• 제목/요약/키워드: Adhesion film

검색결과 822건 처리시간 0.025초

Metallization of Polymers Modified by Ton-Assisted Reaction (IAR)

  • J.S. Cho;Bang, Wan-Keun;Kim, K.H.;Sang Han;Y.B. Sun;S.K. Koh
    • 마이크로전자및패키징학회지
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    • 제8권1호
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    • pp.53-59
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    • 2001
  • Surfaces of PTFE and PVDF were modified by ion-assisted reaction (IAR) in which 1 keV $Ar^{+}$ ions were irradiated on the surface of the polymer with varying ion dose in an oxygen gas environment, and Cu, Pt, Al and Ag thin films were deposited on the modified polymers. Wettability of the modified polymers was largely improved by the formation of hydrophilic groups due to chemical reaction between polymer surface and the oxygen gas during IAR. The change in wettability in the modified polymers was also related to the change in surface morphology and roughness. Adhesion between metal films and polymers modified by IAR was significantly improved, so that no detachment was possible in the $Scotch^{TM}$ tape test. The increase of adhesion strength between the metal film and the modified PVDF was mainly attributed to the formation of hydrophilic groups, which interacted with the metal film. In the case of the modified PTFE, the enhanced adhesion to metal film could be explained by the change in surface morphology together with the formation of hydrophilic groups. The electrical properties of the metal films on the modified polymers were also investigated.

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Polyester Film Laminating Technology for Chip Condenser

  • Lee, Yun Dai;Son, Yang Soo;Ahn, Joong Geol
    • Corrosion Science and Technology
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    • 제3권4호
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    • pp.172-177
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    • 2004
  • Biaxially oriented polyethylene terephthalate copolymer(BO - PET)film laminated aluminiums have been applied for chip condenser case. The BO PET film is characterized by high molecular which gives high corrosion resistance, good adhesion and high heat resistance. The higher orientation lowers formability of the film. So, optimum orientation has to be controlled during the laminating process. And to confirm the adhesion between BO PET and aluminium and to guarantee the formability of PET laminated aluminums, we have controlled the chromium oxides weight on the aluminium and laminating condition ( laminating temperature, soaking temperature and lag time after nip roll and quenching conditions) This paper discusses the effect of the laminating conditions on the formability of laminated aluminums. As results, it is clear that the orientation of the BO PET film decreased with an increase in the strip temperature. When the film temperature is over the melting point of the film, its orientation drastically decreased.

ADHESION STRENGTH OF DIAMOND COATED WC-Co TOOLS USING MICROWAVE PLASMA CVD

  • Kiyama, Nobumichi;Sakamoto, Yukihiro;Takaya, Matsufumi
    • 한국표면공학회지
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    • 제29권5호
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    • pp.540-544
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    • 1996
  • To apply the CVD diamond film to coated tools, it is necessary to make adhesion strength between diamond film and substrate stronger. So adhesion strength of diamond coated WC-Co tools using Microwave Plasma CVD and cutting test of Al-18mass%Si alloy using diamond cutting tools were studied. Diamond coating was carried out using Microwave Plasma CVD apparatus. Reaction gas was used mixture of methane and hydrogen. Substrate temperature were varied from 673K to 1173K by control of microwave output power and reaction pressure. By observation of SEM, grain size became larger and larger as substrate temperature became higher and higher. Also all deposits were covered with clear diamond crystals. XRD results, the deposits were identified to cubic diamond. An analysis using Raman spectroscopy, the deposit synthesized at lower substrate temperature (673K) showed higher quality than deposit synthesized at higher substrate temperature (1173K). As a result of scratch adhesion strength test, from 873K to 1173K adhesion strength decreased by rising of substrate temperature. The deposit synthesized at 873K showed best adhesion strength. In the cutting test of Al-18mass%Si alloy using diamond coated tools and the surface machinability of Al-Si works turned with diamond coating tools which synthesized at 873K presented uniform roughness. Cutting performance of Al-18mass%Si alloys using diamond coated WC-Co tools related to the adhesion strength.

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Acousto-Optic 기법을 이용한 Pt/Ti 박막 계면의 접합특성 평가 (Evaluating Interfacial Adhesion Properties of Pt/Ti Thin-Film by Using Acousto-Optic Technique)

  • 박해성;;;박익근
    • 비파괴검사학회지
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    • 제36권3호
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    • pp.188-194
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    • 2016
  • 본 연구에서는 Pt/Ti 박막과 기판 사이 계면의 접합특성을 비파괴적으로 평가하는 acousto-optic 기법을 제안한다. 현재 상용화된 기술만으로 마이크로/나노 스케일의 박막을 평가하는데 많은 어려움이 있기 때문에 미세구조 변화에 민감한 광학기술과 음향기술이 결합된 간섭계를 적용하여 연구를 수행하였다. 사용한 기법은 마이켈슨 간섭계를 기반으로 하며, 거울에 의한 광 경로차 대신 박막시험편 계면의 진동 영향에 따라 발생하는 간섭현상을 분석하였다. 박막시험편은 특정 주파수에서 공진과 유사한 현상을 보이고 이로 인해 프린지 패턴의 콘트라스트가 낮아지므로, 각 주파수 대역별 프린지 패턴 변화를 스펙트럼 결과로 정량화하여 제안된 기법을 이용한 박막의 접합특성 평가 가능성을 확인하였다.

Alloy42 기판 위에 증착된 Ag막의 밀착력에 관한 연구 (A study on the adhesion of Ag film deposited on Alloy42 substrate)

  • 이철룡;천희곤;조동율;이건환;권식철
    • 한국표면공학회지
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    • 제32권4호
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    • pp.496-502
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    • 1999
  • Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5$\mu\textrm{m}$ at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at $100~300^{\circ}C$, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of $500\AA$. The critical $load L_{c}$ /, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.

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Failure Mechanism of Cu/PET Flexible Composite Film with Anisotropic Interface Nanostructure

  • Park, Sang Jin;Han, Jun Hyun
    • 한국재료학회지
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    • 제30권3호
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    • pp.105-110
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    • 2020
  • Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

PET 기질의 전처리효과가 상온 ECR 화학증착법에 의해 증착된 구리박막의 계면접착력에 미치는 영향 (Effects of Pretreatments of PET Substrate on the Adhesion of Copper Films Prepared by a Room Temperature ECR-MOCVD Method)

  • 현진;전법주;변동진;이중기
    • 한국재료학회지
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    • 제14권3호
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    • pp.203-210
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    • 2004
  • Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

광반응 폴리이미드위에 RF bias sputtering 방식으로 증착된 Cr의 접착력에 관한 연구

  • 김선영;김영호;윤종승
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.171-177
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    • 2001
  • The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

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SPM을 이용한 Si 표면위에 플라즈마 처리된 소수성 박막의 나노 트라이볼로지적 특성 연구 (Nanotribological Characteristics of Plasma Treated Hydrophobic Thin Films on Silicon Surfaces using SPM)

  • 윤의성;양승호;공호성;고석근
    • Tribology and Lubricants
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    • 제19권2호
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    • pp.109-115
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    • 2003
  • Nanotribological characteristics between a Si$_3$N$_4$ AFM tip and hydrophobic thin films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM (atomic force microscope) and LFM (lateral force microscope) modes in various .ranges of normal load. Plasma-modified thin polymeric films were deposited on Si-wafer (100). Results showed that wetting angle of plasma-modified thin polymeric film increased with the treating time, which resulted in the hydrophobic surface and the decrease of adhesion and friction. Nanotribological characteristics of these surfaces were compared with those of other hydrophobic surfaces, such as DLC, OTS and IBAD-Ag coated surfaces. Those of OTS coated surface were superior to those of others, though wetting angle of plasma-modified thin polymeric film is higher.