• Title/Summary/Keyword: ALD modeling$Al_2O_3-HfO_2$

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Tunneling Properties in High-k Insulators with Engineered Tunnel Barrier for Nonvolatile Memory (차세대 비휘발성 메모리에 사용되는 High-k 절연막의 터널링 특성)

  • Oh, Se-Man;Jung, Myung-Ho;Park, Gun-Ho;Kim, Kwan-Su;Chung, Hong-Bay;Lee, Young-Hie;Cho, Won-Ju
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.6
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    • pp.466-468
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    • 2009
  • The metal-insulator-silicon (MIS) capacitors with $SiO_2$ and high-k dielectrics ($HfO_2$, $Al_2O_3$) were fabricated, and the current-voltage characteristics were investigated. Especially, an effective barrier height between metal gate and dielectric was extracted by using Fowler-Nordheim (FN) plot and Direct Tunneling (DT) plot of quantum mechanical(QM) modeling. The calculated barrier heights of thermal $SiO_2$, ALD $SiO_2$, $HfO_2$ and $Al_2O_3$ are 3.35 eV, 0.6 eV, 1.75 eV, and 2.65 eV, respectively. Therefore, the performance of non-volatile memory devices can be improved by using engineered tunnel barrier which is considered effective barrier height of high-k materials.