• 제목/요약/키워드: Ag nanoparticle ink

검색결과 12건 처리시간 0.031초

전도성 잉크의 레이저 열경화 공정 시 온도에 따른 비저항 연구 (Study of Specific Resistance of Conductive Ink According to Temperature During Laser Sintering Process)

  • 이대건;박용한;박지용;김동근;문윤재;문승재;황준영;강희석
    • 대한기계학회논문집B
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    • 제37권2호
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    • pp.119-124
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    • 2013
  • 본 연구에서는 전도성 잉크의 레이저 열경화 공정시 은 나노입자 잉크의 레이저 열경화 공정 온도를 수치해석하였다. 유리기판 위에 잉크젯 프린팅을 이용하여 인쇄한 은 나노 입자 잉크를 532 nm 파장의 CW 레이저를 각기 다른 세기로 60 초 동안 조사하여 가열하였다. 온도계산을 위해서, 열생성항에 들어가는 반사율을 구하였고, 레이저 조사 중 실시간 은 나노입자 잉크의 비저항을 측정하였다. 온도 계산은 2차원 열전도 방정식에 Wiedemann-Franz law 를 적용하였다. 그 결과, 레이저 조사로 인해 인쇄된 잉크의 온도가 상승할수록 비저항이 떨어지는 결과를 확인하였다.

유연소자 응용을 위한 은 나노입자의 레이저 소결 (Laser Sintering of Silver Nanoparticle for Flexible Electronics)

  • 지석영;박원태;노용영;장원석
    • 한국생산제조학회지
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    • 제24권1호
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    • pp.135-139
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    • 2015
  • We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of $5{\mu}m$ and conductivity of $4.2{\times}10^5S/cm$ (bulk Ag has a conductivity of $6.3{\times}10^5S/cm$) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel.

정전류 전기 소결법을 이용한 Ag 전극 배선의 전도성 향상 (Enhancement of Electrical Conductivity for Ag Grid using Electrical Sintering Method)

  • 황준영;문윤재;이상호;강경태;강희석;조영준;문승재
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.114.1-114.1
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    • 2011
  • Electrical sintering of the front electrode for crystalline silicon solar cells was performed applying a constant DC current to the printed lines. Conducting lines were printed on glass substrate by a drop-on-demand (DOD) inkjet printer and silver nanoparticle ink. Specific resistance and microstructure of sintered silver lines and were measured with varying DC current. To find the relation between temperature increase with changing applied current and specific resistance, temperature elevation was also calculated. Sintering process finished within a few milliseconds. Increasing applied DC current, specific resistance decreased and grain size increased after sintering. Achieved minimum specific resistance is approximately 1.7 times higher than specific resistance of the bulk silver.

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잉크젯 프린팅된 은(Ag) 박막의 등온 열처리에 따른 미세조직과 전기 비저항 특성 평가 (Microstructure and Electrical Resistivity of Ink-Jet Printed Nanoparticle Silver Films under Isothermal Annealing)

  • 최수홍;정정규;김인영;정현철;정재우;주영창
    • 한국재료학회지
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    • 제17권9호
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    • pp.453-457
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    • 2007
  • Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

레이저 기반 플라즈모닉 어닐링을 통한 은 나노입자 자가 생성 및 소결 공정과 이를 활용한 메탈메쉬 전극 기반 투명 웨어러블 히터 (Ag Nanoparticle Self-Generation and Agglomeration via Laser-Induced Plasmonic Annealing for Metal Mesh-Based Transparent Wearable Heater)

  • 황윤식;남의연;김연욱;우유미;허재찬;박정환
    • 한국전기전자재료학회논문지
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    • 제35권5호
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    • pp.439-444
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    • 2022
  • Laser-induced plasmonic sintering of metal nanoparticles (NPs) is a promising technology to fabricate flexible conducting electrodes, since it provides instantaneous, simple, and scalable manufacturing strategies without requiring costly facilities and complex processes. However, the metal NPs are quite expensive because complicated synthesis procedures are needed to achieve long-term reliability with regard to chemical deterioration and NP aggregation. Herein, we report laser-induced Ag NP self-generation and sequential sintering process based on low-cost Ag organometallic material for demonstrating high-quality microelectrodes. Upon the irradiation of laser with 532 nm wavelength, pre-baked Ag organometallic film coated on a transparent polyimide substrate was transformed into a high-performance Ag conductor (resistivity of 2.2 × 10-4 Ω·cm). To verify the practical usefulness of the technology, we successfully demonstrated a wearable transparent heater by using Ag-mesh transparent electrodes, which exhibited a high transmittance of 80% and low sheet resistance of 7 Ω/square.

배선 함몰 전극의 배선 소결공정 최적화에 따른 전기적 특성 향상 (Improving Conductivity of Metal Grids by Controlling Sintering Process)

  • 안원민;정성훈;김도근
    • 한국표면공학회지
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    • 제48권4호
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    • pp.158-162
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    • 2015
  • To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

플래시 기반 유기금속화합물 열처리를 통한 고성능 유연 전극 제조 (Flash Lamp Annealing of Ag Organometallic Ink for High-Performance Flexible Electrode)

  • 우유미;이동규;황윤식;허재찬;정성민;조용준;박귀일;박정환
    • 한국전기전자재료학회논문지
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    • 제36권5호
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    • pp.454-462
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    • 2023
  • 금속 나노 입자의 플래시 램프 어닐링 공정은 빠른 가공 속도(밀리초 단위), 저온 공정, 롤투롤 공정과의 호환성 등 이유로 유연한 기판 위에 고성능 전극을 제조하기 위한 강력한 솔루션으로 제공되어 왔다. 그러나 금속 나노 입자[예를 들면, 금(Au), 은(Ag), 구리(Cu) 등]는 저온 공정을 위한 미세 금속 나노 입자(직경 10 nm 미만)의 제조가 어렵고, 고가이며, 잉크보관 및 플래시 램프 어닐링 과정에서 산화가 발생하는 등의 한계가 존재했다. 이러한 이유로 유기금속화합물 잉크는 금속 나노 입자를 대체할 수 있는 재료로서 저렴한 가격(기존 금속 나노 잉크 대비 1/100의 가격)과 저온 공정성, 높은 재료 안정성으로 인해 제안되었다. 하지만 이러한 장점에도 불구하고, 유기금속화합물의 플래시 램프 어닐링 처리를 통한 유연한 전극의 제조는 광범위하게 연구되지 않고 있다. 본 논문에서는 사전 경험 없이 은 유기금속화합물을 플래시 램프 어닐링하는 과정에서 발생할 수 있는 어려움을 최소화하기 위해 재료 매개변수와 플래시광 처리 매개변수(에너지 밀도, 펄스 지속시간 등)를 고려하여 유연 기판에 전극을 제조하기 위한 최적의 조건을 결정하는 방법을 실험적으로 가이드하고자 한다.

Characteristics of photo-thermal reduced Cu film using photographic flash light

  • Kim, Minha;Kim, Donguk;Hwang, Soohyun;Lee, Jaehyeong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.293.1-293.1
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    • 2016
  • Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

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