• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.199-200
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• 2002

Three-body abrasive wear resistance of mild steel, low alloy steel (Bisalloy) and 27%Cr white cast iron was investigated using a ball-cratering test. Glass beads, silica sand, quartz and alumina abrasive particles with sizes larger than $100{\mu}m$ were used to make slurries. It was found that the wear rates of all three materials tested increased with time when angular abrasive particles were used and were rather constant when round particles were used. This increase in wear rates was mainly due to the gradual increase in ball surface roughness with testing time. Abrasive particles with higher angularity caused higher ball surface roughness. Mild steel and Bisalloy were more affected by this ball surface roughness changes than the hard white cast iron. Generally, three-body rolling wear dominated. The contribution of two-body grooving wear increased when the ball roughness was significant. More grooves were found when round particles were used or the size of the particles was decreased.

• Transactions on Electrical and Electronic Materials
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• 제7권3호
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• pp.112-117
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• 2006

In this paper we present that the effects of polymer adsorption on stabilities and CMP performance of ceria abrasive particles. Characterization of ceria abrasive particles in the presence of poly(vinyl pyrrolidone) (PVP) was performed by the measurements of adsorbed amounts of PVP, average sizes, and the back scattering intensities of the ceria abrasive particles as functions of PVP molecular weight and PVP concentration. The ceria abrasive particles in the presence of PVP were used to polish $SiO_2\;and\;Si_3N_4$ films deposited on Si wafers in order to understand the effect of PVP adsorption on chemical mechanical polishing (CMP) performance, together with ceria abrasive particles without PVP. Adsorption of PVP on the ceria abrasive particles enhanced the stability of ceria abrasive particles due to steric stabilization of the thick adsorbed layer of PVP. Removal rates of the deposited $SiO_2\;and\;Si_3N_4$ films by the ceria abrasive particles in the presence of PVP were much lower than those in the absence of PVP and their magnitudes were decreased with an increase in the concentration of free PVP chains in the dispersion media. This suggests that the CMP performance in the presence of PVP could be mainly controlled by the hydrodynamic interactions between the adsorbed PVP chains and the free ones. Moreover, the molecular weight dependence of PVP on the removal rates of the deposited films was hardly observed. On the other hand, high removal rate selectivity between the deposited films in the presence of PVP was not observed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1832-1835
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• 2003

This paper suggests the selective ultra precision polishing techniques for micro die and mold parts using magnetic-assisted machining. Fabrication of magnetic abrasive particle and their polishing performance are key technology at ultra precision polishing process of micro parts. Conventional magnetic abrasives have disadvantages. which are missing of abrasive particle and inequality between magnetic particle and abrasive particle. So, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Ferrite and carbonyl iron powder are used as magnetic particle where silicon carbide and Al$_2$O$_3$ are abrasive particle. Developed particles are analyzed using measurement device such as SEM. Possibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 2.927 $\mu\textrm{m}$ Rmax to 0.453 $\mu\textrm{m}$ Rmax.

• 한국공작기계학회논문집
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• 제12권5호
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• pp.59-66
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• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.

• 한국정밀공학회지
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• 제30권12호
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• Tribology and Lubricants
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• 제34권6호
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• pp.279-283
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• 2018

In this study, we investigate the behavior of abrasive particles and change of the stick-slip pattern according to chemical mechanical polishing (CMP) process parameters when a large number of abrasive particles are fixed on a pad. The CMP process is simulated using the finite element method. In the simulation, the abrasive grains are composed of those used in the actual CMP process. Considering the cohesion of the abrasive grains with the start of the CMP process, abrasive particles with various sizes are fixed onto the pad at different intervals so that stick-slip could occur. In this analysis, we determine that when the abrasive particle size is relatively large, the stick-slip period does not change as the pressure increases while the moving speed is constant. However, if the size of the abrasive grains is relatively small, the amount of deformation of the grains increases due to the elasticity of the pad. Therefore, the stick-slip pattern may not be observed. As the number of abrasive particles increases, the stick-slip period and displacement decrease. This is consistent with the decrease in the von Mises yield stress value on the surface of the wafer as the number of abrasive grains increases. We determine that when the number of the abrasive grains increases, the polishing rate, and characteristics are improved, and scratches are reduced. Moreover, we establish that the period of stick-slip increases and the change of the stick-slip size was not large when the abrasive particle size was relatively small.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.227-230
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• 2002

New polishing technique for small parts has been tried out using the principle of particle electromechanics. Common fine abrasives such as alumina, diamond, silicon carbide are dielectric materials which are polarized under an electric field, and a non-uniform electric field makes abrasive particles translate along the field line. Using this principle, We make abrasive particles aggregate in the vicinity of the micro tool which is fir the surface finishing of a small part without contact with it. The behavior of particles is optically measured, and the machined depth of glass is examined.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.332-340
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• 2000

Friction properties of automotive brake pads containing different types of abrasivess were investigated. Five different abrasives, including o-quartz, magnesia, magnetite, alumina, zircon, were employed in this investigation and size effects of the abrasives on friction characteristics were also studied using 1, 50, 140$\mu\textrm{m}$ size zircon. Experimental results showed that the hardness and size of these abrasive particles were strongly related to friction behaviors and wear mechanisms. Harder and smaller abrasives showed higher friction coefficient and more wear. The surfaces of friction materials with different sizes of abrasives showed that two different modes of abrasion (two-body and three-body abrasion) appeared during sliding. Considering the above results, abrasive materials were thought to destroy transfer film and the extent of the destruction depends on the types and sizes of abrasive particles. A mechanism of the wear mode transition (two-body to three body abrasive motion) was suggested considering the binding energy and friction energy in terms of abrasive particle size.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.