• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.1-12
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• 1999

Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.217-218
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• 2023

In modern architecture, tiles are used as a decorative material to enhance the appearance of buildings. However, defects occurring during tile installation affect not only the appearance of the building, but also its maintenance. This study aims to investigate stable tile installation by producing tile modules using the floating mortar method and conducting freeze-thaw tests to measure their adhesion strength. Test results showed that the adhesion strength increased as the mesh size decreased, except for S3 mesh. This study highlights the importance of research on tile installation to solve problems related to building appearance and maintenance.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.728-734
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• 2004

The effect of microstructure of WC-Co substrates which have different WC grain sizes from submicron to 5 $\mu$m on the diamond-substrate adhesion strength was investigated. The substrates were pre-treated by two methods : chemical etching with Murakami's solution and subsequently with $H_2SO_4$, and thermal heat-treatment. The adhesion strength was estimated by degree of peeling after Rockwell indentation. Diamond films of 20 $\mu$m thickness deposited on the heat-treated substrates showed an excellent adhesion strength at the load of 100 kg, which ascribed to the large and elongated WC grains. However, the cutting edge of insert was deformed after heat treatment and the surface morphology of heat treated substrate strongly affected on the surface roughness of the deposited diamond films. On the contrary, the diamond film of 10 $\mu$m in thickness on the chemically etched substrates of average WC grain size over 2 $\mu$m showed good adhesion strength enough not to peel-off under a load of 60 kg. Especially, the substrate of average WC grain size over 5 $\mu$m exhibited much improved reliability of adhesion comparing with the substrate of average grain size under 2 $\mu$m. No substrate deformation was observed in this case after the chemical etching, which is more advantageous and more practical in terms of precious machining than the heat treatment case.

• Journal of the Korean Home Economics Association
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• v.29 no.2
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• pp.35-46
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• 1991

After adhering theone-sided non-woven adhesive interlining to the polyester/cotton fabrics and making experiments under the various conditions by L27 Orthogonal Array Table, we examined and analyzed the breaking away strength. The rusults are summarized as follows : 1. The best length of the adhering time is 15 secs. 2. As the adehesive interlining for blouse and jacket, B3 is best 3. The pressure for the adhesion is best under the pressure of 6.2Kg. 4. The temperature for the adhesion is best at 140$^{\circ}C$. 5. As for the direction of the adhesion, three directions appear much the same breaking away strength. 6. For the better adhesion power, if the less adhering power, if the less adhering pressure is applied, the adhering time must be extended(15-20 secs), and if much stronger adhering pressure is applied, the time must be shortened(10-15 secs). In general, it is the best way for the adhesion to apply under the pressure of 6.2Kg, for 15 secs long, and at 140$^{\circ}C$ of the adhering temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.177-179
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• 2011

The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

• Journal of the Korean institute of surface engineering
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• v.26 no.2
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.109-114
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• 2002

The adhesion of electroless plated Ni layer on Al/Si substrates has been investigated. The zincating treatment was conducted with a conventional method and a modified method. In a modified method, ultrasonic agitation was applied during zincating. Adhesion strength was evaluated by a pull-off test. The ultrasonic agitation during zincating increased the nucleation density of Zn particles and refined Zn particle size. the adhesion strength of electroless Ni layer deposited on the modified zincated surface was higher than that on the conventionally zincated surface. the improvement of adhesion was attributed to the fine and dense Zn particles.

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.109-119
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• 1996

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by using the cellophane tape and the push-pull scale. With the minor addition of the stabilizers, 2-MBT having a large molecular size gives poor adhesion, together with a finer grain structure, whereas Thiourea and NaCN show a high mechanical strength of the deposits. The high mechanical strength is supposed to be due to the easy desorption of hydrogen gas generated from the electroless reactions. A large amount of the three stabilizers decreases the adhesion for all the cases, resulting from strong adsorption of the stabilizers to the substrates.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.410-415
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• 1999

The adhesion strength of sputtered copper films to Inconel substrates has been studied using the scratch test. The effects of substrate treatments before deposition such as chemical or ion bombardment etching were investigated by means of a mean critical load derived from a Weibull-like statistical analysis. It was found that the mean critical load was very weak unless the amorphous layer produced by mechanical polishing on the substrate surface was eliminated. Chemical etching in a nitric-hydrochloric acid bath was shown to have practically no effect on the enhancement of the adhesion. In contrast, the addition in this bath of nickel and copper sulphates allowed removal of the amorphous layer and an increase in the values of the mean critical load. However, it was observed that excessive chemical etching could cancel out the mean critical load enhancement. The results obtained in the case of ion bombardment etching pretreatments could be far higher than those obtained with chemical etching. Moreover, for a sufficiently long period of ion bombardment etching, the adhesion strength was so high that it was impossible to observe evidence of an adhesion failure.