• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.1-12
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• 1999

Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

• 한국표면공학회지
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• 제34권2호
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 봄 학술논문 발표대회
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• pp.217-218
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• 2023

In modern architecture, tiles are used as a decorative material to enhance the appearance of buildings. However, defects occurring during tile installation affect not only the appearance of the building, but also its maintenance. This study aims to investigate stable tile installation by producing tile modules using the floating mortar method and conducting freeze-thaw tests to measure their adhesion strength. Test results showed that the adhesion strength increased as the mesh size decreased, except for S3 mesh. This study highlights the importance of research on tile installation to solve problems related to building appearance and maintenance.

• 한국세라믹학회지
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• 제41권10호
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• pp.728-734
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• 2004

평균입자크기가 서로 다른 WC-Co계 모재위에 고온 열처리법과 화학적 에칭방법을 이용하여 다이아몬드 막을 코팅하고 압흔법을 통해 그 접착력(adhesion strength)을 평가하였다. $1450^{\circ}C$의 고온 열처리 방법에 의해 준비된 WC-Co 시편표면에서는 WC 입자가 성장하였으며, 그 결과 20$\mu$m 이상의 다이아몬드 막이 증착된 경우에도 100kg의 하중에서도 우수한 접착력이 얻어졌다. 그러나, 모재 표면입자의 과도한 입성장으로 시편 인선부에는 변형이 발생하였으며, 증착된 다이아몬드 막은 거친 표면조도를 보였다. 이와 비교하여, 화학적 부식의 경우에는 submicron 크기의 WC 입자를 제외하고, 2$\mu$m 이상의 WC 입자를 가지는 모재를 이용하여 10$\mu$m의 다이아몬드 코팅막을 증착시킨 경우에는, 60kg의 하중에서도 양호한 접착력이 유지되었다 특히, WC 입자가 클수록 접착력의 신뢰성이 대폭 향상되었다. 이는 수 $\mu$m 이내의 비교적 얇은 두께의 다이아몬드 막을 증착하는 경우 화학적 에칭방법이 시편 형상의 변형을 방지하고, 양호한 표면조도를 얻을 수 있어 고온 열처리 방식에 비해 효과적임을 의미한다.

• 대한가정학회지
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• 제29권2호
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• pp.35-46
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• 1991

After adhering theone-sided non-woven adhesive interlining to the polyester/cotton fabrics and making experiments under the various conditions by L27 Orthogonal Array Table, we examined and analyzed the breaking away strength. The rusults are summarized as follows : 1. The best length of the adhering time is 15 secs. 2. As the adehesive interlining for blouse and jacket, B3 is best 3. The pressure for the adhesion is best under the pressure of 6.2Kg. 4. The temperature for the adhesion is best at 140$^{\circ}C$. 5. As for the direction of the adhesion, three directions appear much the same breaking away strength. 6. For the better adhesion power, if the less adhering power, if the less adhering pressure is applied, the adhering time must be extended(15-20 secs), and if much stronger adhering pressure is applied, the time must be shortened(10-15 secs). In general, it is the best way for the adhesion to apply under the pressure of 6.2Kg, for 15 secs long, and at 140$^{\circ}C$ of the adhering temperature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.177-179
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• 2011

The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

• 한국표면공학회지
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• 제26권2호
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.109-114
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• 2002

The adhesion of electroless plated Ni layer on Al/Si substrates has been investigated. The zincating treatment was conducted with a conventional method and a modified method. In a modified method, ultrasonic agitation was applied during zincating. Adhesion strength was evaluated by a pull-off test. The ultrasonic agitation during zincating increased the nucleation density of Zn particles and refined Zn particle size. the adhesion strength of electroless Ni layer deposited on the modified zincated surface was higher than that on the conventionally zincated surface. the improvement of adhesion was attributed to the fine and dense Zn particles.

• 한국표면공학회지
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• 제29권2호
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• pp.109-119
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• 1996

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by using the cellophane tape and the push-pull scale. With the minor addition of the stabilizers, 2-MBT having a large molecular size gives poor adhesion, together with a finer grain structure, whereas Thiourea and NaCN show a high mechanical strength of the deposits. The high mechanical strength is supposed to be due to the easy desorption of hydrogen gas generated from the electroless reactions. A large amount of the three stabilizers decreases the adhesion for all the cases, resulting from strong adsorption of the stabilizers to the substrates.

• 한국표면공학회지
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• 제32권3호
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• pp.410-415
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• 1999

The adhesion strength of sputtered copper films to Inconel substrates has been studied using the scratch test. The effects of substrate treatments before deposition such as chemical or ion bombardment etching were investigated by means of a mean critical load derived from a Weibull-like statistical analysis. It was found that the mean critical load was very weak unless the amorphous layer produced by mechanical polishing on the substrate surface was eliminated. Chemical etching in a nitric-hydrochloric acid bath was shown to have practically no effect on the enhancement of the adhesion. In contrast, the addition in this bath of nickel and copper sulphates allowed removal of the amorphous layer and an increase in the values of the mean critical load. However, it was observed that excessive chemical etching could cancel out the mean critical load enhancement. The results obtained in the case of ion bombardment etching pretreatments could be far higher than those obtained with chemical etching. Moreover, for a sufficiently long period of ion bombardment etching, the adhesion strength was so high that it was impossible to observe evidence of an adhesion failure.