• Membrane Journal
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• v.27 no.4
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• pp.313-318
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• 2017

For the separation of olefins/paraffins, $Poly(ethylene oxide)(PEO)/AgBF_4/Al(NO_3)_3/Ag_2O$ composite membranes were prepared. When $Ag_2O$ was introduced, the initial selectivity and permeance of composite membranes were observed to be 13.7 and 21.7 GPU, respectively. The increase in performance compared to the initial performance of $PEO/AgBF_4/Al(NO_3)_3$ membrane (selectivity 13 and permeance 7.5 GPU) was thought to be due to the increase of Ag ion activity due to the addition of $Ag_2O$. However, performance degradation over time was observed, which was thought to be due to the polymer matrix PEO. Since the PEO polymer could not stabilize the $Ag_2O$ particles, the $Ag_2O$ particles becmae aggregated together as the solvent evaporates, and $Ag_2O$ acts as a barrier. As a result, the permeance decreases over time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.18-18
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• 2007

지난 수년 동안 Sn-3.0Ag-0.5Cu 합금은 전자산업의 표준 무연솔더 조성으로 전자제품의 제작에 사용되어져 왔으며, 그 신뢰성도 충분히 검증되어 대표적인 무연 솔더 조성으로의 입지를 굳혀왔다. 그러나 전자제품의 mobile화에 따른 내충격 신뢰성에 대한 요구와 최근의 급격한 Ag 가격의 상승은 Ag 함량의 축소에 의한 원가절감을 요청하게 되었으며, 이에 따라 소량의 Ag를 함유하는 솔더 조성 개발에 대한 연구가 산업 현장을 중심으로 절실히 요청되고 있다. Sn-Ag-Cu의 3원계 함긍에서 Ag는 합금의 융점을 낮추고, 강도와 같은 합금의 기계적 특성을 증가시키는 한편, 모재에 대한 합금의 젖음성을 향상시키는데 필수적인 원소로 인식되고 있다. 따라서 Sn-Ag-Cu의 3원계 함금에서 Ag의 함량을 감소시키게 되면, 합금액 액상선 온도와 고상선 온도가 벌어져 pasty range(또는 mush zone)가 증가하게 되고, wettability도 감소하게 되어 솔더 합금으로서의 요구 특성을 많이 상실하게 된다. 또한 Ag 함량을 감소시키게 되면 합금의 elongation이 향상되면서 내 impact 수명이 향상되는 효과를 볼 수 있으나, 합금의 creep 특성 및 기계적인 강도는 감소하면서 열싸이클링 수명은 감소하는 경향을 나타내게 된다. 따라서 솔더 합금의 내 impact 수명과 열싸이클링 수명을 동시에 만족시키지 위해서는 Ag 함량을 최적화하기 위한 고려가 필요하며, 합금원소에 대한 연구가 요청된다고 하겠다. 한편 Ag의 함량을 3wt.% 이상으로 첨가할 경우에도 비교적 느린 응고 속도에서는 조대한 판상의 $Ag_3Sn$ 상을 형성하는 경향이 있어 외관 물량을 야기 시킬 가능성이 매우 커지는 현상도 보고되고 있다. 따라서 Ag의 첨가량을 최적화 하면서 솔더 재료로서의 특성을 계속적으로 유지하기 위해서는 제 4 원소의 함유가 필수적이라고 할 수 있다. 본 연구에서는 Sn-Ag-Cu계에 첨부하는 제 4원소로서 In을 선택하였다. 비록 In은 Ag보다 고가이기 때문에 산업적인 적용을 위한 솔더 합금 원소로는 거의 각광받지 못했으나, 본 연구의 결과로는 In은 매우 소량 첨가할 경우에도 Sn-Ag-Cu계 합금, 특히 소량의 Ag를 함유하는 Sn-Ag-Cu계 합금의 wettabilty와 기계적 특성 향상에 매우 효과적임을 알 수 있었다. 결론적으로 본 연구를 통해 구현된 Sn-Ag-Cu-In계 최적 솔더 조성의 경우 Sn-3.0Ag-0.5Cu의 표준 조성에 비하여 약 18%의 원자재 가격 절감을 도모할 수 있을 것으로 예상되는 한편. Sn-3.0Ag-0.5Cu에 유사하거나 우수한 wettability 특성을 나타내었고. Sn-1.0Ag-0.5Cu 또는 Sn-l.2Ag-0.5Cu-0.05Ni 조성보다는 월등히 우수한 wettability 특성을 나타내었다. 더구나 Sn-Ag-Cu-In계 최적 솔더 조성은 합금의 강도 저하는 최소화 시키면서 합금의 elongation은 극적으로 향상시켜 합금의 toughness 값이 매우 우수한 특성을 가짐을 알 수 있었다. 이렇게 우수한 toughness 값은 솔더 조인트의 대표적 신뢰성 요구 특성인 열싸이클링 수명과 내 impact 수명을 동시에 향상시킬 수 있을 것으로 예상된다. 요컨대 본 연구를 통해 구현된 Sn-Ag-Cu-In계 솔더 조성은 최적 솔더 조성에서 요구되는 4가지 인자, 즉, 저렴한 원재료 가격, 우수한 wettability 특성, 합금 자체의 높은 toughness, 안정하고 낮은 성장 속도의 계면 반응층 생성을 모두 만족시키는 특징을 가짐으로서 기존 무연솔더 조성의 새로운 대안으로 자리 잡을 것으로 기대된다.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.169-171
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• 2006

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.67-73
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• 2012

After flash memory card(FMC) was manufactured by $B^2it$ process, interfacial reaction of silver bump with thermal stress was studied. To investigate bonding reliability of Ag bump, thermal shock and thermal stress tests were conducted and then examined on the crack between Cu land and Ag bump interface. Diffusion reaction of Ag bump/Cu land interface was analyzed using SEM, EDS and FIB. The Ag-Cu alloy layer due to the interfacial reaction was formed at the Ag/Cu interface. As the diffusivity of Ag ${\rightarrow}$ Cu is faster than Cu ${\rightarrow}$ Ag, a lot of (Cu, Ag) alloy layers were observed at the Cu layer than Ag. These alloy layers contributed to increase the Cu-Ag bonding strength and its reliability.

• Journal of the Korean Vacuum Society
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• v.20 no.2
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• pp.127-134
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• 2011

We investigate the crystallographic orientation and strain states of the Ni/Ag ohmic contacts on p-type GaN. The Ag film in the Ni/Ag contact was severely agglomerated during high temperature annealing in air ambient. As a results, after annealing for 24 h, the Ni/Ag contact shows non-linear I-V curve and low light reflectance of ~21% at 460 nm wavelength. High-resolution X-ray diffraction results show that the interplanar spacing of Ag (111) planes is almost same to that of bilk Ag after annealing for 24 hrs, indicating that the in-plane tensile strain in the Ag film was fully relaxed due to the Ag agglomeration.

• Korean Journal of Soil Science and Fertilizer
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• v.45 no.6
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• pp.1114-1119
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• 2012

This study was conducted to assess the microbial toxicity of ionic silver solution ($Ag^+N$) and silver nanoparticle suspension ($Ag^0NP$) based on the Microtox bioassay. In this test, the light inhibition of luminescent bacteria was measured after 15 and 30 min exposure to aqueous solutions and soils spiked with a dilution series of $Ag^+N$ and $Ag^0NP$. The resulting dose-response curves were used to derive effective concentration (EC25, $EC_{50}$, EC75) and effective dose ($ED_{25}$, $ED_{50}$, $ED_{75}$) that caused a 25, 50 and 75% inhibition of luminescence. In aqueous solutions, $EC_{50}$ value of $Ag^+N$ after 15 min exposure was determined to be < $2mg\;L^{-1}$ and remarkably lower than $EC_{50}$ value of $Ag^0NP$ with $251mg\;L^{-1}$. This revealed that $Ag^+N$ was more toxic to luminescent bacteria than $Ag^0NP$. In soil extracts, however, $ED_{50}$ value of $Ag^+N$ with 196 mg kg-1 was higher than $ED_{50}$ value of $Ag^0NP$ with $104mg\;kg^{-1}$, indicating less toxicity of $Ag^+N$ in soils. The reduced toxicity of $Ag^+N$ in soils can be attributed to a partial adsorption of ionic $Ag^+$ on soil colloids and humic acid as well as a partial formation of insoluble AgCl with NaCl of Microtox diluent. This resulted in lower concentration of active Ag in soil extracts obtained after 1 hour shaking with $Ag^+N$ than that spiked with $Ag^0NP$. With longer exposure time, EC and ED values of both $Ag^+N$ and $Ag^0NP$ decreased, so their toxicity increased. The toxic characteristics of silver nanomaterials were different depending on existing form of Ag ($Ag^+$, $Ag^0$), reaction medium (aqueous solution, soil), and exposure time.

• Journal of the Korean Chemical Society
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• v.40 no.7
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• pp.474-482
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• 1996

Two crystal structures of the vacuum dehydrated $Ag^+$-exchanged zeolite X have been determined by single-crystal X-ray diffraction techniques in the cubic space group Fd3 at 21(1)$^{\circ}C$ (a=24.922(1)${\AA}$ and a=24.901(1)${\AA}$, respectively). Each crystal was ion exchanged in flowing streams of aqueous $AgNO_3$ for three days. The first crystal was dehydrated at 300$^{\circ}C$ and $2{\times}10^{-6$torr for two days. The second crystal was similarly dehydrated at 350$^{\circ}C$. Their structures were refined to the final error indices, $R_1=0.095\;and\;R_2=0.092$ with 227 reflections, and $R_1=0.096\;and\;R_2=0.087$ with 334 reflections, respectively, for which I > 3${\sigma}$(I). In the first crystal, Ag species are found at five different crystallographic sites: sixteen $Ag^+$ ions fill the site I, the center of the double 6-ring, thirty-two Ag0 atoms fill the I' site in the sodalite cavities opposite double six-rings, seventeen $Ag^+$ ions lie at the 32-fold site II' inside the sodalite cavity at the single six-oxygen ring in the supercage, fifteen Ag+ ions lie at the 32-fold site II, in the supercage, and the remaining twelve $Ag^+$ ions lie at site III' in the supercage at a little off two-fold axes. In the second crystal, all Ag species are located similarly as crystal 1; 16 at site I, 28 at site I', 16 at site II, 16 at site II', 6 at site III and 6 at site III'. Total 88 silver species were found per unit cell. The remaining four Ag atoms were migrated out of the zeolite framework to form small silver crystallites on the surface of the zeolite single crystal. In the first structure, the numbers of Ag atoms per unit cell are approximately 32.0 and these may form tetrahedral $Ag_4$ clusters at the centers of the sodalite cavities. The probable four-atom cluster is stabilized by coordination to two $Ag^+$ ions. The Ag-Ag distance in the cluster, ca. 3.05 ${\AA}$, is a little longer than 2.89 ${\AA}$, Ag-Ag distance in silver metal. At least two six-ring $Ag^+$ ions on sodalite cavity (site II') must necessarily approach this cluster and this cluster may be viewed as a distorted octahedral silver cluster, (Ag6)2+.

• The korean journal of orthodontics
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• v.47 no.1
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• pp.3-10
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• 2017

Objective: Microbial aggregation around dental implants can lead to loss/loosening of the implants. This study was aimed at surface treating titanium microimplants with silver nanoparticles (AgNPs) to achieve antibacterial properties. Methods: AgNP-modified titanium microimplants (Ti-nAg) were prepared using two methods. The first method involved coating the microimplants with regular AgNPs (Ti-AgNP) and the second involved coating them with a AgNP-coated biopolymer (Ti-BP-AgNP). The topologies, microstructures, and chemical compositions of the surfaces of the Ti-nAg were characterized by scanning electron microscopy (SEM) equipped with energy-dispersive spectrometer (EDS) and X-ray photoelectron spectroscopy (XPS). Disk diffusion tests using Streptococcus mutans, Streptococcus sanguinis, and Aggregatibacter actinomycetemcomitans were performed to test the antibacterial activity of the Ti-nAg microimplants. Results: SEM revealed that only a meager amount of AgNPs was sparsely deposited on the Ti-AgNP surface with the first method, while a layer of AgNP-coated biopolymer extended along the Ti-BP-AgNP surface in the second method. The diameters of the coated nanoparticles were in the range of 10 to 30 nm. EDS revealed 1.05 atomic % of Ag on the surface of the Ti-AgNP and an astounding 21.2 atomic % on the surface of the Ti-BP-AgNP. XPS confirmed the metallic state of silver on the Ti-BP-AgNP surface. After 24 hours of incubation, clear zones of inhibition were seen around the Ti-BP-AgNP microimplants in all three test bacterial culture plates, whereas no antibacterial effect was observed with the Ti-AgNP microimplants. Conclusions: Titanium microimplants modified with Ti-BP-AgNP exhibit excellent antibacterial properties, making them a promising implantable biomaterial.

• Journal of Korean Ophthalmic Optics Society
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• v.1 no.2
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• pp.63-69
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• 1996

D.c conductivity and optical transmittance of amorphous ($As_2Se_3$)Ag, (x =0, 2, 5, 10mol%) thin films were measured in order to find effects of Ag additives on electrical and optical properties of the films. The d.c. activation energy and the optical gap decreased with increasing Ag contents the Urbach tail was approximately unchangeable for variation of Ag contents. For Ag contents of 5mol% and less, the rate of decrease of the d.c activation energy was more rapidly than that of the optical gap with increasing Ag contents. For Ag contents more than 5mol%, the rate of decrease of the d.c activation energy and the optical gap were nearly the same each other with decreasing Ag contents. So it was appeared that the Fermi level of the films comes close to the mobility edge for Ag contents of 5mol% and less, and the mobility edge comes close the Fermi level for Ag contents more than 5mol%.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.