• Journal of Energy Engineering
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• v.22 no.4
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• pp.338-346
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• 2013

The conventional lead acid battery is optimized for cranking performance of engine. Recently electric devices and fuel economy technologies of battery have influenced more deep cycle of dynamic behavior of battery. I also causes to reduce battery life-time. This study proposed that aging battery model is focused for increasing of battery durability. The stress factors of battery aging consist of discharge rate, charging time, full charging time and temperature. This paper considers the electrochemical kinetics, the ionic species conservation, and electrode porosity. For prediction of battery life cycle we consider battery model containing strong impacts, corrosion of positive grid and shedding. Finally, we validated that modeling results were compared with the accelerated thermal measurement data.

• Journal of the Korean Ceramic Society
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• v.40 no.11
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• pp.1067-1072
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• 2003

The electrical stability of the varistor ceramics composed of Zn-Pr-Co-Cr-Dy oxides-based varistors was investigated at 0.0∼2.0 mol% Dy$_2$O$_3$ content under DC accelerated aging stress. The ceramic density was increased up to 0.5 mol% Dy$_2$O$_3$ whereas further addition of Dy$_2$O$_3$ decreased sintered ceramic density. The density sailently affected the stability due to the variation of conduction path. The nonlinearity of varistor ceramics was greatly improved above 45 in the nonlinear exponent and below nearly 1.0 ${\mu}$A by incorporating Dy$_2$O$_3$. Under 0.95 V$\_$1mA/150$^{\circ}C$/24 h stress state, the varistor ceramics doped with 0.5 mol% Dy$_2$O$_3$ exhibited the highest electrical stability, in which the variation rates of varistor voltage, nonlinear exponent, and leakage current were -0.9%, -14.4%, and +483.3%, respectively. The variation rates of relative permittivity and dissipation factor were +7.1% and +315.4%, respectively. The varistors with further addition of Dy$_2$O$_3$ exhibited very unstable state resulting in the thermal runaway due to low density.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Elastomers and Composites
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• v.47 no.3
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• pp.254-258
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• 2012

Material characteristics and the prediction of life time of polyacrylic rubber (ACM) for automotive engine gasket were studied. Two kinds of ACM rubber compounds, having chlorine cure-site and carboxyl cure-site, were made with optimum formulations and the properties of each materials were examined. As a test results for the thermal properties and compression set, which are very important in the application for the automotive engine gasket, the compound using ACM with carboxyl cure-site was evaluated as having a better characteristics than that of ACM with chlorine cure-site. Arrhenius relationship based on time-temperature superposition principle (TTSP) was obtained through the accelerated heat aging test to predict the useful life-time for the compound using ACM with carboxyl cure-site.

• Tribology and Lubricants
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• v.35 no.4
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• pp.222-228
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• 2019

As rubber products such as O-rings, which are also known as packings or toric joints, come in regular, long term contact with liquid fuel, they can eventually swell, become mechanically weakened, and occasionally crack; this diminishes both their usefulness and intrinsic lifetime and could cause leaks during the steady-state flow condition of the fuel. In this study, we evaluate the lifetime of such products through compression set tests of FKM, a family of fluorocarbon elastomer materials defined by the ASTM international standard D141; these materials have great compression, sunlight, and ozone resistance as well as a low gas absorption rate. In this process, O-rings are immersed in the liquid fuel of airtight containers that can be expressed as a compression set, and the liquid fuel leakage in a flow rig tester at variable temperatures over 12 months is investigated. Using the Power Law model, our study determined a theoretical O-ring lifetime of 2,647 years, i.e. a semi-permanent lifespan, by confirming the absence of liquid fuel leakage around the O-ring assembled fittings. These results indicate that the FKM O-rings are significantly compatible for fuel tests to evaluate long-term sealing conditions.