• Title/Summary/Keyword: Abrasive particles

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Ultra-Precise Polishing of Mica Glass Ceramics Using MR Fluids and Nano Abrasives (MR fluid를 이용한 Mica Glass Ceramics의 초정밀 연마)

  • Beak, Si-Young;Song, Ki-Hyeok;Kim, Ki-Beom;Kim, Byung-Chan;Kang, Dong-Sung;Hong, Kwang-Pyo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.85-90
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    • 2017
  • Mica-glass ceramics has features such as micro-sized crystals, high strength, chemical resistance, semitransparent optical properties, etc. Due to its superior material properties, mica glass ceramics have increasing applications in dental and medical components, insulation boards, chemical devices, etc. In many applications, especially for dental and medical components, ultra-precise polishing is required. However, it is known to be a very difficult-to-grind material because of its high hardness and brittle properties. Thus, in this study, a newly developed ultra-precise polishing method is applied to obtain nano-level surface roughness of the mica glass ceramics using magnetorheological (MR) fluids and nano abrasives. Nano-sized ceria particles were used for the polishing of the mica glass ceramics. A series of experiments were performed under various polishing conditions, and the results were analyzed. A very fine surface roughness of Ra=6.127 nm could be obtained.

Slurry Characteristics by Surfactant Condition at Copper CMP (구리 CMP 공정시 계면활성제 첨가 조건에 의한 슬러리 특성)

  • Kim, In-Pyo;Kim, Nam-Hoon;Lim, Jong-Heun;Kim, Sang-Yong;Kim, Tae-Hyoung;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.166-169
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    • 2003
  • In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

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Preparation of Cross-sectional Specimen for High Resolution Observation of Coating Structure and Visualization of Styrene/butadiene Latex Binder (고배율 도공층 구조 및 S/B latex 분포 분석을 위한 도공층 횡단면 제작)

  • Kim, Chae-Hoon;Youn, Hye-Jung;Lee, Hak-Lae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.4
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    • pp.16-24
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    • 2012
  • To characterize the coating structure, diverse methods such as mercury intrusion, nitrogen adsorption and oil absorption methods have been developed and widely employed. These indirect techniques, however, have some limitation to explain the actual coating structure. Recently microscopic observation methods have been tried for analyzing structural characteristics of coating layers. Preparation of the undamaged cross section of a coating layer is essential for obtaining high quality image for analysis. In this study, distortion-free cross-section of the coating layer was prepared using a grinding and polishing technique. The coated paper was embedded in epoxy resin and cured. After curing the resin block it was ground with abrasive papers and then polished with diamond particle suspension and nylon cloth. Polished coating layer was sufficient enough to obtain undamaged cross sectional images with scanning electron microscope under backscattered electron image mode. In addition, the SEM images allowed distinction of the coating layer components. Also S/B latex film formed between pigment particles was visualized by osmium tetroxide staining. Pore size distribution and pore orientation were evaluated by image analysis from SEM cross-sectional images.

Machining Characteristics of SiC reinforced Composite by multiple diamond-coated drills (다이아몬드 피복공구에 의한 SiC 강화 복합재료의 절삭특성)

  • M. Chen;Lee, Y. M.;S. H. Yang;S. I. Jang
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.533-537
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    • 2003
  • Compared to sintered polycrystalline diamond (PCD), the deposited thin film diamond has a great advantage on the fabrication of cutting tools with complex geometries such as drills. Because of high performance in high speed machining non-ferrous difficult-to-cut materials in the field of automobiles industry, aeronautics and astronautics industry, diamond-coated drills find large potentialities in commercial applications. However, the poor adhesion of the diamond film on the substrate and high surface roughness of the drill flute adversely affect the tool lift and machining quality and they become the main technical barriers for the successful development and commercialization of diamond-coated drills. In this paper, diamond thin films were deposited on the commercial WC-Co based drills by the electron aided hot filament chemical vapor deposition (EACVD). A new multiple coating technology based on changing gas pressure in different process stages was developed. The large triangular faceted diamond grains may have great contribution to the adhesive strength between the film and the substrate, and the overlapping ball like blocks consisted of nanometer sized diamond crystals may contribute much to the very low roughness of diamond film. Adhesive strength and quality of diamond film were evaluated by scanning electron microscope (SEM), atomic force microscope (AFM), Raman spectrum and drilling experiments. The ring-block tribological experiments were also conducted and the results revealed that the friction coefficient increased with the surface roughness of the diamond film. From a practical viewpoint, the cutting performances of diamond-coated drills were studied by drilling the SiC particles reinforced aluminum-matrix composite. The good adhesive strength and low surface roughness of flute were proved to be beneficial to the good chip evacuation and the decrease of thrust and consequently led to a prolonged tool lift and an improved machining quality. The wear mechanism of diamond-coated drills is the abrasive mechanical attrition.

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Particle Removal on Buffing Process After Copper CMP (구리 CMP 후 버핑 공정을 이용한 연마 입자 제거)

  • Shin, Woon-Ki;Park, Sun-Joon;Lee, Hyun-Seop;Jeong, Moon-Ki;Lee, Young-Kyun;Lee, Ho-Jun;Kim, Young-Min;Cho, Han-Chul;Joo, Suk-Bae;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.1
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    • pp.17-21
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    • 2011
  • Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

Wear Properties of Hybrid Metal Matrix Composites (하이브리드 금속복합재료의 마모특성)

  • 부후이후이;송정일
    • Composites Research
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    • v.16 no.3
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    • pp.75-84
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    • 2003
  • The purpose of this study is to investigate the wear properties of Saffil/Al, Saffil/A12O3/Al and Saffil/SiC/Al hybrid metal matrix composites fabricated by squeeze casting method. Wear tests were done on a pin-on-disk friction and wear tester under both dry and lubricated conditions. The wear properties of the three composites were evaluated in many respects. The effects of Saffil fibers, $\textrm{Al}_2\textrm{O}_3$ particles and SiC particles on the wear behavior of the composites were investigated. Wear mechanisms were analyzed by observing the worn surfaces of the composites. The variation of coefficient of friction(COF) during the wear process was recorded by using a computer. Under dry sliding condition, Saffil/SiC/Al showed the best wear resistance under high temperature and high load, while the wear resistances of Saffil/Al and Saffi1/$\textrm{Al}_2\textrm{O}_3$/Al were very similar. Under dry sliding condition, the dominant wear mechanism was abrasive wear under mild load and room temperature, and the dominant wear mechanism changed to adhesive wear as load or temperature increased. Molten wear occurred at high temperature. Compared with the dry sliding condition, all three composites showed excellent wear resistance when lubricated by liquid paraffin. Under lubricated condition, Saffil/Al showed the best wear resistance among them, and its COF value was the smallest. The dominant wear mechanism of the composites under lubricated condition was microploughing, but microcracking also occurred to them to different extents.