• Title/Summary/Keyword: Ag diffusion

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Development of BiPbAgSrCaCuO Superconductor used diffusion of dual layer and The growth mechanism process of superconducting phase (이중층 시료에서 확산을 이용한 BiPbAgSrCaCuO 초전도체 개발 및 초전도상 성장기구)

  • Choi, S.H.;Gang, H.G.;Yu, H.S.;Yu, J.J.;Choi, M.H.;Kim, M.K.;Choi, H.S.;Han, T.H.;Park, S.J.;Hwang, J.S.;Han, B.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1993.05a
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    • pp.22-27
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    • 1993
  • we prepared 70K new BiPbAgSrCaCuO superconductor used diffusion of dual layer which composed of SrCaCuO and BiPbAgCuO compound. This method is used permeation and diffusion on partial melting point of BiPbAgCuO compound. Samples were analyzed by means of X-ray diffraction analysis, Thermal analysis, critical temperature and scanning electron microscopy. It was found that the best results were obtained for spread volume (A:B=1:0.6) and sintring time 210hours.

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Joining of AIN Ceramics to Metals: Effect of Reactions and Microstructural Developments in the Bonded Interface on the Joint Strength (질화알루미늄과 금속간 계면접합에 관한 연구: 계면반응과 미세구조 형성이 접합체 강도에 미치는 영향)

  • 박성계
    • Journal of Powder Materials
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    • v.4 no.3
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    • pp.196-204
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    • 1997
  • Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

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Pd-based metallic membranes for hydrogen separation and production

  • Tosti, Silvano;Basile, Angelo
    • Proceedings of the Membrane Society of Korea Conference
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    • 2003.07a
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    • pp.25-28
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    • 2003
  • Low cost composite metallic membranes for the hydrogen separation and production have been prepared by using thin Pd-Ag foils reinforced by metallic (stainless steel and nickel) structures. Especially, “supported membranes” have been obtained by a diffusion welding procedure in which Pd-Ag thin foils have been joined with perforated metals (nickel) and expanded metals (stainless steel): in these membranes the thin palladium foil assures both the high hydrogen permeability and the perm-selectivity while the metallic support provides the mechanical strength. A second studied method of producing "laminated membranes" consists of coating non-noble metal sheets with very thin palladium layers by diffusion welding and cold-rolling. Palladium thin coatings over these metals reduce the activation energy of the hydrogen adsorption process and make them permeable to the hydrogen. In this case, the dense non-noble metal has been used as a support structure of the thin Pd-Ag layers coated over its surfaces: a proper thickness of the metal assures the mechanical strength, the absence of defects (cracks, micro-holes) and the complete hydrogen selectivity of the membrane. membrane.

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Cold Roll Bonding of (Ag-10% Ni)/Cu Clad Metals ((Ag-10 % Ni)/Cu 접점재의 냉간압연접합)

  • 김종헌;김성일;박상용
    • Transactions of Materials Processing
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    • v.6 no.2
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    • pp.136-144
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    • 1997
  • (Ag-10%Ni)/Cu clad metals for electric contact switch were fabricated by cold-roll bonding process. 2 or 3 passes of cold-rolling was carried out for each process to investigate the effect of the rolling passes on the bonding property. The effect of the annealing temperature of copper before the cold-roll bonding on the bond strength was also studied. The specimen bonded with copper annealed below 30$0^{\circ}C$ before roll bonding showed good bond strength. This is because high stored energy in copper promoted the short range diffusion and the grain refinement of copper by the static recrystallization increased the degree of the interfacial coherency. The maximum peel strength of clad metals bonded with Cu annealed below 30$0^{\circ}C$ was 120N.

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Electrogravimetric and Electrochemical Ac Response of Polypyrrole Films

  • Yang, Haesik;Lee, Hochun;Kwak, Juhyoun
    • Analytical Science and Technology
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    • v.8 no.4
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    • pp.663-668
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    • 1995
  • Ion transport of a polypyrrole/chloride (PPy/Cl) film and a polypyrrole/poly(styenesulfonate) (PPy/PSS) film as a function of applied dc potential was investigated by employing electrogravimetric impedance technique and electrochemical impedance technique. The cation and anion contribution to the whole charge capacitance and the diffusion coefficients of cation and anion in a PPy/PSS film were calculated by fitting the electrogravimetric impedance data with proposed model circuit. The diffusion coefficients of $Na^+$ in a 1 M $NaClO_4$ solution are over 1 order of magnitude larger than those of $ClO{_4}^-$, and $ClO{_4}^-$ contribution to charge compensation decreases as dc potential lowers. The charge compensation of a PPy/Cl film ir a 1 M CsCl solution is carried out largely by $Cl^-$ at 0.2 V vs. Ag/AgCl and by $Cs^+$ as well as $Cl^-$ at -0.4 V.

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Preparation and characterization of expanded graphite/Ag nanoparticle composites for the improvement of thermal diffusion

  • Hong, Seok Hwan;Lee, Won Gyu
    • Korean Chemical Engineering Research
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    • v.56 no.3
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    • pp.410-415
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    • 2018
  • Expanded graphite (EG)/Ag nanoparticle composites were synthesized by the chemical reduction of Ag ions, followed by the addition of expanded graphite into an Ag reducing solution. The prepared composites showed uniform dispersion of Ag nanoparticles on the surface of expanded graphite and exhibited relatively higher thermal conductivities than those of pure expanded graphite. In the case of 10% Ag content in the composite, the thermal conductivity in the thickness direction was 78% higher than the pure expanded graphite. We suggest that EG/Ag nanoparticle composites are a strong candidate for advanced heat spreading material.

Evolution of Cube Texture in the Nickel-Silver-Stainless steel Multi-layer Sheet

  • Lee, Hee-Gyoun;Jung, Yang-Hong;Hong, Gye-Won
    • Progress in Superconductivity
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    • v.1 no.1
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    • pp.51-55
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    • 1999
  • A Ni/Ag/Stainless steel 310S(SS310S) multi-layer sheet has been fabricated by a combination of vacuum brazing, cold rolling and texture annealing processes. After heat-treating the thin Ni/Ag/SS310S multi-layer sheet at $900^{\circ}C$ for 2h, development of (100)<001>cube texture on Ni surface was revealed by (111) pole figure. Quantitative chemical analysis was made by EPMA for the cross-section of the Ni/Ag/SS310S multi-layer sheet. EPMA results showed that Ag diffusion into the Ni layer, which may suppress the cube texture development, was negligible. A small amount of Cr atoms were detected in the Ni layer. It showed that Ag can be used as a chemical barrier of alloying element atoms in Ni layer for the Ni/Ag/SS310S multi-layer sheet and a strong cube texture was developed for the Ni layer in the Ni/Ag/SS310S multi-layer sheet.

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Preparation of YBCO films on Ag substrates by MOCVD process (MOCVD공정에 의한 Ag 기판 위에 YBCO 박막의 증착)

  • 김호진;주진호;전병혁;김찬중
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.10a
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    • pp.79-82
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    • 2003
  • We prepared YBCO coated conductor by direct deposition of YBCO on Ag substrate by a MOCVD method. The Ag substrate was only prepared by cold rolling. The XRD data of the as-rolled Ag tape showed the formation of dominant (420) oriented grains. Processing variables were the oxygen partial pressure (Po$_2$) and deposition temperature (T$_{d}$). It was found that the a-axis oriented films were grown at lower T$_{d}$ below 80$0^{\circ}C$, while the c-axis oriented films were grown about 80$0^{\circ}C$. The surface of the films consisted of a second inclusion phase dispersed in the YBCO matrix. The Cu-rich phase regions were observed at the YBCO/Ag interface probably due to the inter-diffusion of Ag and Cu. Cu.

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Fabrication of Antibacterial Biodegradable films Using a Radiation-induced Reduction Method

  • Jung, Chan-Hee;Cho, Yong-Jun;Jung, Jin-Mook;Hwang, In-Tae
    • Journal of Radiation Industry
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    • v.7 no.2_3
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    • pp.141-147
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    • 2013
  • The simple and facile radiation technique of the preparation of antibacterial biodegradable polymer films containing silver nanoparticles (Ag NPs) was described. The biodegradable poly(butylene adipate-co-terephthalate) (PBAT) films containing silver trifluoroacetate (Ag TFA) were prepared by a solvent casting method, and then the films were irradiated by electron beams at the various doses ranging from 20 to 200 kGy to form Ag NPs in the biodegradable polymers. The results of UV-vis and FE-SEM/EDX analyses revealed that the Ag NPs were successfully formed in the PBAT matrix during the electron beam irradiation, and their amounts were dependant on the absorbed dose and Ag TFA concentrations. Furthermore, on the basis of the results of the antibacterial test through disk diffusion and colony counting test, the irradiated PBAT/Ag TFA films exhibited the antibacterial property due to the formation of Ag NPs.

Fabrication and Characterization of PMN-PZT Thick Films Prepared by Screen Printing Method (Screen Printing법을 이용한 PMN-PZT 후막의 제조 및 특성 연구)

  • 김상종;최형욱;백동수;최지원;김태송;윤석진;김현재
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.11
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    • pp.921-925
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    • 2000
  • Characteristics of Pb(Mg, Nb)O$_3$-Pb(Zr, Ti)O$_3$system thick films fabricated by a screen printing method were investigated. The buffer layer were coated with various thickness of Ag-Pd by screen printing to investigate the effect as a diffusion barrier and deposited Pt as a electrode by sputtering on Ag-Pb layer. The printed thick films were burned out at 650$\^{C}$ and sintered at 950$\^{C}$ in O$_2$condition for each 20, 60min after printing with 350mesh screen. The thickness of piezoelectric thick film was 15∼20㎛ and Ag-Pb layer acted as a diffusion barrier above 3㎛ thickness. The PMN-PZT thick films were screen printed on Pt/Ag-Pb(6m) and sintered by 2nd step (650$\^{C}$/20min and 950$\^{C}$/1h) using paste mixed PMN-PZT and binder in the ratio of 70:30, and the remnant polarization of thick film was 9.1$\mu$C/㎠ in this conditions.

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