• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• The Journal of the Acoustical Society of Korea
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• v.16 no.2
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• pp.26-30
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• 1997

In this paper, the thickness measurement method of adhesive layers of multilayers using power cepstrum signal processing technique has been proposed. The peak values for reflected signal from each layer have been separated by power cepstrum technique. Therefore, thickness of adhesive layers have been measured by the intervals of peak signal. In the experiment, the adhesive layers of 0.5mm-0.75mm thickness using epoxy(2-Ton and Plastic Steel Putty(A)) between the aluminum and the brass were formed. The adhesive layer thickness which is calculated with data of reflected signal by ultrasonic pulse-echo method was within error 1.34% of the measured values.

• Restorative Dentistry and Endodontics
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• v.32 no.5
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• pp.445-458
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• 2007

The purpose of this study was to evaluate the bond strength of a new Single step system with different curing mode composites, and to evaluate the effect of the intermediate resins which have different hydrophilicity on bonding ability by means of the micro shear bond testing and TEM examination for the adhesive interface. The adhesive used in this study was an experimental single step system (Bisco Inc., Schaumburg IL). Experimental groups were produced by using six kinds of intermediate resin having different hydrophilicity that was hydrophilic, hydrophobic and most hydrophobic resin and as filled or not after applying adhesive. Each experimental group was further divided into two subgroups whether the adhesive was light cured or not. Dual cured composite (Bis Core, Bisco Ltd., Schaumburg, IL) was placed on the adhesive layer as light cure or self cure mode. The results or bond strength were statistically analyzed using one way ANOVA and multiple comparisons are made using Tukey's test at ${\alpha}\;<\;0.05$ level. The results of this study were as follows ; 1. The application of intermediate resin did not increase the bond strength for light cured composite. 2. The bond strength of an experimental adhesive with self cured composite was significantly increased by the application of intermediate resin layer. 3. The bond strength of adhesive was irrespective of the cure or not of itself before intermediate resin layer applied. 4. As applied hydrophilic resin layer was, the initial bond strength was higher than both hydrophobic and most hydrophobic one used but there was no significance. Using a single step adhesive with dual/self cured composite, the incompatibility between both of them should be solved by the application of intermediate hydrophobic resin to reduce the adhesive permeability. However, Single step adhesive can be used in the light cured composite restoration without any decrease of the initial bond strength.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.25-25
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• 1997

• Structural Engineering and Mechanics
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• v.82 no.3
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• pp.343-354
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• 2022

An understanding of the mechanism of concrete girders repaired with CFRP plates and its influence on the dynamic parameters is presented in this paper. Dynamic parameters are governed by the relationship with the physical properties of concrete girders and CFRP plates as well as the adhesive layer between them. A brief explanation of the mechanism of the composite action of concrete girders repaired with CFRP is also given in this paper. Experimental work was carried out to validate the theory of the composite action. The results show a decrease in the modal parameters of CFRP repaired girders that were turned over during the repair procedure, which contrasts with the proven static-based results that CFRP plates increase the stiffness of repaired girders. The composite action theory has explained the results based on the tension and compression forces' growth at the adhesive layer between the CFRP plates and girder surface during the repair procedure. Other girders were prepared and repaired without turning over in order to avoid tension and compression forces at the adhesive layer. The experimental results show an increase in the dynamic parameters of CFRP repaired girders that were not turned over during the repair procedure, which aligns with the static-based results. The study concludes that the dynamic parameters are excellent indicators for the assessment of CFRP repaired concrete girders. The study also suggests that researchers should not turn over damaged concrete girders to repair them with CFRP plates if they intend to study the dynamic parameters, in order to avoid the proposed composite action effect on modal parameters.

• Restorative Dentistry and Endodontics
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• v.29 no.5
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• pp.423-429
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• 2004

The purpose of this study was to evaluate the effect of multiple application of all-in-one dentin adhesive system on microtensile bond strength using confocal laser scanning microscope and microtensile bond strength test. Flat occlusal dentin surfaces were prepared using low-speed diamond saw. In group I, Scotchbond Multipurpose (SM) was applied by manufacturer's recommendation. In group II, after Adper Prompt L-Pop was applied for 15s and light cured for 10s. the second coat was re-applied and light-cured. In group III, after light-curing the second layer. the third coat was re-applied and light-cured. Specimens bonded with a resin-composite were sectioned into resin-dentin stick for measuring the adhesive layer thickness by confocal laser scanning microscope and evaluating micro-tensile bond strength. The adhesive layers of three-step dentin adhesive system. 3 coats of Adper Prompt L-Pop had significantly thicker than SM. 2 coats of Adper Prompt L-Pop (p < 0.05). However. there was no significant differences in bond strengths between SM and 3 coats of Adper Prompt L-Pop (p > 0.05). And SM. 3 coats of Adper Prompt L-Pop had significantly higher than 2 coats of Adper Prompt L-Pop in bond strengths (p < 0.05).

• Journal of the korean academy of Pediatric Dentistry
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• v.44 no.2
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• pp.180-187
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• 2017

The aim of this study was to investigate and compare fluoride release of giomer (Beautifil Injectable), compomer ($Dyract^{(R)}$ XP), and composite resin ($Filtek^{TM}$ Z350XT) through adhesive (Scotchbond Multi-Purpose) layer. A total of 20 cylindrical specimens (7 mm in diameter and 2 mm in thickness) of giomer, compomer and composite resin were prepared according to the manufacturers' instruction (10 with adhesive and 10 without adhesive). These specimens were immersed individually in 2 mL of deionized water at $37^{\circ}C$. The amount of fluoride release was measured on the $1^{st}$, $3^{rd}$, $7^{th}$, $14^{th}$, $21^{st}$, and $28^{th}$ day. To confirm uniform application of the adhesive layer, additional 18 specimens with adhesive were prepared and evaluated by scanning electron microscope. The giomer and compomer groups with adhesive applied showed no fluoride release until the $3^{rd}$ day. However, from the $7^{th}$ day, fluoride was detected. The application of dentin adhesive did not completely prevent fluoride release from giomer or compomer. Fluoride release was significantly (p < 0.05) reduced through the adhesive layer. The reduction of fluoride release was more remarkable on the giomer.

• Polymer(Korea)
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• v.39 no.3
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• pp.514-521
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• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Tribology and Lubricants
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• v.17 no.6
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• pp.459-466
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• 2001

In this study, the effects of oxide layer formed on the contact parts of TiN coated ball and steel disk on friction characteristics in various sliding conditions were investigated. AISI52100 steel ball was used for the substrate of coated ball specimens, which were prepared by depositing TiN coating with 1(m in coating thickness. AISI1045 steel was used for the disk type counter-body. To investigate the effect of oxide layer on the contact parts of two materials, the tests were performed both in air for forming oxide layer on the contact parts and in nitrogen environment to avoid oxidation. From the test results, the frictional characteristic between the two materials was predominated by iron oxide layer that formed on wear tract of counter-body and this layer caused friction transition and high friction. And the adhesive wear occurred from steel disk to TiN coated ball caused the formation of oxide layer on counter parts between the two materials.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.13 no.1
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• pp.97-103
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• 2000

This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.