• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.540-547
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• 2001

This study has evaluated the wear behavior of PTA (Plasma Transferred Arc) Inconel 625 and Stellite 6 overlays on Nimonic 80A substrate. Nimonic 80A alloy was also included for comparison. In order to evaluate the wear performance, three-body abrasive wear test and pin-on-disk dry sliding wear test were performed. Microstructural development during the solidification of deposits is also discussed. Wear test results show that the wear rate of Stellite 6 deposit is lower than that of Inconel 625 deposit and Nimonic 80A. The sliding wear resistance of overlay deposits follows a similar trend to the abrasive wear resistance, but for Nimonic 80A. The main wear mechanisms were abrasive wear for Inconel 625 deposit, adhesive wear and delamination for Stellite 6 deposit in pin-on-disk dry sliding wear test and ploughing in three-body abrasive wear test. Cross sectional examinations of the worn surface of pin specimens after pin-on-disk dry sliding wear test implies that the plastic deformation near worn surface has occurred during the wear testing.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1296-1301
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• 2003

The chemical mechanical polishing(CMP) is necessarily applied to manufacturing the dielectric layer and metal line in the semiconductor device. The conditioning of polishing pad in CMP process additionally operates for maintaining the removal rate, within wafer non-uniformity, and wafer to wafer non-uniformity. But the fixed abrasive pad(FAP) using the hydrophilic polymer with abrasive that has the swelling characteristic by water owns the self-conditioning advantage as compared with the general CMP. FAP also takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration. This paper introduces the manufacturing technique of FAP. And the tungsten CMP using FAP achieved the good conclusion in point of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.78-81
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• 2003

Polishing Processes are widely used in the glass, optical, die and semiconductor industry and are conventionally carried out using abrasive slurry and a polishing pad. But abrasive slurry process has a weak point that is high cost of handling of used slurry and hard controllability of slurry. Recently, some researches have attempted to solve these problems and one method is the development of a fixed abrasive pad. FAP has a couple of advantages including clean environment, lower CoC, easy controllability and higher form accuracy. But FAP also has a weak point that is need of dressing because of glazing and loading. The paper introduces the basic concept and fabrication technique of FAP using hydrophilic polymers with swelling characteristics in water and explains the self-conditioning phenomenon. Experimental results demonstrate to achieve nano surface roughness of soda lime glass for optical application

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.203-208
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• 1998

Materials of the Frame hole in fishing trackle reel is made up a number large and small holes. Thus, it is difficult to effective machining. Abrasive flow machining(AFM) is useful to polish a internal or external surface of the 3-dimensional shape parts, which are used in many fields such as aerospace, automative, semi-conductor, and medical component industries. The machining process is that two hydraulic cylinders, which are located face to face, enforce abrasive media to the passage between workpiece and tooling parts alternately, and then the abrasives include in the media pass the passage and polish the surface of workpiece. The media which is made of polymer and abrasives plays the role of the tool for deburring or polishing complex shap workpiece by its viscoelastic characteristics. In this study, the abrasive media for abrasive flow machining was made by mixing viscielastic polymer with alunina and silicon carbide abrasive. Also, we present AFM device design and preliminary results of an investigation in to some aspects of the AFM process performance in fishing trackle reel.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.59-64
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• 1998

We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.266-272
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• 2012

This paper has aims to share fundamental knowledge for magnetic abrasive polishing and to mainly introduce recent research results. In order to enhance a magnetic flux density for nonferrous materials, advanced magnetic abrasive polishing system which is called 2nd generation system was established by electro-magnet array table, and the effectiveness of the electromagnet array table was evaluated in real polishing experiments. To increase adhesiveness of the abrasives in high speed polishing, a silicone gel agent was proposed and carbon nanotube particles as new magnetic abrasives were applied in the magnetic abrasive polishing. In addition, a strategy for optimal step-over determination by heuristic algorithm was introduced for applying large size workpiece. Curved surfaces having a uniform radius were simulated and tested with installed electro-magnet array table.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.16-25
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• 1999

In recent years, grinding techniques for precision machining of brittle materials used in die, model and optical parts have been improved by using superfine abrasive wheel and precision grinding machine. The completion of optimum dressing of superfine abrasive wheel makes possible the effective precision grinding of die steel(STD-11). In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This method can carry out optimum in-process electrolytic dressing of superfine abrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of STD-11.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.10
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.