• Title/Summary/Keyword: Abrasive processing

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Effect of Abrasive Processing in the Milling Process on the Quality of Rice (정백공정 중 연삭공정이 쌀 품질에 미치는 영향)

  • Kang, Tae-Hwann;Ning, Xiao Feng;Han, Chung-Su;Cho, Sung-Chan
    • Journal of Biosystems Engineering
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    • v.35 no.3
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    • pp.169-174
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    • 2010
  • This study was conducted to investigate the effect of abrasive processing and non abrasive processing in the milling process on the quality of rice. The effect was analyzed based on the factor such as whiteness, grain temperature, moisture content, crack and broken rice ratio. The results were as followings. Whiteness of abrasive rice was the same as non abrasive rice. The rice temperature increase of abrasive rice was $1.6^{\circ}C$ lower than non abrasive rice. The crack ratio was increased in the process of milling and non abrasive rice showed higher values than abrasive rice. The broken rice ratio of the using abrasive processing was about 0.05% lower than that of non abrasive processing. The moisture content decreased in the process of milling regardless of the use abrasive rice milling machine.

Recovery of abrasives from electrical industry sludge

  • Cho Sung-Baek;Kim Sang-Bae;Cho Keon-Joon
    • 한국지구물리탐사학회:학술대회논문집
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    • 2003.11a
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    • pp.637-641
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    • 2003
  • Abrasive powders were recovered from electrical industry sludge by simple physical separation for their recycling. The raw electrical industry sludge was filter pressed, dried, dispersed and then classified by air classifier at various conditions. The three kinds of particles with different particle size distribution were classified by controlling rotor speed and air volumes of the classifier. The recovered abrasive powders, which are classified at 5,000,9000 and 13,000 rpm of rotor speed, are almost same properties to raw pumice, garnet and rouge powders, respectively. The results of particle size analysis, X-ray diffraction and SEM observation show that the recovered powders can be reused as an abrasive powders.

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Nozzle Condition Monitoring System for Abrasive Waterjet Process (연마재 워터젯을 위한 노즐상태 모니터링 시스템 설계)

  • Kim, Jeong-Uk;Kim, Roh-Won;Kim, Chul-Min;Kim, Sung-Ryul;Kim, Hyun-Hee;Lee, Kyung-Chang
    • Journal of the Korean Society of Industry Convergence
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    • v.23 no.5
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    • pp.817-823
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    • 2020
  • In recent, the machining of difficult-to-cut materials such as titanium alloys, stainless steel, Inconel, ceramic, glass, and carbon fiber reinforced plastics (CFRP) used in aerospace, automobile, medical industry is actively researched. Abrasive waterjet is a non-traditional processing method in which ultra-high pressure water and abrasive particles are mixed in a mixing chamber and shoot out jet through a nozzle, and removed by erosion due to collision with a material. In particular, the nozzle of the abrasive waterjet is one of the most important parts that affect the machining quality as with a cutting tool in general machining. It is very important to monitor the condition of the nozzle because the workpiece is uncut or the surface quality deteriorates due to wear, expanding of the bore, damage of the nozzle and clogging of the abrasive, etc. Therefore, in this paper, we propose a monitoring system based on Acoustic Emission(AE) sensor that can detect nozzle condition in real time during AWJ processing.

Super Precise Finishing of Internal-face in STS304 Pipe Using the Magnetic Abrasive Polishing (자기연마를 이용한 STS304 파이프 내면의 초정밀 가공)

  • 김희남;윤여권;심재환
    • Journal of the Korean Society of Safety
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    • v.17 no.3
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    • pp.30-35
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    • 2002
  • The magnetic abrasive polishing is the useful method to finish using magnetic power of a magnet. It's not a long time this method was introduced to korea as one of precision finishing techniques. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. The are rarely researcher in this field because of no-effectiveness of magnetic abrasive. The mechanism of this R&D is dealing with the dynamic state of magnet-abusive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get the best surface roughness at low cost. We need to continue the research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnetic abrasive are the particles of 150$\mu\textrm{m}$, 250$\mu\textrm{m}$.

Chemical Mechanical Polishing: A Selective Review of R&D Trends in Abrasive Particle Behaviors and Wafer Materials (화학기계적 연마기술 연구개발 동향: 입자 거동과 기판소재를 중심으로)

  • Lee, Hyunseop;Sung, In-Ha
    • Tribology and Lubricants
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    • v.35 no.5
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    • pp.274-285
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    • 2019
  • Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

A Study on the Optimization of Machining Process for Al6061 Using the AWJM (AWJM을 이용한 Al6061 절단조건 최적화에 관한 연구)

  • Lee, Jae-Kwang;Min, Byeong-Hyeon;Ye, Sang-Don;Jea, Wone-Soo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.5 no.3
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    • pp.65-70
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    • 2006
  • The AWJM(Abrasive Water-jet Machining) technology is one of the cutting technologies, which can cut various materials with 2 or 3 times of the speed of sound. In this study, processing conditions such as jet-pressure, cutting speed, orifice diameter and stand-off distance, are used by following the design of experiments with 3 levels. Al6061 material which is normally applied on the field, is applied. Through the S/N ratio analysis with measured values, the optimization value of processing conditions to minimize the surface roughness and taper value is obtained. The order of significance is as follows; jet pressure, cutting speed, abrasive mixing ratio, orifice diameter and stand-off distance. RSM(Response Surface Method) is applied to find the optimal processing conditions to minimize both the surface roughness and the taper value by using jet pressure, cutting speed and abrasive mixing ratio.

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Development of Magneto-Electrolytic-Abrasive Polishing System for Piston Pin (피스톤 핀의 자기전해 경면연마 시스템 개발)

  • 김정두
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.03a
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    • pp.59-64
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    • 1998
  • We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

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A Study on the Frosting Phenomena of Abrasive Waterjet Microcutting for Multi-Layered Materials (연마제 워터젯을 이용한 복합재 미세가공의 백화현상에 대한 연구)

  • Park, Kang-Su;Bahk, Yeon-Kyoung;Go, Jeung-Sang;Shin, Bo-Sung
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.183-190
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    • 2007
  • It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.

Applicability of abrasive waterjet cutting to irradiated graphite decommissioning

  • Francesco Perotti ;Eros Mossini ;Elena Macerata;Massimiliano Annoni ;Michele Monno
    • Nuclear Engineering and Technology
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    • v.55 no.7
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    • pp.2356-2365
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    • 2023
  • Characterization, dismantling and pre-disposal management of irradiated graphite (i-graphite) have an important role in safe decommissioning of several nuclear facilities which used this material as moderator and reflector. In addition to common radiation protection issues, easily volatizing long-lived radionuclides and stored Wigner energy could be released during imprudent retrieval and processing of i-graphite. With this regard, among all cutting technologies, abrasive waterjet (AWJ) can successfully achieve all of the thermo-mechanical and radiation protection objectives. In this work, factorial experiments were designed and systematically conducted to characterize the AWJ processing parameters and the machining capability. Moreover, the limitation of dust production and secondary waste generation has been addressed since they are important aspects for radiation protection and radioactive waste management. The promising results obtained on non-irradiated nuclear graphite blocks demonstrate the applicability of AWJ as a valid technology for optimizing the retrieval, storage, and disposal of such radioactive waste. These activities would benefit from the points of view of safety, management, and costs.