• Title/Summary/Keyword: Advanced manufacturing

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BUILDABILITY OF MORTAR FEEDSTOCK IN MATERIAL EXTRUSION ADDITIVE MANUFACTURING

  • JINSOO PARK;HOJAE LEE;HANSHIN CHOI
    • Archives of Metallurgy and Materials
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    • v.65 no.3
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    • pp.1069-1072
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    • 2020
  • Mortar feedstock is extruded to form bead and it is selectively placed line by line in the material extrusion additive manufacturing. With respects to part building process healthiness, load-supporting ability of overlaid beads is emphasized as buildability. Buildability is primarily dependent on thixotropic properties of feedstock and vertical overlapping schedule. In the present study, water-to-binder (w/b) ratio was chosen as material aspect to assess buildability. Uneven bead shape evolution and premature failure were highlighted owing to low yield stress of high w/b ratio feedstock. Feedstock with optimum w/b ratio showed good buildability even at the interval time of 19 sec.

The Effect of Heat Treatment on the Tensile Properties of TiNi/6061Al Composites (TiNi/6061Al 복합재료의 인장특성에 미치는 열처리의 영향)

  • Park, Sung-Ki;Shin, Soon-Gi;Lee, Jun-Hee
    • Korean Journal of Materials Research
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    • v.13 no.1
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    • pp.64-68
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    • 2003
  • The 1.6 vol% and 2.5 vol% TiNi/6061Al composites were fabricated by permanent mold casting for investigating the effect of heat treatment on tensile strength for composites. The tensile strength without T6 treatment at 293 K was increased with increasing the volume fraction of TiNi fiber and at 363 K the higher the pre-strain, the higher the tensile strength. The tensile strength of the composite with $T_{6}$ treatment at 293 K was found to increase with increasing both the amount of pre-strain and the volume fraction of TiNi fiber and was higher than that without $T_{6}$ treatment. It should be noted that the tensile strength 2.5vol%TiNi/6061Al composites rolled at a 38% reduction ratio was the maximum value of 298 MPa. The tensile strength of composites decreased with increasing the reduction ratio over 38% because of the rupture of TiNi fiber.

Software Development for Automatic Generation of Unit Shape Part for Variable Lamination Manufacturing Process (가변 적층 쾌속 조형 공정 개발을 위한 단위형상조각 자동 생성 소프트웨어 개발 및 적용 예)

  • Lee, Sang-Ho;Kim, Tae-Hwa;An, Dong-Gyu;Yang, Dong-Yeol;Chae, Hui-Chang
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.8
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    • pp.64-70
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    • 2001
  • In all the Rapid Prototyping (RP) techniques, the computer-aided design (CAD) model of a three-dimensional part is sliced into horizontal layers of uniform, but not necessarily constant, thickness in the building direction. Each cross- sectional layer is successively deposited and, at the same time, bonded onto the previous layer. The stacked layers form a physical part of the model. The objective of this study is to develop a software for automatic generation of unit shape part(USP) for a new RP process, Variable Lamination Manufacturing using the linear hotwire cutting technique and expandable polystyrene foam sheet as part material(VLM-S). In order to examine the applicability of the developed software to VLM-S, USPs of general three-dimensional shapes, such as an auto-shift lever knob and a pyramid shape were generated.

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Experimental Study on the Forming Limit Curve of Aluminum Alloy Sheets using Digital Image Correlation (디지털 이미지 상관관계를 이용한 알루미늄 합금 판재의 성형한계도 평가)

  • Kim, Yongbae;Park, Jungsoo;Song, Junghan
    • Journal of Institute of Convergence Technology
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    • v.5 no.1
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    • pp.7-12
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    • 2015
  • Sheet metal formability can be defined as the ability of metal to deform without necking or fracture into desired shape. Every sheet metal can be deformed without failure only up to a certain limit, which is normally known as forming limit curve(FLC). In this paper, the dome stretching tests and tensile tests have been performed to obtain forming limit curve of aluminum alloy. During the experiment, failure strain is measured using digital image correlation(DIC) method. DIC method is a whole-field measurement technique that acquires surface displacements and strains from images information which characterized a random speckle as intensity grey levels. Recently years, this DIC method is being developed and used increasingly in various research. DIC results demonstrated the usefulness and ability to determine a strain.

Synthesis of Nanosized Cu/Zn Particles in the Base Oil Phase by Hydrothermal Method and Their Abrasion Resistance (기유 내에서 수열합성법에 의한 나노크기의 구리/아연 입자 합성 및 윤활 특성)

  • Kim, Young-Seok;Lee, Ju-Dong;Lee, Man-Sig
    • Journal of Surface Science and Engineering
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    • v.40 no.1
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    • pp.11-15
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    • 2007
  • Stable metallic Cu/Zn nanoparticles were prepared in the base oil phase by hydrothermal method. The physical properties, such as crystal structure, crystallite size and crystallinity according to synthesis conditions have been investigated by XRD, FT-IR and TEM. In addition, 4-ball test has been performed in order to investigate the frictional wear properties of prepared nanosized Cu/Zn particles. The peaks of the X-ray diffraction pattern indicate that the particle size was very small and crystallinity of Cu/Zn particles was good. The micrographs of TEM showed that nanosized Cu/Zn particles possessed a spherical morphology with a narrow size distribution. The crystallite size of the Cu/Zn particles synthesized in base oils was 23-30 nm. It was found that the antiwear capacity increases with increasing Cu/Zn concentration. When the concentration of Cu/Zn was 5.0 wt%, the wear scar diameters was 0.38 mm.

Estimation of Rotational Motion Accuracy for Rotary Units (회전 유니트의 회전정밀도 예측 기술)

  • Hwang, Jooho;Shim, Jongyoup;Park, Chun-Hong
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.2
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    • pp.127-133
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    • 2015
  • The error motion of a machine tool spindle directly affects the surface errors of machined parts. Those are usually due to the imperfectness of bearings, stiffness of spindle, assembly errors, external force or unbalance of rotors. The error motions of the spindle have been needed to be decreased to desired goal of spindle's performance. The level of error motion is needed to be estimated during the design and assembly process of the spindle. In this paper, the estimation method for the five degree of freedom (5 D.O.F) error motions for rotary units such as a spindle and rotary table are suggested. To estimate the error motions of the rotary unit, waviness of bearings and external force model were used as input data. The estimation model considers geometric relationship and force equilibrium of the five degree of the freedom motions.

Machining of Repetitive Micro Patterns using Oscillation Micro Milling (진동 마이크로 밀링을 이용한 미세 반복 패턴 가공 기술 연구)

  • Ro, Seung-Kook;Khim, Gyungho;Park, Jong-Kweon
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.5
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    • pp.381-387
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    • 2014
  • This paper introduces a system to machine micro-sized patterns effectively on surface based on micro-milling process using tools with simultaneous rotation and oscillation, oscillation micro milling. To review the effectiveness of proposed concept, we integrated a micro-spindle supported by active magnetic bearings with a precision 3-axis air bearing stage using double-wedge mechanism, and tested this oscillation milling. Two types of oscillation milling were tested, which are linear oscillation milling with a flat end mill and elliptical oscillation milling with a ball end mill with 0.3 mm of diameter. The spindle was rotating 110 krpm and workpiece was moving constant speed of 2~8 mm/sec during the oscillation milling. As the results, multiple oval shape dimples were generated in regular spacing, and the variation of elliptical motion made different shapes of patterns. The results showed that proposed oscillation milling can be successfully used for machining repeated micro-patterns.

Drying Characteristics of Conductive Thin Films (전도성 잉크 박막의 건조특성)

  • Yoon, Seong Man;Jo, Jeongdai;Kim, Kwang Young
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.6
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    • pp.505-511
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    • 2014
  • In this paper, silver pastes were printed on polyethylene terephthalate (PET) film using screen printing and evaluated the drying characteristics by using dry oven and NIR drying system. The printed Ag films were dried at $140^{\circ}C$ and the drying time was changed from 10 to 90 seconds. To evaluate the electrical properties of printed Ag film, sheet resistance was compared. The sheet resistance of the dried thin silver film by using NIR drying system more rapidly decreased. To clarify this phenomena, the morphology and component of the dried surfaces were measured by using the scanning electron microscope (SEM) and the energy dispersive X-ray Spectroscopy (EDX), respectively. In the EDX measurement results, the oxidation of the surface was observed in the dried thin film by using the dry oven. The NIR drying system is more applicable than conventional hot air drying to apply continuous printing system.

Current Status and Technical Issues of Ultra-precision Machine Tools (초정밀 가공기의 개발 동향 및 기술적 이슈)

  • Oh, Jeong Seok;Kim, Chang-Ju;Park, Chun Hong;Choi, Young Jae
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.3
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    • pp.189-197
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    • 2014
  • Diffractive optical elements (DOEs) - in general a complex pattern of micro- and nano-scale structures - can modulate and transform light in a predetermined way. Their importance is being increased nowadays because they can be designed to handle a number of simultaneous tasks. In view point of machining DOEs, it is a big challenge to fabricate micro- and nano-scale structures on a free-form surfaces. In this paper, the state-of-the-art of the ultra-precision machine tools is reviewed. Also some technical issues which determine the machine tool accuracy are discussed.

Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging (3차원 적층 패키지를 위한 ISB 본딩 공정의 파라미터에 따른 파괴모드 분석에 관한 연구)

  • Lee, Young-Kang;Lee, Jae-Hak;Song, Jun-Yeob;Kim, Hyoung-Joon
    • Journal of Welding and Joining
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    • v.31 no.6
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    • pp.77-83
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    • 2013
  • 3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.