• 제목/요약/키워드: Ag grid

검색결과 78건 처리시간 0.022초

Seismic behavior of reinforced concrete exterior beam-column joints strengthened by ferrocement composites

  • Li, Bo;Lam, Eddie Siu-shu;Wu, Bo;Wang, Ya-yong
    • Earthquakes and Structures
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    • 제9권1호
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    • pp.233-256
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    • 2015
  • This paper presents an experimental study to assess the effectiveness of using ferrocement to strengthen deficient beam-column joints. Ferrocement is proposed to protect the joint region through replacing concrete cover. Six exterior beam-column joints, including two control specimens and four strengthened specimens, are prepared and tested under constant axial load and quasi-static cyclic loading. Two levels of axial load on column (0.2fc'Ag and 0.4fc'Ag) and two types of skeletal reinforcements in ferrocement (grid reinforcements and diagonal reinforcements) are considered as test variables. Experimental results have indicated that ferrocement as a composite material can enhance the seismic performance of deficient beam-column joints in terms of peak horizontal load, energy dissipation, stiffness and joint shear strength. Shear distortions within the joints are significantly reduced for the strengthened specimens. High axial load (0.4fc'Ag) has a detrimental effect on peak horizontal load for both control and ferrocement-strengthened specimens. Specimens strengthened by ferrocement with two types of skeletal reinforcements perform similarly. Finally, a method is proposed to predict shear strength of beam-column joints strengthened by ferrocement.

e-Science 협업 연구를 위한 협업 시스템 비교 분석 (Comparison of Collaboration System for e-Science)

  • 유진승;김법균;오충식;장행진
    • 한국콘텐츠학회:학술대회논문집
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    • 한국콘텐츠학회 2007년도 추계 종합학술대회 논문집
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    • pp.565-568
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    • 2007
  • e-Science는 고성능 컴퓨팅 장비와 첨단 장비, 대용량 데이터, 연구인력 등을 동시에 활용하여 연구생산성을 혁신적으로 향상시켜주는 것으로 e-Science에 있어서 연구자들 간의 협업을 위한 기능 제공은 가장 기초적인 서비스에 속한다. 본 논문에서는 다양한 분야에서 사용되고 있는 주요 협업 시스템들을 e-Science에 필요한 특성들을 중심으로 비교 분석한다. 기술적인 특성 외에도 지원되는 스트림의 수를 비롯한 확장성과 구축/운영 비용도 e-Science를 위한 협업 시스템으로 선정하는데 있어 중요한 항목으로 고려하였다. e-Science 협업 연구에 적합하다고 판단되는 액세스 그리드의 현황과 발전 방향을 소개한다.

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Pb-기판의 표면특성에 미치는 합금원소의 영향 (Effects of Alloying Elements on the Surface Characteristics of Pb-Substrate for Battery)

  • 오세웅;최한철
    • 한국표면공학회지
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    • 제39권6호
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    • pp.302-311
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    • 2006
  • Nowadays the open-type lead-acid battery for vehicle use is being replaced with the sealed-type because it needs no maintenance and has a longer cycle life. Thus researches on this battery are being conducted very actively by many advanced battery companies. There is, however, a serious problem with the maintenance free(MF) battery that its cathode electrode has a limited cycle life due to a corrosion of grid. In this study, it was aimed to improve a corrosion resistance of the cathode grid which is commonly made of Pb-Ca alloy for a mechanical strength. For this purpose, various amounts of alloying elements such as Sn, Ag and Ba were added singly or together to the Pb-Ca alloys and investigated their corrosion behaviors. Batteries fabricated by using these alloys as cathode grids were subjected to life cycle test and their corrosion layers appeared at the interface between the grids and the active materials were carefully observed in order to clarify effects of alloying elements.

결정질 실리콘 태양전지에 적용하기 위한 도금법으로 형성환 Ni/Cu 전극에 관한 연구 (Investigation of Ni/Cu Contact for Crystalline Silicon Solar Cells)

  • 김범호;최준영;이은주;이수홍
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2007년도 춘계학술대회
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    • pp.250-253
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    • 2007
  • An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

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Anions as Connectors for Higher Dimensions. Silver(I) Trifuoracetate with 3,3'-Oxybispyridine vs 3,3'-Thiobispyridine

  • Kim, Yun-Ju;Yoo, Kyung-Ho;Park, Ki-Min;Hong, Jong-Ki;Jung, Ok-Sang
    • Bulletin of the Korean Chemical Society
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    • 제23권12호
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    • pp.1744-1748
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    • 2002
  • Trifluoroacetate anion as a connector has been studied on $AgCF_3CO_2$ with 3,3'-$Py_2X$(X=O vs S) produces 1 : 1 adducts of [Ag($CF_3CO_2$)(3,3'-$Py_2X<$)]. Crystallographic characterization of [Ag($CF_3CO_2$)(3,3'-$Py_2X$)](monoclinic $P2_1$a=7.383(1)$\AA$b=19.801(3)$\AA$c=9.297(3)$\AA$,$\beta$=$100.26(2)^{\circ}$,V=1337.4(5) $\AA^3$, Z=2, R=0.0386) reveals that the 3,3'-$Py_2O$ spacer connects two silver ions to give a single strand and that the single strands are linked via the trifluoroacetate anions in an "up and down even-bridge" to give an elegant molecular grid. The framework of [$Ag(CF_3CO_2)(3,3'-Py_2X)$](monoclinic $P2_1/c$a=8.331(2)$\AA$b=14.010(2)$\AA$,c=11.926(3 $\AA$$\beta$=$93.70(2)^{\circ}$=1385.1(6)$\AA^3$, Z=4, R=0.0589) is a single-strand. The single strands are connected via the trifluoroacetate anions in a double-bridge, resulting in a typical molecular chicken-wire. The trifluoroacetate anion as a connector appears to be primarily associated with its moderately coordinating ability. Their structural features have been discussed based on the anion exchangeability. Thermal analyses indicate that the compounds are stable up to approximately $200^{\circ}C$.

리플로우 횟수가 ENIG/Sn-3.5Ag/ENIG BGA 솔더 조인트의 기계적, 전기적 특성에 미치는 영향 (Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint)

  • 성지윤;표성은;구자명;윤정원;노보인;원성호;정승부
    • 마이크로전자및패키징학회지
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    • 제16권1호
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    • pp.7-11
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    • 2009
  • 본 연구에서는 electroless nickel / immersion gold (ENIG) 처리된 printed circuit board (PCB)를 무연 솔더인 Sn-3.5(wt%)Ag로 접합하였다. 리플로우 횟수를 1회부터 10회까지 다양하게 하여 리플로우 횟수가 증가함에 따른 솔더 접합부의 기계적, 전기적 특성의 변화에 대해 연구하였다. 접합부의 미세 조직 관찰을 위해 접합부 단면을 폴리싱 하여 금속간 화합물의 두께를 측정하고 종류를 분석하였다. 접합부의 기계적 특성을 평가하기 위해서 die 전단 시험을 하였는데, 리플로우 횟수가 4-5회일 때까지 전단 강도 값이 증가하다가 5회 이후로 감소하였다. 전기적 특성을 알아보기 위해 전기 저항 값을 측정하였는데, 리플로우 횟수가 증가할수록 접합부의 전기 저항 값은 점점 증가하였다.

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BGA 무연솔더(Sn-3.0Ag-0.5Cu)와 무전해 Ni-W-P 도금층 계면의 열 안정성에 대한 연구 (Study on Thermal Stability of the Interface between Electroless Ni-W-P Deposits and BGA Lead-Free Solder (Sn-3.0Ag-0.5Cu))

  • 신동희;조진기;강성군
    • 마이크로전자및패키징학회지
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    • 제17권1호
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    • pp.25-31
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    • 2010
  • 본 연구에서는 무연 솔더 중 우수한 특성을 보여 실용화된 Sn-3.0Ag-0.5Cu 조성의 솔더를 사용하여 2주 동안의 시효조건에서 W의 함량이 무전해 Ni-W-P 도금층과 솔더와의 계면에서의 IMC 생성에 미치는 영향에 대해서 조사하였다. 도금층내 인의 함량은 8 wt.%로 고정하였고, 텅스텐의 함량은 각각 0, 3, 6 및 9 wt.%로 변화시켰으며, 모든 시료는 $255^{\circ}C$에서 리플로우한 후, $200^{\circ}C$에서 2주 동안 시효처리하였다. 각각의 시료에서 $(Cu,Ni)_6Sn_5$$(Ni,Cu)_3Sn_4$의 IMC가 관찰되었으며, 시효처리시간의 증가에 따라 UBM과 무연납의 계면에서 생성된 IMC가 증가함을 보였고, W의 함량이 높을수록 열적 안정성이 증가하여 $Ni(W)_3P$의 생성 속도를 늦춰 그에 따른 영향으로 IMC의 두께가 증가함을 보였다.

비파괴 분석법을 적용한 결정질 태양전지 모듈의 Snail trail 현상 연구 (Non-destructive Analysis of Snail Trail on Silver Grid Line in PV Module)

  • 김다정;김남수;황경준;이주호;정신영;정대홍
    • Current Photovoltaic Research
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    • 제2권2호
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    • pp.63-68
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    • 2014
  • In recent years, discoloration defects, called as snail trail, have been observed at many crystalline photovoltaic modules after a period of time ranging from several months to several years after initial installation. It has been reported that this phenomenon doesn't impact on the performance of photovoltaic modules, but it can be detected through simple visual inspection. The origin and detailed mechanism for the formation have not been identified. In this study, non-destructive analysis by Raman spectroscopy has been carried out to investigate the origin of this phenomenon. In parallel, destructive analysis by scanning electron microscopt and transmission electron microscopy was also performed in order to confirm the results from non-destructive method. Through the extensive analysis, it was found that the main cause for discoloration is the formations of $Ag_2CO_3$ and $AgC_2H_3O_2$. Detailed mechanism for the formation of these particles was indentified through systematic studies.

결정질 실리콘 태양전지의 전면전극 접촉 특성 연구 (Study of contact property of front grid in screen printed silicon solar cell)

  • 김성탁;박성은;김영도;송주용;박효민;김현호;탁성주;김동환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.42.1-42.1
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    • 2010
  • 결정질 실리콘 태양전지의 전면 전극은 전극 면적으로 인한 손실(shading loss)를 줄이고 단락전류밀도(Jsc)를 높이기 위해 전극 너비를 줄이는 노력을 하고 있다. 하지만 전극 소성(firing) 시 전면 전극의 핑거(finger)와 버스바(busbar)의 너비 차이로 인해 전극 침투(fire-through) 정도가 달라질 수 있다. 본 연구에서는 전극 소성 공정 시 전면 전극의 너비에 따른 전극 침투 정도를 조사하기 위해 접촉 저항(specific contact resistance)과 재결정화(Ag recrystallite) 된 전면전극의 분포에 대해 비교하였다. 접촉 저항을 측정하기 위하여 transfer length method(TLM)를 이용하였다. 또한 전면 전극층을 제거한 후 실리콘 기판의 재결정 분포를 주사전자현미경(Scanning electron microscope : SEM)을 이용하여 관찰하였다.

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결정질 실리콘 태양전지의 저가 고 효율화를 위한 Ni/Cu/Ag 전극 태양전지 (The Research of Ni/Cu/Ag Contact Solar Cells for Low Cost & High Efficiency in Crystalline Solar Cells)

  • 조경연;이지훈;이수홍
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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    • pp.214-219
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    • 2009
  • In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

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