• 제목/요약/키워드: A/D board

검색결과 790건 처리시간 0.03초

초소형 60 GHz LTCC 전력 증폭기 모듈 (A Very Compact 60 GHz LTCC Power Amplifier Module)

  • 이영철
    • 한국전자파학회논문지
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    • 제17권11호
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    • pp.1105-1111
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    • 2006
  • 본 논문에서는 저온 소성 세라믹(LTCC)에 기초한 SiP 기술을 이용하여 60 GHz 무선 통신을 위한 송신기용 초소형 전력 증폭기 LTCC모듈을 설계 및 제작하여 그 특성을 측정하였다. 60 GHz대역에서 LTCC 다층 기판과 전력 증폭기 MMIC의 상호 연결 손실을 줄이기 위해 와이어 본드와 기판 사이의 천이를 최적화하였고, MMIC 집적을 위한 고 격리 구조를 제안하였다. 와이어 본드 천이의 경우, 와이어의 인덕턴스를 감소시키기 위해 매칭 회로의 설계와 와이어 상호간의 간격을 최적화하였다. 또한 상호 연결 불연속 효과로 인한 전계의 방사를 억제하기 위해 코프라나 와이어 본드 구조를 이용하였다. 고 격리 모듈 구조를 위하여, LTCC 기판 내부에 DC 전원 배선을 내장시키고 비아로 그 주위를 차폐를 시켰다. 5층의 LTCC 기판을 사용하여 제작된 전력 증폭기 LTCC모듈의 크기는 $4.6{\times}4.9{\times}0.5mm^3$이고, $60{\sim}65GHz$ 대역에서 이득과 P1dB 출력 전력은 각각 10 dB와 11 dBm이다.

2.4GHz 무선 음성/영상 송신용 RF 모듈 구현 (Implementation of an RF Module for 2.4GHz Wireless Audio/Video Transmission)

  • 김거성;권덕기;박종태;유종근
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 하계종합학술대회 논문집(5)
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    • pp.55-58
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    • 2002
  • This paper describes an RF module for 2.4GHz wireless audio/video transmission. The pre-processed baseband input signals are FM-modulated using a VCO and then transmitted through an antenna after RF filtering. The designed circuits are implemented using a Teflon board of which the size is 52mm${\times}$62mm. The measured maximum output signal levels are around -3dBm and the harmonics are less than -450dBc. The manufactured module consumes 130mA from a 8V supply.

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Real-Time Power Electronics Remote Wiring and Measurement Laboratory (PermLAB) Using 3-D Matrix Switching Algorithms

  • Asumadu, Johnson A.;Tanner, Ralph;Ogunley, Hakeem
    • Journal of Power Electronics
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    • 제10권6호
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    • pp.611-620
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    • 2010
  • This paper presents a new architecture, called "Power Electronics Remote Wiring and Measurement Laboratory (PermLAB)", that translates a common gateway interface (CGI) string from a remote web user to a web server connected to a 3-dimension switching matrix board, can be used to switch on and off, and to control a cluster of instruments and components. PermLAB addresses real-time connection, switching, and data acquisition over the Internet instead of using simulated data. A software procedure uses a signature system to identify each instrument and component in a complex system. The Web-server application is developed in HTML, JavaScript and Java, and in C language for the CGI interface, which resides in a controller portion of LabVIEW. The LabVIEW software fully integrates the Web sever, LabVIEW data acquisition boards and controllers, and the 3-dimensional switching matrix board. The paper will analyze a half-wave rectifier (AC - DC converter) circuit connected over the Internet using the PermLAB. PermLAB allows students to obtain real data by real-time wiring of real circuits in the laboratory using a "virtual breadboard" on the Web. The software for the Web-based 3-dimensional system is flexible, portable, can be integrated into many laboratory applications or expanded, and easily accessible worldwide.

압접 커넥터 CAE 적용 휨 변형 원인 분석에 관한 연구 (A Study on the Bend Deformation Cause Analysis of CAE Applied Wire to Board Connectors)

  • 전용준;신광호;허영무
    • Design & Manufacturing
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    • 제10권1호
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    • pp.19-25
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    • 2016
  • Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

초소형 S-대역 PCM/FM 텔레메트리 송신기 설계 및 제작 (A Design of Ultra Compact S-Band PCM/FM Telemetry Transmitter)

  • 전지호;박주은;김성민;민세홍;이종혁;김복기
    • 한국항공우주학회지
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    • 제50권11호
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    • pp.801-807
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    • 2022
  • 본 논문에서는 초소형 S-대역 PCM/FM 텔레메트리 송신기를 제안한다. 크기의 소형화로 한정적인 공간에 적용이 가능하며 운용 환경 및 시스템마다 다르게 설정되는 규격에도 안정적인 데이터 송신이 가능한 장비를 설계 및 제작하였다. 장비의 소형화를 위하여 RF 직접변환 구조를 적용하였으며, 최소한의 소자로 송신기의 역할을 수행할 수 있도록 1장의 인쇄회로기판에 RF송신반, 전원분배반, 신호처리반을 구현하였다. 목표한 규격대로 성능의 저하 없이 S-대역(2,200~2,400MHz)에서 1~10W의 출력 가변이 가능하고 390kbps~12.5Mbps의 Data Rate 설정이 가능하도록 설계 및 제작을 진행하였다. 설계 검증을 위하여 장비를 제작한 후 RF 성능 시험 및 비트오류율 측정 시험을 진행하였다. 본 장비는 IRIG (Inter-Range Instrumentation Group) 표준이 제시하는 PCM/FM 변조 신호의 OBW(Occupied Bandwidth), null-to-null 대역폭, 1st IMD(Inter Modulation Distortion), Spurious Emission, Phase Noise 특성이 만족함을 확인하였으며, 송신기 점검 장비를 이용하여 본 장비가 전달받은 Data를 왜곡 없이 정상적으로 송신함을 확인하였다.

Develoment of high-sensitivity wireless strain sensor for structural health monitoring

  • Jo, Hongki;Park, Jong-Woong;Spencer, B.F. Jr.;Jung, Hyung-Jo
    • Smart Structures and Systems
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    • 제11권5호
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    • pp.477-496
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    • 2013
  • Due to their cost-effectiveness and ease of installation, wireless smart sensors (WSS) have received considerable recent attention for structural health monitoring of civil infrastructure. Though various wireless smart sensor networks (WSSN) have been successfully implemented for full-scale structural health monitoring (SHM) applications, monitoring of low-level ambient strain still remains a challenging problem for WSS due to A/D converter (ADC) resolution, inherent circuit noise, and the need for automatic operation. In this paper, the design and validation of high-precision strain sensor board for the Imote2 WSS platform and its application to SHM of a cable-stayed bridge are presented. By accurate and automated balancing of the Wheatstone bridge, signal amplification of up to 2507-times can be obtained, while keeping signal mean close to the center of the ADC span, which allows utilization of the full span of the ADC. For better applicability to SHM for real-world structures, temperature compensation and shunt calibration are also implemented. Moreover, the sensor board has been designed to accommodate a friction-type magnet strain sensor, in addition to traditional foil-type strain gages, facilitating fast and easy deployment. The wireless strain sensor board performance is verified through both laboratory-scale tests and deployment on a full-scale cable-stayed bridge.

PCB-BOARD의 방열기 발열특성 해석 (Heat Characteristics Analysis of Radiator for PCB-Board)

  • 장성철;권민수;한수민
    • 동력기계공학회지
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    • 제20권6호
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    • pp.20-26
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    • 2016
  • For power electronic devices, the thermal energy density per unit volume has seen a rapid increase in recent years, owing to the miniaturization and dense integration of electronic components, as well as the continuous development in performance and function. This research examined the validity and reliability of a thermal safety model for managing the heating conditions of TRIAC electronic components. Among the electronic components of a PCB, these can be considered as a heat source. Using the model, the heating conditions of TRIAC components were maintained at their design target levels in the process of developing an LMT motor drive board. In addition, the heating characteristics of the entire PCB were analyzed to verify its thermal safety. Finally, the reliability and validity of the thermal safety model for maintaining the heating conditions of the TRIAC electronic elements at adequate levels was verified using a numerical analysis method.

A Plastic BGA Singulation using High Thermal Energy of $2^{nd}$ Harmonic Nd:YAG Laser

  • Lee, Kyoung-Cheol;Baek, Kwang-Yeol;Lee, Cheon
    • KIEE International Transactions on Electrophysics and Applications
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    • 제2C권6호
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    • pp.309-313
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    • 2002
  • In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

JMF 기반의 실시간 원격 공정 감시 및 제어 시스템 설계 및 구현 (Design md Implementation for the Remote Real Time Process Monitoring and Control System based on the JMF)

  • 김삼룡;임인택;이정배
    • 정보처리학회논문지D
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    • 제11D권2호
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    • pp.453-460
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    • 2004
  • 본 논문에서는 I/O 인터페이스 제어 보드와 ISA 인터페이스 제어 보든 그리고 레고 기반의 프로토타이핑(Prototyping)을 통해 실시간 신발 공정 컨베이어 제어를 위한 원격 감시 및 제어 시스템을 구현하였다. 컨베이어 서버에서 실시간으로 공정을 제어하기 위하여 작업의 우선권을 사용자가 정할 수 있는 RTLinux(Real-Time Linux)를 사용하였으며, RTLinux 기반으로 디바이스 드라이버를 작성하였다. 이를 통해 Client/Server 분산 환경 시스템의 구현 및 테스트를 하며, JMF(Java Media Framework) 기반의 모니터링 시스템을 구현하여 전체 공정 상황을 확인하였다.

온-보드 영상장치를 이용한 총체적 셋업의 정확성 분석 (Analysis of Overall Setup Accuracy Using On-Board Imager��)

  • 마선영;임상욱;강수만;정태식
    • 한국의학물리학회지:의학물리
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    • 제22권2호
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    • pp.67-71
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    • 2011
  • 본 연구에서는 방사선사를 포함한 레이저, 갠트리 및 온-보드 영상장치의 총체적 셋업의 정확성을 평가하고자 하였다. 경험이 많은 방사선사에게 매일 아침 마커블록을 카우치의 Lock bar 시스템에 고정하고 마커블록을 레이저 중심에 맞추도록 하였다. 71일간 마커블록을 2D/2D 정합으로 위치를 보정하기 위하여 $0^{\circ}$ and $270^{\circ}$ 각도에서 한 쌍의 kV 영상을 획득하였다. 정합이 되었을 때 원격으로 카우치를 조정하여 셋업에러를 보정하고 보정 값은 저장하였다. 상하방향(vertical)과 앞뒤방향(longitudinal) 평균오차를 분석한 결과 상하방향은 0.65, 앞뒤방향은 0.66으로 나타났으며 반면에 좌우방향(lateral)은 0.01으로 나타났다. 상하방향과 앞뒤방향의 p 값은 모두 0.00으로 통계적으로 유의하게 나타났으며, 좌우방향에서는 p 값이 0.829로 나타나 계통오차를 발견하기 어려웠다. 총체적 셋업평가방법은 일간으로 시행하기에 유용하고 편리하였다. 그러나 계통오차를 줄이기 위해서 여전히 레이저와 OBI의 일간 점검은 필요하다.