• 한국재료학회지
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• 제23권7호
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• pp.379-384
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• 2013

In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.953-955
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• 2006

In this work we compared different sources of composition of Ag powders obtained by dry and wet process on the photolithographic patterning of PDP electrode and resistance of sintered Ag electrode. It was found that 90 : 10 wt% ratio of Ag powder made by dry and wet processes gave optimum result both on the PDP electrode pattern and resistance of PDP electrode after sintering.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.90.1-90.1
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• 2012

1934년 J. R. Winkler에 의해 처음으로 개발된 pulse current 도금은 연속적인 직류 단속을 이용한 전기도금으로써 종래의 연속적인 직류(direct current) 전기 도금이 가지는 다공성 및 거친 도금 등의 한계를 극복하기 위해 연구되고 있다. 최근 전기 전자 산업의 급속한 발달과 함께 Au, Pd, Rh 등의 귀금속 도금에 있어서 Pulse 도금은 광택, 다공도, 내부 응력, 불순물 및 수소 함유량의 감소와 같은 특성 향상을 가질 수 있으며 기존 DC 전기 도금의 문제점 해결책으로서 많은 연구가 이루어지고 있다. 하지만 현재까지 Pulse 도금의 정확한 기구(mechanism)에 대한 명확한 정립이 되어 있지 않아 모든 도금계에 적용할 수 있는 standard pattern이 없는 실정이다. 본 연구에서는 귀금속 도금 중 Ag pulse 도금에 있어서 Peak current density, duty cycle, time이 Ag 도금의 표면 형상, 두께, 열전도율에 미치는 영향에 대해 연구하였다.

• 대한화학회지
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• 제59권2호
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• pp.132-135
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• 2015

Bonding force and stiffness in amine-linked single-molecule junctions for Ag electrodes were measured using a home-built conducting atomic force microscope under ambient conditions at room temperature. For comparison, Au electrodes were used to measure the rupture force and stiffness of the molecular junctions. The traces of the force along with the conductance showed a characteristic saw-tooth pattern owing to the breaking of the metal atomic contacts or the metal-molecule- metal junctions. We found the rupture force and stiffness for Ag are smaller than those for Au electrodes. Furthermore, we observed that the force required to break the amine-Ag bond in the conjugated molecule, 1,4-benzenediamine, is smaller than in 1,4-butanediamine which is fully saturated. These results consist with the previous theoretical calculations for the binding energies of the nitrogen bonded to Ag or Au atoms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국세라믹학회지
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• 제44권3호
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• 한국인쇄학회지
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• 제29권2호
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• Current Photovoltaic Research
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• 제4권2호
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• pp.64-67
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• 2016

We investigated the influences of Ag nanoparticle (NP) arrays and surface nanohole (NH) patterns on the optical characteristics of 10-${\mu}m$-thick c-Si wafers using finite-difference time-domain (FDTD) simulations. In particular, we comparatively studied the plasmonic effects of both monomer arrays (MA) and heptamer arrays (HA) consisting of identical Ag NPs. HA improved the optical absorption of the c-Si wafers in much wider wavelength range than MA, with the help of hybridized plasmon modes. The light trapping capability of the NH array pattern is superior to that of the Ag plasmonic NPs. We also found that the addition of the Ag HA on the wafers with surface NH patterns further enhanced optical absorption: the expected short-circuit current density was as high as $34.96mA/cm^2$.

• Bulletin of the Korean Chemical Society
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• 제32권10호
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• pp.3581-3586
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• 2011

Silver nanoparticle (Ag-NPs)-immobilized and amine-functionalized carbon nanotubes (MWCNTs), MWCNT-Ag-$NH_2$, were easily prepared in order to develop an efficient delivery system of biomolecules without complicated processes of manufacture. For this, Ag-NPs-immobilized MWCNTs, MWCNT-Ag, were initially prepared in order to create large surface area to enable more efficient linkage with guest-molecules using pristine MWCNTs. The Ag-NPs on MWCNTs were further positively functionalized with 2-aminoethanthiol to allow ionic linkage with biomolecules. Ultimately, the positively charged delivery system proved to be highly effective for the binding capacity of bovine serum albumin (BSA) as a negatively charged model protein, when compared to that of lysozyme used as a positively charged model protein. The releasing profile of BSA was observed in almost linear pattern for about two weeks in a saline solution. This study demonstrated the potential usefulness of the pristine MWCNTs in conjunction with Ag-NPs for the selective delivery of many (negatively or positively) charged biomolecules including proteins and genes.

• Journal of Yeungnam Medical Science
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• 제13권2호
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• pp.272-278
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• 1996

B형 간염 표면항원(HBsAg)의 4가지 주요 아형 조사를 통해 HBsAg과 B형 간염표면항체가 모두 양성인 환자에서 항원과 항체의 아형이 다름을 밝힘으로 항원-항체 공존을 이해하게 되었으며, 감염경로를 추적하는 역학적 조사, 인구이동양상의 지표에 유용하게 사용될 수 있다. 현재까지 우리나라의 HBV 아형에 관한 연구는 전체적인 빈도의 조사나 HBsAg과 anti-HBs가 공존하는 경우에서 아형이 가지는 의미에 대한 것이 전부였다. 본 연구에서는 영남대학교 의과대학 부속병원에서 만성 간질환으로 진단받고 경과추적중인 HBsAg 양성인 환자 214명을 대상으로 혈청에 존재하는 HBsAg 아형을 단세포군 항체를 이용한 혈청학적 방법으로 조사하였다. 214명의 검체중 206명(93.9%)에서 adr, 6명(2.8%)에서 adw, 2명(0.9%)에서 ayr, 2명(0.9%)에서 ar, 3명(1.4%)에서 adwr로 나타났으며 ayw는 한 례에서도 발견되지 않았다. 아형과 질환의 중증도 사이에는 유의한 연관성은 발견되지 않았다. 결론적으로 만성 간질환 환자에서 adr이 가장 많고 질환의 중증도와 아형간에 유의한 연관성은 발견되지 않았지만, 아형이 만성 B형 바이러스 간염의 간경변증이나 간세포암으로의 진행과 예후에 영향을 미치는지 밝히기 위해서는 좀 더 연구를 진행하여야 할 것이다.