• Title/Summary/Keyword: AIGaN/GaN

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Ultrafast Lasing Characteristics of the Gain Switched V-Groove Quantum Wire Laser (이득 스위칭 방법을 이용한 V-자형 양자선 레이저의 초고속 레이징 특성 연구)

  • Choi, Young-Chul;Kim, Tae-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.04a
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    • pp.185-188
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    • 2003
  • 본 논문에서는 공진기 길이 변화에 따른 V-자형 알루미늄갈륨비소-갈륨비소(AIGaAs-GaAs) 양자선 레이저의 서브밴드 에너지 천이에 대한 스펙트럼과 시간적 스위칭 특성을 조사하였다. $300{\mu}m$ 이하의 짧은 공진기 길이를 갖는 V-자형 양자선 레이저는 공진기 손실의 증가로 인하여 n=1에서 n=2 서브밴드(subband)로의 양자화 천이(불연속적인 파장 스위칭)가 발생하였고, 초단 광펄스를 생성하는 이득 스위칭방식을 이용하여 초고속 레이징 특성을 관찰하였다.

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A Study on the Ultrashort Optical Pulse Generation of the Gain Switched V-Groove Quantum Wire Laser (이득 스위칭 방법을 이용한 V-자형 양자선 레이저의 초단 광펄스 생성에 관한 연구)

  • 최영철;김주연;김태근
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.833-837
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    • 2003
  • The spectral and temporal characteristics of a V-groove AIGaAs-GaAs quantum wire (QWR) laser were investigated with varying the cavity length. At cavity lengths shorter than 300 ${\mu}{\textrm}{m}$, a discrete shift in tile wavelength occurred from the n=1 to the n=2 subband due to the increased cavity losses. Utilizing this characteristic, ultrafast lasing characteristics at each subband were investigated by tile gain switching method.

Improved Uniformity of GaAs/AlGaAs DBR Using the Digital Alloy AlGaAs Layer (디지털 합금 AlGaAs층을 이용하여 제작된 GaAs/AlGaAs DBR의 균일도 향상)

  • Cho, N.K.;Song, J.D.;Choi, W.J.;Lee, J.I.;Jeon, Heon-Su
    • Journal of the Korean Vacuum Society
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    • v.15 no.3
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    • pp.280-286
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    • 2006
  • A distributed Bragg reflector (DBR) for the application of $1.3{\mu}m$ vertical cavity surface emitting laser (VCSEL) has grown by digital-alloy AlGaAs layer using the molecular beam epitaxy (MBE) method. The measured reflection spectra of the digital-alloy AlGaAs/GaAs DBR have uniformity in 0.35% over the 1/4 of 3-inch wafer. Furthermore, the TEM image showed that the composition and the thickness of the digital-alloy AlGaAs layer in AlGaAs/GaAs DBR was not affected by the temperature distribution over the wafer whole surface. Therefore, the digital-alloy AlGaAs/GaAs DBR can be used to get higher yield of VCSEL with the active medium of InAs quantum dots whose gain is inhomogeneously broadened.

Pd/Si/Pd/Ti/Au Ohmic Contact for Application to AIGaAs/GaAs HBT (AlGaAs/GaAs HBT 응용을 위한 Pd/Si/Pd/Ti/Au 오믹 접촉)

  • 김일호;장경욱
    • Journal of the Korean Vacuum Society
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    • v.11 no.4
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    • pp.201-206
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    • 2002
  • Pd/Si/Pd/Ti/Au ohmic contact to n-type InGaAs was investigated with rapid thermal annealing conditions. Minimum specific contact resistivity of $3.9\times10^{-7}\Omega\textrm{cm}^2$ was achieved at $400^{\circ}C$/20sec. This was related to the formation of Pd-Si compounds by rapid thermal annealing and the in-diffusion of Si atoms to InGaAs surface. However, the specific contact resistivity increased slightly to low-$10^{-6}\Omega \textrm{cm}^2$ at $400^{\circ}C$ for longer than 30 seconds, and to high-$10^{-7}$ at 425~$450^{\circ}C$ for 10 seconds. This resulted from the formation of Pd-Ga compounds. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained after annealing at high temperature. Therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

Pd/Si/Ti/Pt Ohmic Contact for Application to AlGaAs/GaAs HBT (AIGaAs/GaAs HBT 응용을 위한 Pd/Si/Ti/Pt 오믹 접촉)

  • 김일호;박성호(주)가인테크
    • Journal of the Korean Vacuum Society
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    • v.10 no.3
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    • pp.368-373
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    • 2001
  • Pd/Si/Ti/Pt ohmic contact to n-type InGaAs was investigated. As-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$ for 10 seconds. However, the specific contact resistivity decreased remarkably to $1.7\times10^{-6}\Omega\textrm{cm}^2$ and $2\times10^{-6}\Omega\textrm{cm}^2$ at $375^{\circ}C$/60sec and $425^{\circ}C$/10sec, respectively. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained even at $450^{\circ}C$, therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

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