• Journal of the Korean Ceramic Society
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• v.25 no.6
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• pp.623-630
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• 1988

As a function of the composition and content of frit, the electrical property of Ag and Ag/Pd thick film conductors were investigated with microstructure. With increasing sintering temperature in Ag-frit thick film conductors, electrical sheet resistivity decreased, but again increased above 80$0^{\circ}C$. And when frit contents is 5wt%, compact and homogenious microstructure can be obtained, then electrical sheet resistivity has minimum value. In Ag/Pd-frit film conductor, the electrical sheet resistivity decreased with increasing sintering temperature. The system which having frit with low softing point has lower sheet resistivity then to add high softening point frit.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.79-82
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• 2003

We prepared YBCO coated conductor by direct deposition of YBCO on Ag substrate by a MOCVD method. The Ag substrate was only prepared by cold rolling. The XRD data of the as-rolled Ag tape showed the formation of dominant (420) oriented grains. Processing variables were the oxygen partial pressure (Po$_2$) and deposition temperature (T$_{d}$). It was found that the a-axis oriented films were grown at lower T$_{d}$ below 80$0^{\circ}C$, while the c-axis oriented films were grown about 80$0^{\circ}C$. The surface of the films consisted of a second inclusion phase dispersed in the YBCO matrix. The Cu-rich phase regions were observed at the YBCO/Ag interface probably due to the inter-diffusion of Ag and Cu. Cu.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.12
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• pp.1067-1072
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• 2009

YBCO coated conductor is named by second generation superconductor tapes. It is different with first generation superconductor tapes. YBCO coated conductor's specific difference with Bi-2223/Ag tape is more strong mechanical durability. This is important role to apply to superconducting machines. For mechanical transforming of YBCO coated conductors, we are using the well designed former. The merit of transformation is several. First, we vary the superconducting characteristics according to mechanical stress. Second, we reduce the volume of superconductor, so we achieve reducing the volume of superconducting machines. On this study, we experiment the transporting current characteristics of one types YBCO coated conductor. YBCO coated conductor with Ie of 70 A and voltage grade of 0.6 V/cm were connected to spiral former to conduct current application test.

• Progress in Superconductivity and Cryogenics
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• v.21 no.4
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• pp.34-38
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• 2019

Multilayered high-temperature superconductor coated conductor (CC) tapes are used in an extensive range of applications and are exposed to many stresses such as hoop stress, radial/transverse tensile stress under large Lorentz forces, and thermal stress while cooling if thermal expansion properties differ. Loads induced transversely at the tape surface inevitably create delamination phenomena in the multilayered CC tapes. Thus, delamination behaviors of CC tapes along the c-axis under transverse loading conditions, which can vary based on manufacturing process and constituent layers, must be characterized for applications. The anvil test method was used to mechanically investigate the delamination characteristics of various commercially available Ag-stabilized CC tapes at room temperature and 77 K, finding superior strength at the latter. The wide variations found depended on tape structure and fabrication technique. Fractographic morphologies of delaminated tapes supported the findings under transverse loading conditions.

• Progress in Superconductivity and Cryogenics
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• v.14 no.1
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• pp.4-7
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• 2012

Coated conductors have been developed to increase piece length and critical current for electric power applications. Otherwise, Many efforts were carried out to reduce AC loss of coated conductor for AC applications. Twisting and cabling processes are effective to reduce AC loss but, these processes can not be applied for tape shaped coated conductor. It is inevitable to have thin rectangular shape because coated conductor is fabricated by thin film deposition process on metal substrate. In this study, round shape superconducting wire was first fabricated using coated conductors. First of all, Ag coated conductor was used. coated conductor was slitted to several wires with narrow width below 1mm. 12ea slitted wires were parallel stacked on top of another until making up the square cross-section. The bundle of coated conductors was heat treated to stick on each other by diffusion bonding and then copper plated to make round shape wire. Critical current of round wire was measured 185A at 77K, self field.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.363-364
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• 2009

For the application of superconductor technology, we need critical properties of superconductors such as a critical current ($I_c$). $I_c$ is varied as processing method by action of flux pinning center. Our research activities are reported on the establishment of standard measurement method for critical current in coated conductor. And then, we researched pre-studies for standardization of critical current evaluation method using IEC/TC 90 standard.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.294-296
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• 2002

Considering the application of high temperature superconductor to MRI, the loss at conductor joint would be very important. Therefore, we have carried out a measurement of joint resistance of Bi-2223/Ag tapes at 77 K. A pancake coil was wound by Bi-2223/Ag tape. Both ends the tape were overlapped and soldered to each other. The DC current is induced in the pancake coil by energizing the excitation coil wound by copper wire closely located to the pancake coil. The decay behaviour of the current in coils was clearly separated in two regimes, and initial fast decay of the order of minutes followed by a slow logarithmic-like decay, From this data, the resistance of the joint was evaluated as 2.74 n$\Omega$.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.72-74
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• 2003

We fabricated textured Ag substrates for coated conductor and evaluated the effects of annealing temperature on microstructural evolution, texture formation, and surface morphology. A strong {110}〈110〉 textured Ag substrate was obtained by cold rolling and annealing at 80$0^{\circ}C$: the full-width at half-maximum(FWHM) value of {110}〈110〉 poles was as sharp as 10$^{\circ}$. Surface morphology was evaluated by using Atomic force microscopy(AFM). Root-mean-square(RMS) roughness of the substrate annealed at 80$0^{\circ}C$ was 39.2 nm. The substrate of strong texture and smooth surface, fabricated in our study, is considered to be suitable for use as a substrate for deposition of superconductor films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.302-302
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• 2008

다층 세라믹 기판은 내열성, 내마모성 및 우수한 전기적 특성으로 인하여 기존의 PCB의 대체품으로 많이 이용되며 그 수요가 점점 늘어가고 있는 추세이다. 이에 고집적 다층 세라믹 기판을 보다 다기능화, 고밀도화, 고성능화하기 위해서는 세라믹 층간 정밀도가 아주 중요한 요소로 부각되고 있으며, 무수촉 기판 소성기술을 이용한 층간 정밀도를 높이는 연구가 진행되어지고 있다. 그러나 무수축 기판에서 이러한 정밀도를 유지하기 위해서는 전극의 수축률을 기판의 수축율과 같은 0%에 가깝게 제어하여야 하며 이를 위해서 여러 가지 Frit을 이용하여 수축율을 제어를 시도되고 있다. Ag 전극은 낮은 비저항 우수한 접착성 등의 장점을 가지고 있을 뿐 아니라 가격이 저렴하여 전극재료로서 많은 연구가 이루어졌다. 특히 Infiltration법에 의한 무수축소성의 경우 Glass가 Ag paste로 Infiltration되어 Ag paste와 세라믹의 matching성 확보에 많은 문제가 발생하였다. 이에 본 실험에서는 제조된 Ag conductor paste 에 첨가되는 frit이 무수축 기판과의 매칭성에 어떠한 영향이 있는지에 대하여 고찰하였다. 시편의 준비는 frit이 첨가된 Ag paste를 기판에 screen printing 한 후 $900^{\circ}C$에서 소결한 것을 사용하였으며 Ag 전극의 미세구조를 관찰하고 전기적 특성과 미세구조와의 연관성에 관해 고찰하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.2 no.1
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• pp.76-85
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• 1992

${\beta}-$Ag_2S$(high temperature phase) was grown by solid/vapour reaction growth based on solid -state electrochemisty. In S/V growth, one of the reactants, silver ion, is supplied to the growth surface through the solid $Ag_2S$ from one side and the other reactants, surfur, is transported in the phase of vapour from the other side. With the sufficient supply of S vapour, the growth rate increased as increasing $T_d$(decomposition temperature of $Ag_2S$) and ${\Delta}T$ between $T_d$ and $T_g$(temperature of growth surface). At low S vapour pressure, growth rate decreased with decreased vapour pressure and ${\beta}-$Ag_2S$ was grown in the form of whisker, when Ag+ion is sufficiently supplied. The measured values of electronic conductivity of ${\beta}-$Ag_2S$ showed that electronic conductivity of the poly crystal was larger than that of single crystal.