• 한국정밀공학회지
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• 제19권12호
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• pp.134-141
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• 2002

The ER fluid can be one of efficient materials in ultraprecision polishing for optics, ceramics and semiconductors because of electrically controllable apparent viscosity. To finish small 3 dimensional structures such as the aspherical surface in optical elements, the possible arrangement of a tool, workpiece and auxiliary electrode is described. We examined the influence of the addition of a few abrasive particles on the performance of the ER fluid by measuring yield stress, and observed the behavior of abrasive particles in the ER fluid by a CCD camera, which is also theoretically predicted from the electromechanical principles of particles. On the basis of the above results, the steady flow analysis around the rotating micro tool is worked out considering the non-uniform electric field. Finally, Pyrex glass is polished using the mixture of the ER fluid and abrasive particles, and the effect of the electric field strength is evaluated.

• 한국생산제조학회지
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• 제20권3호
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• pp.274-279
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• 2011

In this study, new abrasives that were composed of iron powder and carbon nanotube (CNT) particle were attempted to be abrasives for magnetic abrasive polishing. Because the CNT particles itself are very small ones with high hardness and magnetic strength, these properties are effective for magnetic abrasive polishing of nonmagnetic materials. As an experimental result for evaluating the machining characteristics in magnetic abrasive polishing, the CNT particles showed better performance than the conventional abrasives such as Fe and CBN powder.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• 한국정밀공학회지
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• 제21권8호
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• 대한소아치과학회지
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• 제24권4호
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• pp.763-770
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• 1997

The air abrasive technique is a non-mechanical method by which teeth are treated before restoration and stains and calculi are removed from tooth surfaces using the kinetic energy of small particles. The air abrasive technique in dentistry was first introduced in the 1950's with as instrument called 'Airdent'. But, as the main restorative materials of the period were amalgam and gold, and the instrument's inability to control the flow of particles caused the particles to be spread throughout the clinics, widespread use was not possible. In the 1990's, as these techincal problems were solved and more interest in new restorative materials rose in an effort to preserve sound tooth structure, new developements took place in instruments related to the air abrasive technique. The air abrasive technique produces less pressure, vibration and heat that might cause patient discomfort and facilitates the preservation of sound tooth structure. It also reduces the need for anesthesia and is less harmful to the pulp. Other advantages include increase in dentin bonding strength of composite resin, lower possibility of saliva contamination and maintenance of a dry field. But there is not direct contact between the nozzle and the tooth, the operator cannot use his or her tactile sense and must rely solely upon visual input. Other disadvantages are: the tooth preparation depends on the operator's ability; alpha-alumina particles, after bouncing off the tooth surface, cause damage to dental mirrors; the equipment is expensive and takes up a certain amount of space in the clinic. The author conducted case report using the air abrasive technique on patient visiting the Department of Pediatric Dentistry at Seoul National University Dental Hospital and arrived at the following conclusions. 1. The tooth preparation capability of different air abrasive devices varied widely among manufacturers. 2. It was more effective in treating early caries lesions and stains compared to lesions where caries had already progressed to produce soft dentin. 3. The cold stream and noise caused by the evacuation system was a major cause of discomfort to pediatric patients. 4. As there is no direct contact with tooth surface when using the air abrasive technique for tooth preparation, considerable experience and skill is required for proper tooth preparation.

• Tribology and Lubricants
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• 제33권5호
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• pp.214-219
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• 2017

Abrasive fluidized bed machining (AFBM) is similar to general abrasive fluidized machining (AFM) in that it can perform polishing of the outer and inner surfaces of a 3-dimensional shape by the flow of particles. However, in the case of AFM, the shear force generated by the flow of the particles causes material removal, while in AFBM, the abrasive particles are suspended in the chamber to form a bed. AFBM can be used for deburring, polishing, edge contouring, shot peening, and cleaning of mechanical parts. Most studies on AFBM are limited to metals, and research on application of AFBM to plastic materials has not been performed yet. Therefore, in this study, we investigate the effect of rotating speed of the specimen and the air flow rate on the material removal characteristics during AFBM of polyacetal with a horizontal AFBM machine. The material removal rate (MRR) increases linearly with increase of the rotating speed of the main shaft because of the shear force between the particles of the fluidized bed and the rotation of the workpiece. The reduction in surface roughness tends to increase as the rotating speed of the main shaft increases. As the air flow rate increases, the MRR tends to decrease. At a flow rate of 70 L/min or more, the MRR remains almost constant. The reduction of the surface roughness of the specimen is found to decrease with increasing air flow rate.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.803-809
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• 2005

Cerium ammonium nitrate (CAN) and nitric acid was used an etchant and an additive for Ru etching and polishing. pH and Eh values of the CAN and nitric acid added chemical solution satisfied the Ru etching condition. The etch rate increased linearly as the concentration of CAN increased. Nitric acid added solution had the high etch rate. But micro roughness of etched surfaces was not changed before and after etching, The removal rate of Ru film was the highest in $1wt\%$ abrasive added slurry, and not increased despite the concentration of alumina abrasive increased to $5wt\%$. Even Ru film was polished by only CAN solution due to the friction. The highest removal rate of 120nm/min was obtained in 1 M nitric acid and $1wt\%$ alumina abrasive particles added slurry. The lowest micro roughness value was observed in this slurry after polishing. From the XPS analysis of etched Ru surface, oxide layer was founded on the etched Ru surface. Therefore, Ru was polished by chemical etching of CAN solution and oxide layer abrasion by abrasive particles. From the result of removal rate without abrasive particle, the etching of CAN solution is more dominant to the Ru CMP.

• International Journal of Precision Engineering and Manufacturing
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• 제5권1호
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• pp.47-54
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• 2004

In this study, the electrorheological (ER) fluid was used as finishing agent. Since the apparent viscosity can be controlled by an electric field, the ER fluid can be one of efficient materials in finishing processes. To finish small 3-dimensional structures such as the aspherical surface in optical elements, the possible arrangement of a tool, part and auxiliary electrode was described. We examined the influence of the addition of a few abrasive particles on the performance of the ER fluid by measuring yield stress and observed the behavior of abrasive particles in the ER fluid by a CCD camera, which had been also theoretically predicted from the electromechanical principles of particles. On the basis of the above results, the steady flow analysis around the rotating micro tool was performed considering the non-uniform electric field. Finally, borosilicate glass was finished using the mixture of the ER fluid and abrasive particles and material removal with field strength and surface roughness were investigated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.