• Journal of Korean Tunnelling and Underground Space Association
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• v.21 no.6
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• pp.763-778
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• 2019

Abrasive waterjet cutting technology has been used for rock excavation of tunnels and underground structures due to various advantages. In order to cut rocks by using the abrasive waterjet system, abrasive is essential to enhance impact energies for fracturing the target rock. Since garnet abrasives are not produced in Korea, alternative abrasives, instead of garnets, are needed to achieve the economical waterjet cutting. This study is to analyze cutting performance for rocks with sandy particles as alternative abrasive. Cutting tests were carried out on granite specimens at the constant waterjet energy (e.g., water pressure or water flow rate). The five kinds of sands, sampled by construction fields and natural sites, were prepared to perform the experimental tests. When sea sand was used as an alternative abrasive, cutting performance was secured to be 60~70% compared to the commercial garnet abrasive. Thus, it is expected that sand abrasives can be applied on the waterjet cutting process for the economical excavation construction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.8
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• pp.887-892
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• 2014

In a conventional magnetic abrasive polishing process, the polishing abrasives are mixed with ferrous particles and slight cutting oil to form a cluster of abrasives. However, when a tool rotates at a high revolution speed, most of the polishing abrasives are scattered away from it due to the increase in centrifugal force. This phenomenon directly reduces the polishing efficiency. The use of a highly viscous matter such as silicone gel instead of cutting oil for mixing is one method to solve this problem and increase abrasive adhesion. Another method to avoid high abrasive scattering is the application of wet magnetic abrasive polishing (WMAP). In WMAP, abundant mineral oil is preliminarily applied to the workpiece surface. This study experimentally evaluated the effect of WMAP on abrasive adhesion. The relationship between the amount of working abrasives and polishing conditions was characterized. Despite the lower adhesion ratio of polishing abrasives, the surface roughness was found to be significantly improved as the result of WMAP.

• Tribology and Lubricants
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• v.18 no.3
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• pp.204-210
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• 2002

Automotive brake pads with four different sizes of zircon particles (average sizes of 1㎛, 6㎛, 75㎛, and 140㎛, respectively) were investigated to evaluate the size effect of abrasive particles on friction performance. Results showed that the brake pads with the larger size of zircon particles tend to show better frictional stability and low pad wear. However, the rotor surface was severely abraded in the case of using larger zircon particles. On the other hand, the small zircon particles in the pads showed the fast increase of the coefficient of friction with friction force oscillation and the tendency was pronounced at low sliding speeds. The brake pads with small particle sizes also exhibited strong fade phenomena at elevated temperatures.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.47-53
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• 2001

Results ar presented of a new process for internal precision finishing of slender fine ceramic pipes using a magnetic field generated by a permanent magnets. For finishing the interior surface of a long pipe, a new type of finishing equipment was developed which can be very easily used in an industrial surrounding. In general, the pipe is so slender that a conventional finishing tool is hardly inserted into the pipe deeply, being impossible to finish. Therefore, a new technology has been considered to finish inside of a slender ceramic pipe by a simple technique. In this experimental, Magnetic Abrasive Machining is applied for the inner surface of silicon nitride fine ceramic pipe using ferromagnetic particles mixed with chromium-oxide powder. It is shown the initial roughness of 2.6㎛ Ry(0.42㎛ Ra) in the inside surface can be precisely finished to the roughness of 0.1㎛ Ry(0.01㎛ Ra). This paper discusses the outline of the processing by the application of magnetic abrasive machining and a few finishing characteristics.

• Tribology and Lubricants
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• v.25 no.6
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• pp.404-408
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• 2009

In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.3940-3955
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• 2023

A new method of numerical simulating prediction and decontamination effect evaluation for abrasive jet decontamination to radioactively contaminated metal is proposed. Based on the Computational Fluid Dynamics and Discrete Element Model (CFD-DEM) coupled simulation model, the motion patterns and distribution of abrasives can be predicted, and the decontamination effect can be evaluated by image processing and recognition technology. The impact of three key parameters (impact distance, inlet pressure, abrasive mass flow rate) on the decontamination effect is revealed. Moreover, here are experiments of reliability verification to decontamination effect and numerical simulation methods that has been conducted. The results show that: ⁶⁰Co and other homogeneous solid solution radioactive pollutants can be removed by abrasive jet, and the average removal rate of Co exceeds 80%. It is reliable for the proposed numerical simulation and evaluation method because of the well goodness of fit between predicted value and actual values: The predicted values and actual values of the abrasive distribution diameter are Ф57 and Ф55; the total coverage rate is 26.42% and 23.50%; the average impact velocity is 81.73 m/s and 78.00 m/s. Further analysis shows that the impact distance has a significant impact on the distribution of abrasive particles on the target surface, the coverage rate of the core area increases at first, and then decreases with the increase of the impact distance of the nozzle, which reach a maximum of 14.44% at 300 mm. It is recommended to set the impact distance around 300 mm, because at this time the core area coverage of the abrasive is the largest and the impact velocity is stable at the highest speed of 81.94 m/s. The impact of the nozzle inlet pressure on the decontamination effect mainly affects the impact kinetic energy of the abrasive and has little impact on the distribution. The greater the inlet pressure, the greater the impact kinetic energy, and the stronger the decontamination ability of the abrasive. But in return, the energy consumption is higher, too. For the decontamination of radioactively contaminated metals, it is recommended to set the inlet pressure of the nozzle at around 0.6 MPa. Because most of the Co elements can be removed under this pressure. Increasing the mass and flow of abrasives appropriately can enhance the decontamination effectiveness. The total mass of abrasives per unit decontamination area is suggested to be 50 g because the core area coverage rate of the abrasive is relatively large under this condition; and the nozzle wear extent is acceptable.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.249-252
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• 2009

Nanocrystalline ceria particles were prepared by using the ultrasonic spray pyrolysis method. The prepared ceria particles were found to be spherical and non-agglomerated by the SEM and TEM analyses. It was found that carrier gas influences the size and morphology. It was found that the air stream of carrier gas results in porous agglomerated structure of ceria abrasives, whereas solid nano-sphere can be obtained in a more oxidizing atmosphere.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.48-48
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• 2005

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.161-161
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• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.