• Tribology and Lubricants
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• v.15 no.1
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• pp.29-38
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• 1999

In recent years, the tribological behavior of coated ceramic material has been the issue of much interest. Particularly, the understanding of the tribological performance of thin film under light load is important for its potential in applications of MEMS. The friction and wear behavior of ceramic material that occur at light load depends on several factors such as surface roughness, contact area and material properties. In this work, the tribological behavior of coated silicon under light load and low speed was investigated. Particularly, the effects of coated materials, humidity and undulated surface were also studied. The results show that the effect of humidity on fiction was influenced by the apparent area of contact between the two surfaces. Also both adhesive and abrasive wear occurred depending on the sliding condition. Finally, undulations on the silicon wafer were found to be effective in trapping wear particles and resulted in the reduction of friction.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.49-53
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• 2004

Polymeric materials are widely used in the electronic industry as a common dielectric material or adhesive. The polymeric layer coated on Si substrate can be subjected to thermal stresses due to difference in thermal expansion coefficients. The mismatch in thermal properties between the polymeric layer and the substrate results in significant residual stresses. In this study, the thermal deformation is measured by a curvature measurement method using laser scanning, and the elastic modulus is calculated by an analytic model.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.593-594
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• 2006

A novel thermal transfer method was developed to form the phosphor screen for VPT(Video Phone Tube). This method have advantages of simple process, clean environment, saving raw material and running-cost comparison of electrodeposition, spin coating of conventional methods. But now applying phosphor screen for thermal transfer method has been formed three layers (phosphor layer, ITO layer and thermal adhesive layer) on the PET film as substrate. This is complex process, run to waste of raw-material and require of high cost. Also ITO paste at present has been imported from Japan. To improve these problems, we have manufactured phosphor screen formed by two layers (phosphor layer and ITO layer). We have developed ITO paste that had both conductive and excellent thermal transfer abilities, made it of domestic raw-material.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.170-170
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• 2004

박막의 접착강도를 측정하기 위하여 수직력과 수평력을 동시에 측정할 수 있는 0.1∼100 N 용량의 2축 로드셀에 기반을 둔 스크레치 테스터를 개발하였다. 반도체용 Si wafer 기판 위에 Au나 Al 등의 금속이 관은 박막으로 증착된 제품을 table에 고정시킨 후, 2축 로드셀(x, z)이 장착된 하중센서의 선단에 Diamond Tip을 장착하여 기판과 박막에 하중(z-axis)을 증가시키면서 동시에 wafer를 x축 방향으로 이동시킨다. 이런 방식으로 시료의 표면을 긁으면 박막이 벗겨져 나가 Diamond Tip이 기판에 닿을 때 서로 다른 경도차에 의해 진동이 발생하게 되고, 이 진동을 Acoustic Emission 센서에서 감지하여 Crack 발생 시점의 Load와 Stroke를 찾아내게 된다.(중략)

• Carbon letters
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• v.7 no.4
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• pp.241-244
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• 2006

Carbon/Carbon composite was been manufactured by the technology of warmer-molding process of clutter chopped carbon fiber, using phenolic resin as an adhesive. The degree of graphitization, the microstructure and the friction properties were studied. The results show that the clutter chopped carbon fiber fully scatter in the Carbon/Carbon composite and the degree of graphitization of phenolic resin can reach up to 86.2%, this matrix carbon can form the continuous and stable graphitic thin film on the friction surface during braking process so that the composite has fine friction properties and low wear rate.

• Journal of Adhesion and Interface
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• v.19 no.2
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• pp.84-94
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• 2018

Electrically debonding adhesives[EDA], one of the controlled delamination materials[CDM] is reviewed. CDM can be defined as the ability to separate adhesive bonded assemblies without causing damage to the substrates. Its application includes electronics, medical surgery, dentistry, building and general manufacturing where the opportunity to separate assemblies is important. There are several important mechanisms of EDAs; faradaic reaction, phase separation and anode detachment, cathodic debonding, gas emission mechanism, and mechanical stresses. These mechanisms are reviewed with various research results. Since the mechanism behind the electrochemical debonding of adhesives is not well understood, this review aims to help the research scientists in the industries. Finally, new applications of EDA are introduced as new business opportunity.

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.601-601
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• 2003

AQ Bond Plus has the function of self-etching priming adhesive, which can be applied by single coating without second coating, being different from conventional AQ bonds. Moreover, because the absorption range of light became wider, the bond can comply with any visible light curing units. Thus, the bond can produce an unified form between the dentine layer with impregnated resin of good quality and the thin and hard film characteristically. In this study, we investigated the junctional conditions of AQ Bond Plus, using a scanning electron microscope (SEM).(omitted)

• Journal of Surface Science and Engineering
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• v.40 no.4
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• pp.159-164
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• 2007

Transparent aluminum oxide films were deposited on polycarbonate (PC) substrates by inductively coupled plasma (ICP) assisted reactive sputtering. the oxygen flow rate was regulated by controlling the target voltage with a proportional integrate derivative controller. The PC substrate was treated with plasma prior to the deposition in order to the enhance the adhesive strength of the $Al_2O_3$ film. The characteristics of hardness, structure, density, transmittance, deposition rate, surface roughness and residual stress were investigated to estimate the possibility for the hard coating.

• Journal of the Korean Applied Science and Technology
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• v.35 no.4
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• pp.1224-1229
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• 2018

In this study, 2-hedroxyethyl methacrylate (2-HEMA) was graft synthesized on water-dispersed polyurethane using polytetramethylene ether glycoll (PTMG), and then the film of resin was prepared and the physical properties of polyurethane resin were measured. The mechanical properties of the synthesized polyurethane resin were measured by using FT-IR, UTM, adhesion performance measuring instrument. As a result of tensile strength measurement, the tensile strength of HPUD4 with high 2-HEMA content was increased to $5.05kgf/mm^2$, the elongation was measured as 285% of the HPUD1 sample not containing 2-HEMA and adhesive strength of HPUD4 sample was measured at 9.1 sec to 635 psi.