• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.827-832
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• 2005

Dual band internal antennas were fabricated with Ag conducting paste of various preparation conditions and different print thickness by silk screen print. We have investigated microwave properties were compared Ag conducting paste antenna with copperplate antenna at 800 MHz and 1,800 MHz. Gain of Ag conducting paste antenna was improved when preparation conditions were the single size Ag particle, using dry type resin and high Ag containing percent. However, it was lower than that of copperplate antenna within $0.1\~2.0dBi$ at 800MHz. In addition, it was improved at 800MHz when thickness of Ag conducting paste was printed more than skin depth but it was held after critical print thickness. On the other hand, it was reached level of copperplate antenna at 1,800MHz.

• 한국전기전자재료학회논문지
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• 제23권4호
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• 한국분말재료학회지
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• 제24권6호
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• pp.464-471
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• 2017

A metal mesh TCE film is fabricated using a series of processes such as UV imprinting of a transparent trench pattern (with a width of $2-5{\mu}m$) onto a PET film, filling it with silver paste, wiping of the surface, and heat-curing the silver paste. In this work nanosized (40-50 nm) silver particles are synthesized and mixed with submicron (250-300 nm)-sized silver particles to prepare silver paste for the fabrication of metal mesh-type TCE films. The filling of these silver pastes into the patterned trench layer is examined using a specially designed filling machine and the rheological testing of the silver pastes. The wiping of the trench layer surface to remove any residual silver paste or particles is tested with various mixture solvents, and ethyl cellosolve acetate (ECA):DI water = 90:10 wt% is found to give the best result. The silver paste with 40-50 nm Ag:250-300 nm Ag in a 10:90 wt% mixture gives the highest electrical conductance. The metal mesh TCE film obtained with this silver paste in an optimized process exhibits a light transmittance of 90.4% and haze at 1.2%, which is suitable for TSP application.

• 청정기술
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• 제19권4호
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• pp.410-415
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• 2013

폴리이미드(polyimide) 필름 위에 은(Ag) 나노 페이스트(paste)가 인쇄된 집전체 및 활성탄소(activated carbon)를 이용하여 제조한 페이스트와 5% potassium polyacrylate (PAAK) 겔(gel) 전해질을 이용하여 슈퍼캐패시터(supercapacitor) 반쪽전지(half cell)를 제작하였다. 집전체 및 전극은 스크린 인쇄를 이용하여 제작하였으며 인쇄된 집전체의 두께는 $7.3{\mu}m$이고 면저항은 $5{\sim}7m{\Omega}/square$이다. 전극 페이스트는 비표면적 $1,968m^2/g$인 활성탄소이고 도전재는 카본 블랙(carbon black)을 사용하였으며 바인더로는 poly (4-vinylphenol)를 7:1:3 비율로 혼합하고 2-(2-buthoxyethoxy) 에틸아세테이트(BCA)를 주 용매로 사용하여 제조하였다. 전기화학적 분석을 위해 순환-전압 전류법(cyclic voltammetry)을 이용하여 전기화학적 특성과 안정도를 평가하였으며 순환-전압전류법 측정을 위한 인가 전압의 범위는 -0.5 V~0.5 V이고 주사속도(scan rate)의 범위는 10~500 mV/s로 하였다. 제작된 슈퍼캐패시터 반쪽전지의 비축전 용량은 주사속도가 10 mV/s, 500 mV/s일 때 각각 44.04 F/g, 8.62 F/g이었다.