• Journal of the Korean Society for Heat Treatment
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• v.15 no.3
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• pp.118-126
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• 2002

TiCN thin films were deposited on tool steels at $510^{\circ}C$ by PECVD from a $TiCl_4+N_2+CH_4+H_2+Ar$ gaseous mixture. The microstructures and preferred orientation were investigated. The micro-scratch tests were performed using a system equipped with an acoustic emission sensor. Critical loads were determined to evaluate the adhesion of TiCN to substrate. The influences of the microstructures of substrates, double layered coatings, and coatings after nitriding(duplex coating) were investigated. The experimental results showed that the microstructures of substrates and double layered coating did not affect the critical loads considerably. By the duplex coating, critical loads were not always increased. In some cases, duplex coatings decreased critical loads significantly despite of absence of black layer. In this study, we tried to relate the results of scratch test to the residual stress analysis. Nitriding before the coating reduces the tensile residual stress in the film, which gives rise to low critical load in scratch test.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.523-527
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• 2013

Ti-based coatings following laser ablation were studied to compare degradation behaviors by thermomechanical stress. TiN, TiCN, and TiAlN coatings were degraded by a Nd:YAG pulsed laser with an increase in the laser pulses. A decrease in the hardness was identified as the pulses increased, and the hardness levels were in the order of TiAlN > TiCN > TiN. The TiN showed cracks on the surface, and cracks with pores formed along the cracks were observed in the TiCN. The dominant degradation behavior of the TiAlN was surface pore formation. EDS results revealed that diffusion of substrate atoms to the coating surface occurred in the TiN. Delamination occurred in the TiN and TiCN, while the TiAlN which has higher thermal stability than the TiN and TiCN maintained adhesion to the substrate. It was considered that the decrease in the hardness of the Ti-based hard coatings is attributed to surface cracking and the diffusion of substrate atoms.

• Journal of Sensor Science and Technology
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• v.13 no.4
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• pp.298-302
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• 2004

Thick films of $LaNiO_{3}$ having perovskite structure impregnated with indium and bismuth oxides have been used as sensing material for acetonitrile ($CH_{3}CN$) gas. The sensor response for $CH_{3}CN$ is quite good with an excellent recovery for partial pressure from 3 ppm to 20 ppm between 200 and $250^{\circ}C$. $LaNiO_{3}$ alone has exhibited low response, but after impregnation of $In_{2}O_{3}$ and $Bi_{2}O_{3}$ have given increased sensitivity even with 3 ppm partial pressure of $CH_{3}CN$ at $200^{\circ}C$. It is assumed that $CH_{3}CN$ is undergoing oxidation reaction on surface of the film.

• Journal of Periodontal and Implant Science
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• v.30 no.4
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• pp.885-894
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• 2000

Deer antler has been widely prescribed in Chinese and Korean pharmacology. Although there have been several reports concerning the effects of deer antler, such as anti-aging action, anti-inflammatory activity, antifungal action and regulatory activity of the level of glucose, the effect on bone has not determined yet. The purpose of this study was to examine the effect of deer antler on osteoblast differentiation. Hexane extract(CN-H) and chloroform extract(CN-C) were acquired from deer antler(Cervus nippon) and MC3T3-E1 pre-osteoblasts were cultured in the presence or absence of each extract. Osteoblast differentiation was estimated with the formation of mineralized nodules and the mRNA expression of alkaline phosphatase(ALP), osteocalcin(OC) and bone sialoprotein(BSP) which are markers of osteoblast differentiation. Non-treated group did not show mineralized nodule. CN-C or CN-H-treated group showed minerlaized nodules in 16 days. In northern blot analysis, CN-C or CN-H-treated group showed the elevated expression of ALP, BSP and OC in 16 days. These results suggest the possibility to develop deer antler as a bone regenerative agent in periodontal therapy by showing the stimulating activity of deer antler on differentiation of osteoblast.

• Journal of the Korean Chemical Society
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• v.35 no.4
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• pp.362-367
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• 1991

Rates of nucleophilic substitution reaction ([Pd (ONN) Cl] + Y$^-\;{\rightleftharpoons}$ [Pd (ONN)Y] + Cl$^-$ ; Y = SCN$^-$, CN$^-$, N$_3^-$, imidazole, pyridine) have been measured in methanol by spectrophotometric method at various temperatures. A set of nucleophilic reactivity constants, n$_{Pd}^{\circ}$ has been calculated. These values show an order of nucleophilicity CN$^-$ > SCN$^-$ > N$_3^-$ > Imidazole > Pyridine. The enthalpy of activation are small positive values and the entropy of activation are large negative values. From these results, it can be inferred that the nucleophilic substitution reaction proceeds through an associative (A) mechanism.

• Journal of the Korean Applied Science and Technology
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• v.24 no.1
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• pp.74-78
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• 2007

A new blue phosphorescent material for organic light emitting diodes (OLEDs), Iridium(III)bis[2-(4-fIuoro-3-benzonitrile)-pyridinato-N,C2'] picolinate (Firpic-CN), was synthesized and studied. We compared characteristics of Firpic-CN and Bis(3,5-Difluoro-2-(2-pyridyl)phenyl-(2-carboxypyridyl) iridium III (FIrpic) which has been used for blue dopant materials frequently. The devices structure were indium tin oxide (ITO) (1000 ${\AA}$)/N,N'-diphenyl-N,N'-(2-napthyl)-(1,1'-phenyl)-4,4'-diamine (NPB) (500 ${\AA}$)/4,4'-N,N'-dicarbazole-biphyenyl (CBP) : FIrpic and FIrpic-CN (X wt%)/4,7-diphenyl-1,10-phenanthroline (BPhen) (300 ${\AA}$)/lithum quinolate (Liq) (20 ${\AA}$)/Al (1000 ${\AA}$). 15 wt% FIrpic-CN doped device exhibits a luminance of $1450\;cd/m^2$ at 12.4 V, luminous efficiency of 1.31 cd/A at $3.58mA/cm^2$, and Commission Internationale d'Eclairage $(CIE_{x,y})$ coordinates of (0.15, 0.12) at 12 V which shows a very deep blue emission. We also measured lifetime of devices and was presented definite difference between devices of FIrpic and FIrpic-CN. Device with FIrpic-CN as a dopant presented lower longevity due to chemical effect of CN ligand.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.4
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• pp.72-77
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• 2011

This study is to investigate the effect of the distillation temperature in ultra low sulfur diesel fuel on exhaust emissions in the low-temperature diesel combustion with 1.9L common rail direct injection diesel engine. Low temperature diesel combustion was achieved by adopting an external high EGR rate with a strategic injection control. The engine was operated at 1500 rpm 2.6 bar BMEP. The 90% distillation recovery temperature (T90) was $270^{\circ}C$ and $340^{\circ}C$ for the respective cetane number (CN) 30 and 55. It was found that there exists no distinctive discrepancy on exhaust emissions with regards to the different T90s. The high CN (CN55) fuels follow the similar trend of exhaust emissions as observed in CN30 fuels' except that high T90 fuel (CN55-T340) produced higher PM compared to low T90 fuel (CN55-T270). This may come from that high T90 plays an active role in aggravating the degree of fuel-air mixture preparedness before ignition.

• Journal of The Korean Astronomical Society
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• v.33 no.3
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• pp.137-142
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• 2000

CN and CH band strengths for ten new bright giants in the globular cluster M15 have been measured from archival spectra obtained with the Multiple Mirror Telescope. Using published indices for other bright M15 giants, a CN-CH band strength anticorrelation is found for bright red giants. However, stars that do not follow the CN-CH anticorrelation are also found. They seem to show a positive correlation between the two indices. Among them, all the AGB and HB stars of the sample are included. Stars I-38 and X6, which are located near the RGB fiducial line in the CMD, have low measured CH(G) indices compared with other RGB stars. Stars IV-38, S4, and S1, which are all near the RGB tip, have strong measured CH(G) indices. Therefore, most of their evolutionary states are suspected to be different from those of a normal single RGB star.

• Korean Journal of Agricultural Science
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• v.38 no.3
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• pp.459-464
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• 2011

A simplified model for the colloidal calcium phosphate (CCP) nanocluster was developed from an active role of phosphate in the precipitation of casein (CN)/Ca mixtures and the composition of casein micelles (CM). The possible shape of the CCP nanocluster was selected as a tetrahedron, and we estimated that 4 CN molecules were involved in crosslinking a single CCP nanocluster. Similar values were obtained for the number of CN molecules involved in stabilizing the nanocluster when the number of CNs attached onto each nanocluster surface was deduced from the composition of CM. If one phosphoserine cluster consisted of 3 phosphoserine residues, the theoretical molecular weight and volume for the nanocluster were estimated to be 4,898 g/mol and 2.88 $nm^3$, respectively. It was also shown that the position of Ca present in our model were reasonably located to accommodate the serine phosphate in CN molecule.