely used to prevent the intermetallic diffusion from the porous metal support. However, these layers result in poor adhesion at the interface between film and barrier because of the fundamentally poor chemical affinity and a large thermal stress. In this study, we developed Pd alloy membranes having a dense microstructure and saturated composition on modified metal supports by advanced DC magnetron sputtering and heat treatment for enhanced thermal stability. Experimental results showed that Pd-Cu and Pd-Ag alloy membranes had considerably enhanced long-term stability owing to stable, dense alloy film microstructure and saturated composition, effective diffusion barrier, and good adhesive interface layer.

• Korean Journal of Dental Materials
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• v.43 no.4
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• pp.317-322
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• 2016

The effect of ice-quenching after degassing on the hardness change during simulated porcelain firing in a metal-ceramic Pd-Au-Ag alloy was investigated by means of hardness test, field emission scanning electron microscopic observations, and X-ray diffraction analysis. The hardness decreased by ice-quenching after degassing, which was induced by the homogenization of the ice-quenched specimen. The decreased hardness by ice-quenching after degassing was recovered from the 1st opaque stage which was the first stage of the remaining firing process for bonding porcelain. The microstructural change showed that the increase in hardness during the remaining firing process was caused by precipitation. The ice-quenching after degassing did not affect the hardness change during the subsequent porcelain firing process.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.1-9
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• 2002

The metallurgical reaction properties between the pad consisted of 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu layers on a conventional ball grid array (BGA) substrate and In-15 (wt.%)Pb-5Ag solder ball were characterized during the reflow process and solid aging. During the reflow process of 1 to 5 minutes, it was observed that thin $AuIn_2$ or Ni-In intermetallic layer was formed at the interface of solder/pad. The dissolution rate of the Au layer into the molten solder was about $2\times 10^{-3}$ $\mu\textrm{m}$/sec which is remarkably low in comparison with a eutectic Sn-37Pb solder. After solid aging treatment for 500 hrs at $130^{\circ}C$, the thickness of $Ni_{28}In_{72}$ intermetallic layer was increased to about 3 $\mu\textrm{m}$ in all the conditions nevertheless the initial reflow time was different. These result show that In atoms in the solder alloy were diffused through the $AuIn_2$ phase to react with underlaying Ni layer during solid aging treatment. From the microstructural observation and shear tests, the reaction properties between In-15Pb-5Ag alloy and Au/Ni surface finish were analyzed not to trigger Au-embrittlement in the solder joints unlike Sn-37Pb composition.