• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1157-1164
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• 2003

This paper shows the results of atomistic modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 2-dimensional molecular dynamics simulations using the Lennard-Jones 12-6 potentials. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. This model can be extended to investigate the 3-dimensional chemical mechanical polishing processes.

• Journal of Powder Materials
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• v.15 no.6
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• pp.509-513
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• 2008

High-pressure abrasive entrained jet have rapidly become important machining technology over the last two decades. However, suspension jet by high-pressure has been recently developed for packaging sawing. Ideally, diamond materials should be used for components in abrasive water-jet systems that are subject to high erosive conditions. Using the diamond orifices improve maintenance and extend wear part life. This paper gives insights to using an abrasive suspension jet with diamond orifice. The influences of orifice material and orifice design are evaluated.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.87-88
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• 2006

To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using $CeO_2$ powder as an abrasive added within diluted silica slurry (DSS) were evaluated to achieve the improvement of removal rates and non-uniformity. Second, the control of pH level due to the dilution of slurry was examined. And then, we have discussed the CMP characteristics as a function of abrasive dispersion time.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.304-309
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• 2011

A monitoring system for magnetic abrasive polishing process is necessary to ensure the polishing products the high quality and integrity. Acoustic emission (AE) signal is known to reflect the material removal phenomena in other machining processes. In a case of the magnetic abrasive polishing of non-magnetic materials, application of AE method is very difficult because of lower machining force on the surface of workpiece and the level of AE signal is extremely lower. In this study, AE sensor-based monitoring system is applied to the magnetic abrasive polishing. The relation between the level of the AE RMS and the surface roughness during the magnetic abrasive polishing of magnesium alloy steel is investigated.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.274-279
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• 2011

In this study, new abrasives that were composed of iron powder and carbon nanotube (CNT) particle were attempted to be abrasives for magnetic abrasive polishing. Because the CNT particles itself are very small ones with high hardness and magnetic strength, these properties are effective for magnetic abrasive polishing of nonmagnetic materials. As an experimental result for evaluating the machining characteristics in magnetic abrasive polishing, the CNT particles showed better performance than the conventional abrasives such as Fe and CBN powder.

• Asian-Australasian Journal of Animal Sciences
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• v.17 no.10
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• pp.1465-1471
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• 2004

A trial was conducted to determine the effect of abrasive strips and abrasive paint in layer cages on claw length and claw sharpness, foot condition, feather cover and mortality of hens. During the preparation of the cages for the experiment it was simpler and took less time to apply the pre-prepared paint with a spatula to the egg guard compared to sticking the abrasive strips onto the egg guard. Fitting the strips took longer because it had to be cut from a 25 mm roll, cut into the appropriate lengths, the tape backing removed and then stuck onto the egg guard section. Abrasive paint was more effective as a claw shortener than abrasive strips. The birds using the abrasive paint had the shortest (p<0.05) claw length and lowest (p<0.05) claw sharpness. One of the original reasons for reducing claw length with claw shorteners was to reduce mortality by minimising skin skin abrasions caused by the claws. Surprisingly hen mortality from prolapse and cannibalism was higher (p<0.05) in cages fitted with abrasives. There are no other reports in the literature showing an increase in prolapse and cannibalism from hens using abrasives.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.5
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• pp.817-823
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• 2020

In recent, the machining of difficult-to-cut materials such as titanium alloys, stainless steel, Inconel, ceramic, glass, and carbon fiber reinforced plastics (CFRP) used in aerospace, automobile, medical industry is actively researched. Abrasive waterjet is a non-traditional processing method in which ultra-high pressure water and abrasive particles are mixed in a mixing chamber and shoot out jet through a nozzle, and removed by erosion due to collision with a material. In particular, the nozzle of the abrasive waterjet is one of the most important parts that affect the machining quality as with a cutting tool in general machining. It is very important to monitor the condition of the nozzle because the workpiece is uncut or the surface quality deteriorates due to wear, expanding of the bore, damage of the nozzle and clogging of the abrasive, etc. Therefore, in this paper, we propose a monitoring system based on Acoustic Emission(AE) sensor that can detect nozzle condition in real time during AWJ processing.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.6
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• pp.1533-1541
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• 1990

Cubic boron nitride (CBN) is known the second hardest material followed diamond and was provided industry as an abrasive grain in the late 1960's. Since the introduction of CBN, a large amount of research has been carried out to determine the best application condition for grinding operation. Despite the advantages in its characteristics, CBN has not yet gained full acceptance as more excellent abrasive grain than traditional one. The reason for this state is that the surface roughness ground by CBN is worse than by traditional one and dressing and truing is very difficult. This led user's resistance to the use of CBN as an abrasive grain. Present study is to investigate the cause of lower surface roughness ground by CBN single crystal abrasive grain comparing with traditional one.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.947-952
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• 1997

The magnetic polishing is the useful method to finish using magnetic power of a magnet. The time hasn't been that long since the magnetic polishing method was introduced to korea as one of precision polishing techniques. However, the reasons for not being spreaded widely are the magnetic polishing method don't have mediocrity for machine, the efficiency of magnet-abrasive is confined as a bad polishing, and there are not many researchers in this field. The mechanism of this R&D is dealing with the dynamic state of magnet-abrasive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get a best surface roughness with low cost. Beside the subsidiary experiment was performed using the mixed magnet-abrasive with general alumina, barium. This paper introduced the main reason for difficulty using this method in industrial field. It needs more continues research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnet-abrasive are the particles of 150 $\mu\textrm{m}$, 250 $\mu\textrm{m}$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.4
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• pp.17-24
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• 2003

Chemical mechanical polishing(CMP) has been applied for planarization of topography after patterning process in semiconductor fabrication process. Tungsten CMP is necessary to build up interconnects of semiconductor device. But the tungsten dishing and the oxide erosion defects appear at end-point during tungsten CMP. It has been known that the generation of dishing and erosion is based on the over-polishing time, which is determined by pattern selectivity. Fixed abrasive pad takes advantage of decreasing the defects resulting flam reducing pattern selectivity because of the lower abrasive concentration. The manufacturing technique of fixed abrasive pad using hydrophilic polymers is introduced in this paper. For application to tungsten CMP, chemicals composed of oxidizer, catalyst, and acid were developed. In comparison of the general pad and slurry for tungsten CMP, the fixed abrasive pad and the chemicals resulted in appropriate performance in point of removal rate, uniformity, material selectivity and roughness.